1292525 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係指一種對一 件散熱之散«置。 上發熱電子兀 【先前技術】 =著電子«飛速發展，電子元件（如巾央處㈣ 之產量熱量，使其本身及系統溫度升高，繼而ί響 2 確巧子元件能正常運行，通常在其上安裝散熱 裝置’排出其所產生之熱量1292525 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device. Upper heating electrons [previous technology] = rapid development of electronic «electronic components (such as the central heat of the towel (4), so that the temperature of the system itself and the system rise, and then the sound of the device can operate normally, usually in Mounted on the heat sink to 'discharge the heat generated by it
，子树散關題之傳麟決方案财係在每崎熱電子 女裝-散熱器，該散熱器包括與電子元件緊密接觸之一 ϊί iii if 2 __度雜和多功能方向 當電子元件__小而且高度不等時，如果 it巧數巧，但隨著數碼資訊時代到來，輕薄短小成^ 因此在 分別採_立之散絲置對其散熱轉持祕正f運行，不僅 統之散熱結構分散複雜造成系統空間浪f，而 a ^ ;=恤獅撕w，從鄉統之=== 【發明内容】 散熱g於此’有必要提供-種可明時適配兩個❹個電子元件之 一-^散熱裝置，包括-第-散熱器及__第二散熱器，該第一及第 -散熱器都具有-絲及設於底板上之散熱則，另有二扣件彈性連 接上述二健||，躺使^散純可相娜—雜器沿垂直於 散熱器底板方向活動。 、 相較于現有技術，由於上述散熱裝置之第二散熱器可以相對第一 散熱器上下彈性鶴，故採壯述散熱裝置鮮谢目互間距很小且高 度不等之發熱電子元件進行散熱，不僅可以充分糊電子元件間之狹 小空間，使散熱裝置散熱面積最大化，同時使第一散熱器盥所有第二 散熱器都能固貼於各對應電子元件上。 ·、/、 一 6 1292525 【實施方式】 本發明散熱裝置係用來對多個晶片（圖未示）等電子元件進行散 熱。 請參閱第一圖至第三圖，本發明散熱裝置一實施例包括第一散熱 器10、第二散熱器2〇及將第二散熱器20固定到第一散熱器1〇上^ 扣件27。第一、二散熱器10、2〇都係採用導熱性能良好ϋ料如銅、 鋁等衝壓製成，其底面與電子元件（圖未示）接觸以吸收電子 生之熱量。 第一散熱器10包括一第一底板11及其上一體形成之複數相互 距平行之弟一散熱鰭片13。該第一底板π邊緣向内凹設有一矩形缺 口 17，在該缺口 17之相對兩邊之第一底板1;1上面各設置有一平^旦、 之矩形承接面15，於該承接面15之適位置上開設有一階梯孔152: 該階梯孔152靠向第一散熱鰭片13 一侧之孔徑小，另一侧孔俨大，’ 該階梯孔152具有一階梯台154。第一底板；^之四個對角之^位 置上分別從下向上開設有-盲孔112，該盲孔m内設螺紋，與田 件19相配合從而將第一散熱器1〇緊密固貼在第一晶片（圖未示 々第二散熱器2〇包括一形狀大小與第一底板U之缺口 17二致之 第二底板21及其上一體形成之複數相互等距平行之 鍵 23。該第二散熱底板21之兩側上端分別向外延伸出一與^、^曰 承接部15對應之矩形肩φ 25，該肩面25上適當之位置上開: 通孔252，該通孔252與穿孔152對應，用於穿設 散熱器20彈性固定於第一散熱器1〇之承接面15上。 將弟一 該扣件27具有-圓形頭部271，自該_頭 =7；物伽細271編275間之長 私/用時’第一散熱111G安餘頂面較高之電子树上，而第二 土、、、器2〇則置於頂面相對較低之電子元件上。利用扣 ^ 熱器20之肩部25彈性連接在第一|埶 千將弟一政 7之扣娜織物\:==7== 底= 頭？梯台154上，同時套設於長桿 弹！ 277 —端抵壓於頭部271，：¾ 一#掷认两立丨始 心 另端彈性壓制苐二散熱器20之肩 7 1292525 m ί ί? 271 ^25 ^ 離故此時彈百277處於壓縮狀態。另外，因扣件 ΐί 直徑’故第二散熱器2〇可在二^ 、干 已下/σ者長杯273垂直移動，但由於扣件27上之彈薯 277 -端壓制在第二散熱器2〇之肩部％上，另一端壓制在頭部饥 亡二而扣件！7之扣齡75卡掣第一底板11下面之梯形台154 ,故隨 者第一散熱H 20之械向上移轉簣在同—方向產生進 彈性形變，從而對第二散熱II 2〇施加向下之回復力，使第二散熱器 20向下抵壓電子元件，進而緊密固貼於其上。 實際應用時可根據情況，使用多個第二散熱器2〇，並在第一散 熱器10上開設與第二散熱器20數量相當之缺口 17。第二散熱器20 之形狀、大小亦可以根據需要做相應變化。 當多個發熱電子元件間距很小且高度不一致時，採用該散熱裝置 對它們進行散熱，不僅可以充分利用電子元件間之狹小空間，使散熱 裝置散熱面積最大化，同時由於上述散熱裝置之第二散熱器可以相對 第一散熱器上下彈性移動，從而使第一散熱器與所有第二散熱器都能 固貼於各對應電子元件上，進而保證了散熱裝置之散熱性能。 【圖式簡單說明】 第一圖係本發明散熱裝置一實施例之立體組合圖。 第二圖係第一圖另一視角上之部分組合圖。 第三圖係第一圖之立體分解圖。 【主要元件符號說明】 第一散熱器 10 第一底板 11 第一散熱鰭片13 承接面 15 階梯孔 152 缺口 17 固定件 19 第二散熱器 20 第二底板 21 第二散熱鰭片 23 肩面 25 通孔 252 扣件 27 圓形頭部 271 長桿 273 倒鉤 275 彈簧 277The sub-tree scatters the story of the tactics of the financial system in each of the hot electronic women's wear-heaters, the heat sink includes one of the close contact with the electronic components ϊί iii if 2 __ degree and multi-directional direction as electronic components __Small and high in height, if it is clever, but with the advent of the digital information era, it is light and short, so it’s in the same way. The heat dissipation structure is scattered and complicated, causing the system space wave f, and a ^ ;=shirt lion tearing w, from the