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TW200732893A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200732893A
TW200732893A TW095105461A TW95105461A TW200732893A TW 200732893 A TW200732893 A TW 200732893A TW 095105461 A TW095105461 A TW 095105461A TW 95105461 A TW95105461 A TW 95105461A TW 200732893 A TW200732893 A TW 200732893A
Authority
TW
Taiwan
Prior art keywords
heat sink
plate
dissipation device
heat
heat dissipation
Prior art date
Application number
TW095105461A
Other languages
Chinese (zh)
Other versions
TWI292525B (en
Inventor
Xiao Xu
Yong-Dong Chen
Guang Yu
Shih-Hsun Wung
Chun-Chi Chen
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95105461A priority Critical patent/TWI292525B/en
Publication of TW200732893A publication Critical patent/TW200732893A/en
Application granted granted Critical
Publication of TWI292525B publication Critical patent/TWI292525B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat dissipation device. for cooling at least two electronic components with different height. In one embodiment, the heat dissipation device includes a first heat sink and a second heat sink. the first and second heat sinks each has a plate and a plurality of fins. The plate of the first heat sink defines a notch whose shape and dimension are coincidental with those of the plate of the second heat sink. Two elastic retainer that keep the second heat sink elastically engaging with the first heat sink, and movable relative to the first heat sink along a direction perpendicular to the plate of the first heat sink.
TW95105461A 2006-02-17 2006-02-17 Heat dissipation device TWI292525B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95105461A TWI292525B (en) 2006-02-17 2006-02-17 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95105461A TWI292525B (en) 2006-02-17 2006-02-17 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200732893A true TW200732893A (en) 2007-09-01
TWI292525B TWI292525B (en) 2008-01-11

Family

ID=45067553

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95105461A TWI292525B (en) 2006-02-17 2006-02-17 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI292525B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612271B (en) * 2015-09-21 2018-01-21 啟碁科技股份有限公司 Heat dissipating module capable of enhancing heat dissipating efficiency

Also Published As

Publication number Publication date
TWI292525B (en) 2008-01-11

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