CN102299232A - LED (light emitting diode) and light source module - Google Patents

Abstract

A light-emitting diode, which includes: a light-emitting diode chip; a first package, the first package is used to seal the light-emitting diode chip, the first package has a flat first surface; and a second package body, the second packaging body has a second surface opposite to the first surface, the second surface is provided with a plurality of microstructures protruding toward the first surface, between the first surface and the second surface There is a gap, the gap is vacuum or filled, and the refractive index of the filler is smaller than the refractive index of the first package body and the second package body. The invention also provides a light source module comprising a plurality of the light emitting diodes.

Description

Light-emitting diode and light source module

technical field

The invention relates to a light emitting diode and a light source module including the light emitting diode.

Background technique

The light source module usually uses light-emitting diodes as the backlight source, and uses the light guide plate to expand the point light source or line light source into a surface light source. However, because the light output angle of the light source is narrow, the radiation range is limited. The light-emitting surface is often unevenly bright and dark. Therefore, generally, a light-scattering structure is provided on the light-incident side of the light guide plate. However, as the thickness of the light guide plate becomes thinner, the scattering structure also needs to be thinner. However, when the thickness of the light guide plate is reduced to less than 1mm, the thin scattering structure is prone to burrs, thereby affecting its astigmatism effect.

Contents of the invention

In view of this, it is necessary to provide a light emitting diode with a large light emitting angle and a light source module including the light emitting diode.

A light emitting diode, which includes: a light emitting diode chip; a first package, the first package is used to seal the light emitting diode chip, the first package has a flat first surface; and a second package body, the second package has a second surface opposite to the first surface, the second surface is provided with a plurality of microstructures protruding toward the first surface, between the first surface and the second surface There is a gap, the gap is a vacuum or a filler is provided, and the refractive index of the filler is smaller than the refractive index of the first package body and the second package body

A light source module, which includes a light guide plate and a plurality of light-emitting diodes as a light source, the light guide plate has a flat light-incident surface, the plurality of light-emitting diodes are arranged on one side of the light-incidence surface, and the light-emitting diode includes a light-emitting Diode chip; a first package, the first package is used to seal the light emitting diode chip, the first package has a flat first surface as the light emitting surface of the light emitting diode chip; and a second package, The second package has a second surface opposite to the first surface, the second surface is provided with a plurality of microstructures protruding toward the first surface, and there is a gap between the first surface and the second surface , the gap is vacuum or filled, and the refractive index of the filled is smaller than the refractive index of the first package and the second package.

Compared with the prior art, the second package body of the light-emitting diode provided by the present invention is provided with a plurality of microstructures on the side facing the light-emitting surface of the light-emitting diode chip, and there is a gap between the second package body and the first package body, The light emitting angle of the light emitting diode can be enlarged. The light source module uses a plurality of the light emitting diodes as the light source, so that the light energy is distributed more uniformly, thereby effectively solving the problem of uneven brightness and darkness of the light output from the light guide plate.

Description of drawings

FIG. 1 is a schematic structural diagram of a light emitting diode provided by the first embodiment of the present invention.

FIG. 2 is a cross-sectional view along II-II direction of the light emitting diode shown in FIG. 1 .

FIG. 3 is a cross-sectional view along the II-II direction of another microstructure of the second surface of the second package body of the light emitting diode shown in FIG. 1 .

Fig. 4 is a schematic structural diagram of a light emitting diode provided by a second embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a light source module provided by a third embodiment of the present invention.

FIG. 6 is a schematic structural diagram of a light emitting diode provided by a fourth embodiment of the present invention.

Description of main component symbols

LED 10, 30, 60

Light-emitting diode chips 12, 61

Wire 120

Lead frame 121

The first package body 14, 62

First Surface 140, 34, 620

Bearing surface 160

Second package body 18, 63

Second Surface 180, 380, 630

Microstructure 20, 31, 631

Clearance 21, 33, 64

V-shaped convex bar 200

Tapered bump 202

Light source module 50

Light guide plate 52

Light incident side 520

External surface 600

Detailed ways

Referring to FIG. 1 , FIG. 2 and FIG. 3 , the light emitting diode 10 provided by the first embodiment of the present invention includes a light emitting diode chip 12 , a first package body 14 and a second package body 18 .