township system === [invention content] heat dissipation g here is necessary to provide - can be adapted to match two One of the electronic components - the heat sink, including - the first heat sink and the second heat sink, the first and the first heat sink both have a wire and heat dissipation on the bottom plate, and two fasteners are elastic Connect the above two health||, and let the scatter be pure-phase--the mover moves along the direction perpendicular to the bottom plate of the radiator. Compared with the prior art, since the second heat sink of the heat dissipating device can be elastically mounted on the upper and lower sides of the first heat sink, the heat dissipating device is used to dissipate the heat-dissipating electronic components with small spacing and different heights. Not only can the narrow space between the electronic components be fully buried, the heat dissipation area of the heat sink can be maximized, and all the second heat sinks of the first heat sink can be fixed to the corresponding electronic components. -, /, a 6 1292525 [Embodiment] The heat sink of the present invention is used to dissipate heat from electronic components such as a plurality of wafers (not shown). Referring to FIG. 1 to FIG. 3 , an embodiment of the heat dissipation device of the present invention includes a first heat sink 10 , a second heat sink 2 , and a second heat sink 20 fixed to the first heat sink 1 . . The first and second heat sinks 10 and 2 are made of stamping materials such as copper or aluminum with good thermal conductivity, and the bottom surface is in contact with electronic components (not shown) to absorb heat generated by electrons. The first heat sink 10 includes a first bottom plate 11 and a plurality of heat sink fins 13 integrally formed thereon. The first bottom plate π edge is recessed inwardly with a rectangular notch 17 , and a plurality of rectangular receiving surfaces 15 are disposed on the first bottom plate 1 ; 1 on opposite sides of the notch 17 , and the receiving surface 15 is suitable for the receiving surface 15 A stepped hole 152 is defined in the position: the stepped hole 152 has a small aperture on one side of the first heat dissipation fin 13 and the other side has a large aperture, and the stepped hole 152 has a stepped stage 154. The four bottom corners of the first bottom plate are respectively provided with a blind hole 112 from the bottom to the top, and the blind hole m is internally provided with a thread to cooperate with the field member 19 to closely fix the first heat sink 1 The first wafer (not shown in the second heat sink 2A) includes a plurality of keys 23 of a shape parallel to the second bottom plate 21 of the first bottom plate U and the plurality of the bottom plates 21 and the plurality of the bottom plates 21 are formed integrally with each other. The upper ends of the second heat dissipating bottom plates 21 respectively extend outwardly from a rectangular shoulder φ 25 corresponding to the receiving portion 15 of the second heat dissipating bottom plate 21, and the shoulder