[go: up one dir, main page]

TW200736888A - Heat dissipating device and base thereof - Google Patents

Heat dissipating device and base thereof

Info

Publication number
TW200736888A
TW200736888A TW095109224A TW95109224A TW200736888A TW 200736888 A TW200736888 A TW 200736888A TW 095109224 A TW095109224 A TW 095109224A TW 95109224 A TW95109224 A TW 95109224A TW 200736888 A TW200736888 A TW 200736888A
Authority
TW
Taiwan
Prior art keywords
plate
base
heat pipe
heat
dissipation device
Prior art date
Application number
TW095109224A
Other languages
Chinese (zh)
Inventor
Ping-An Yang
Meng Fu
Shi-Wen Zhou
Chun-Chi Chen
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW095109224A priority Critical patent/TW200736888A/en
Publication of TW200736888A publication Critical patent/TW200736888A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention discloses a heat dissipation device and a base thereof. The heat dissipation device includes a first plate, a least one heat pipe mounted upon the first plate, a second plate disposed upon the heat pipe and a heat sink mounted upon the second plate. The heat pipe is securely sandwiched between the first and the second plate by soldering. The heat dissipation device applys two thin metallic plate instead of a solid base which needs to form grooves for accommodating the heat pipe, therefore the cost and time is induced in fabrication.
TW095109224A 2006-03-17 2006-03-17 Heat dissipating device and base thereof TW200736888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095109224A TW200736888A (en) 2006-03-17 2006-03-17 Heat dissipating device and base thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095109224A TW200736888A (en) 2006-03-17 2006-03-17 Heat dissipating device and base thereof

Publications (1)

Publication Number Publication Date
TW200736888A true TW200736888A (en) 2007-10-01

Family

ID=57913623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109224A TW200736888A (en) 2006-03-17 2006-03-17 Heat dissipating device and base thereof

Country Status (1)

Country Link
TW (1) TW200736888A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458927B (en) * 2010-02-26 2014-11-01 Furukawa Electric Co Ltd Heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458927B (en) * 2010-02-26 2014-11-01 Furukawa Electric Co Ltd Heat sink

Similar Documents

Publication Publication Date Title
TW200631491A (en) Sandwiched thermal solution
TWI265775B (en) Portable electronic device and heat dissipation method and cradle thereof
TW200728961A (en) Heat sink
TW200704356A (en) Thermal solution for portable electronic devices
SG142252A1 (en) Heat dissipation apparatus utilizing empty component slot
TW200723484A (en) Laser fuse with efficient heat dissipation
TW200739867A (en) Tape carrier package and display unit equipped with it
TW200725839A (en) Stacked wafer or die packaging with enhanced thermal and device performance
TW200746452A (en) Light emitting device
WO2003085500A3 (en) Heat dissipation in devices that have an internal energy supply
TW200730084A (en) Radiator plate and semiconductor device
TW200745286A (en) Film forming composition
ITMI20091294A1 (en) SEMICONDUCTOR MODULE AND A PROCEDURE FOR THE PRODUCTION OF AN ELECTRONIC CIRCUIT
EP1715732A3 (en) Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection
TW200736888A (en) Heat dissipating device and base thereof
WO2008040596A3 (en) Heat sink for cooling an electrical component
TW200732893A (en) Heat dissipation device
TW200702620A (en) Heat dissipation device with heat pipe
TW200719811A (en) Heat sink
TW200951688A (en) Heat dissipation device
TW200736887A (en) Heat dissipating device
TWI267345B (en) Heat dissipation device and method for making the same
TW200724013A (en) Heat dissipation device
TW200709767A (en) Heat dissipation device with heat pipes
TW200733860A (en) Heat dissipation device