The first package body 14 is used to seal the LED chip 12 , and the first package body 14 has a flat first surface 140 . The light emitted by the LED chip 12 exits through the first packaging body 14 . The first surface 140 is also the light emitting surface of the LED chip 12 .

The second package body 18 is used to seal the first package body 14, the second package body 18 has a second surface 180 opposite to the first surface 140, the second surface 180 has a plurality of The microstructure 20 protruding from the surface 140 or the second package body 18 is provided with a plurality of microstructures 20 recessed from the first surface 140 to the second surface 180, the first surface 140 and the second surface 180 There is a gap 21 therebetween, and the refractive index of the filling in the gap 21 is smaller than that of the first package body 14 and the second package body 18 . The filler can be air, water, etc., and the gap 21 can also be a vacuum. In this embodiment, the gap 21 is filled with air.

The plurality of microstructures 20 are a plurality of V-shaped protrusions 200 or tapered bumps 202 arranged side by side. But it is not limited to this structure, and may also be microstructures of other shapes, such as protrusions with trapezoidal cross-sections.

The extension directions of the plurality of V-shaped convex strips 200 are the same, and the plurality of V-shaped convex strips 200 can be closely connected, or have gaps, and can be equidistantly distributed.

The tapered bumps 202 are evenly distributed on the second surface 180 , there may be gaps between the multiple tapered bumps 202 , preferably, the multiple tapered bumps 202 are closely connected.

The first packaging body 14 is any one of epoxy resin, silicone resin or glass, and the material of the second packaging body 18 is any one of epoxy resin, silicone resin or glass, but not limited to the listed s material. The first package body 14 includes a phosphor (not shown in the figure) to convert the wavelength of the light emitted by the LED chip 12 .

When the first surface 140 is not in contact with the second surface 180 , that is, the microstructure 20 does not touch the first surface 140 , the light emitted by the LED chip 12 enters the second package 18 after passing through the gap 21 . Since the light enters the optically thinner medium (the air in the gap 21) from the optically denser medium (the first encapsulation body 14), and then enters the optically denser medium (the second encapsulation body 18) from the optically thinner medium Compared with direct exit, the light divergence angle increases. Moreover, the microstructures 20 on the second surface 180 allow light to enter the second package 18 at a larger refraction angle.

The LED chip 12 is disposed on a carrying surface 160 , and the wire 120 of the LED chip 12 is connected to the lead frame 121 .

Please refer to FIG. 4 , the light emitting diode 30 provided by the second embodiment of the present invention is basically the same as the light emitting diode 10 provided by the first embodiment, the difference is that all the microstructures 31 of the light emitting diode 30 are in contact with the first surface 340, Since the microstructures 31 protrude from the second surface 380 , a gap 33 is formed between the second surface 380 and the first surface 340 .

Referring to FIG. 5 , the light source module 50 provided by the third embodiment of the present invention has a light guide plate 52 having a light incident surface 520 . One side of the light incident surface 520 is provided with a plurality of light emitting diodes 10 (30) as light sources. Since the light emitting diode 10 ( 30 ) has a large emission angle, the distribution of light energy is more uniform, thereby effectively solving the problem of uneven brightness and darkness of light emitted by the light guide plate. In this embodiment, the light incident surface 520 is flat, but a scattering structure may also be provided to further improve the uniformity of light output from the light guide plate 52 .

Referring to Fig. 6, the difference between the light emitting diode 60 provided by the fourth embodiment of the present invention and the light emitting diode 10 is that: the outer surface of the light emitting diode 10 is a curve, and the light energy radiation range is large; the outer surface 600 of the light emitting diode 60 is a plane, The overall structure is flat and the space volume is small.