surface 25 is opened at an appropriate position: a through hole 252, and the through hole 252 Corresponding to the through hole 152, the heat sink 20 is elastically fixed on the receiving surface 15 of the first heat sink 1 将. The fastener 27 has a round head 271, from the _ head = 7; 271 series 275 long private / use time 'the first heat dissipation 111G rest on the top of the electronic tree, while the second earth, 2, 2 is placed on the lower surface of the electronic components. The shoulder portion 25 of the buckle heat exchanger 20 is elastically connected to the first | 埶 thousand brothers, a politician, and the bottom of the lining fabric: \======================================================== 277 - The end is pressed against the head 271,: 3⁄4 A # 认 两 两 两 两 另 另 另 另 另 另 另 弹性 弹性 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 The 277 is in a compressed state. In addition, because of the fastener ΐί diameter, the second radiator 2 can be vertically moved in the second, dry, and σ long cups 273, but the spring 277-end of the fastener 27 is pressed. On the shoulder portion % of the second heat sink 2, the other end is pressed in the head and hungry and the fastener is fastened! 7 is 75-inch buckled at the trapezoidal table 154 below the first bottom plate 11, so the first heat dissipation H The mechanism of 20 moves up and transforms into an elastic deformation in the same direction, thereby applying a downward restoring force to the second heat sink II 2 , so that the second heat sink 20 presses down the electronic component and is closely attached thereto. In the actual application, a plurality of second heat sinks 2 使用 can be used according to the situation, and a notch 17 corresponding to the number of the second heat sinks 20 is opened on the first heat sink 10. The shape and size of the second heat sink 20 are also It can be changed as needed. When the distance between multiple heat-generating electronic components is small and the height is inconsistent, The heat device dissipates heat, not only can make full use of the narrow space between the electronic components, but also maximizes the heat dissipation area of the heat sink, and at the same time, the second heat sink of the heat sink can elastically move up and down with respect to the first heat sink, thereby making the first The heat sink and all the second heat sinks can be attached to the corresponding electronic components, thereby ensuring the heat dissipation performance of the heat sink. [Schematic Description] The first figure is a three-dimensional combination diagram of an embodiment of the heat sink of the present invention. The second figure is a partial combination view of the first view. The third figure is an exploded view of the first figure. [Main component symbol description] First heat sink 10 First bottom plate 11 First heat sink fin 13 Face 15 stepped hole 152 notch 17 fixing piece 19 second heat sink 20 second bottom plate 21 second heat sink fin 23 shoulder surface 25 through hole 252 fastener 27 round head 271 long rod 273 barb 275 spring 277