The LED 60 includes an LED chip 61 , a first package 62 and a second package 63 . The first package body 62 is used to seal the LED chip 61 , and the first package body 62 has a flat first surface 620 . The second package body 63 has a second surface 630 opposite to the first surface 620 , and the second surface 630 has a plurality of microstructures 631 protruding toward the first surface 620 . A gap 64 exists between the first surface 620 and the second surface 630 . The refractive index of the filler in the gap 64 is smaller than the refractive index of the first package body 62 and the second package body 63 . The filler can be air, water, etc., and the gap 64 can also be a vacuum. In this embodiment, the gap 64 is filled with air.

The second package 63 can be located only above the first surface 620 as shown in FIG. 6 , and the second package 63 can be fixed by contacting the tip of the microstructure 631 with the first surface 620 . The second package 63 can also completely seal the first package 62 .

The second package body 63 is flat and made of epoxy resin, and the outer surface 600 is opposite to the second surface 630 .

Since the light enters the optically thinner medium (air in the gap 64) from the optically denser medium (the first encapsulation body 62), and then enters the optically denser medium (the second encapsulation body 63) by the optically thinner medium, the light does not pass through the optically thinner medium (the second encapsulation body 63). Compared with direct emission from the medium, the light divergence range is increased. Moreover, the microstructures 631 on the second surface 630 allow light to enter the second package body 63 at a larger refraction angle.

The light emitting diode provided by the embodiment of the present invention is only packaged for one light emitting diode chip. Of course, multiple light emitting diode chips can also be packaged.

It can be understood that those skilled in the art can also make other changes within the spirit of the present invention, which should be included within the scope of the present invention.

Claims (10)

1. light-emitting diode, it comprises:

A light-emitting diode chip for backlight unit;

One first packaging body, this first packaging body is used to seal this light-emitting diode chip for backlight unit, and this first packaging body has a smooth first surface; And

One second packaging body, this second packaging body has one and this first surface opposing second surface, this second surface is provided with a plurality of micro-structurals of protruding towards this first surface, there is the gap between this first surface and this second surface, be vacuum or be provided with filler in this gap, and the refractive index of this filler is less than the refractive index of this first packaging body and this second packaging body.

2. light-emitting diode as claimed in claim 1 is characterized in that, each micro-structural contacts with this first surface.

3. light-emitting diode as claimed in claim 1 is characterized in that, these a plurality of micro-structurals are the taper salient point.

4. light-emitting diode as claimed in claim 1 is characterized in that, these a plurality of micro-structurals are a plurality of V-arrangement raised lines side by side.

5. light-emitting diode as claimed in claim 1 is characterized in that, comprises in this first packaging body that fluorophor carries out wavelength Conversion with the light that this light-emitting diode chip for backlight unit is sent.

6. light-emitting diode as claimed in claim 1 is characterized in that, the material of this first packaging body be in epoxy resin, silicone resin or the glass any, the material of this second packaging body be in epoxy resin, silicone resin or the glass any.

7. light source module, it comprises a light guide plate and a plurality of light-emitting diode as light source, and this light guide plate has a smooth incidence surface, and these a plurality of light-emitting diodes are located at this incidence surface one side, and this light-emitting diode comprises a light-emitting diode chip for backlight unit; One first packaging body, this first packaging body is used to seal this light-emitting diode chip for backlight unit, and this first packaging body has the exiting surface of a smooth first surface as this light-emitting diode chip for backlight unit; And one second packaging body, this second packaging body has one and this first surface opposing second surface, this second surface is provided with a plurality of micro-structurals of protruding towards this first surface, there is the gap between this first surface and this second surface, be vacuum or be provided with filler in this gap, and the refractive index of this filler is less than the refractive index of this first packaging body and this second packaging body.

8. light source module as claimed in claim 7 is characterized in that, each micro-structural contacts with this first surface.

9. light source module as claimed in claim 7 is characterized in that, these a plurality of micro-structurals are the taper salient point.

10. light source module as claimed in claim 7 is characterized in that, these a plurality of micro-structurals are a plurality of V-arrangement raised lines side by side.

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