TW201926596A - Memory heat-dissipating device - Google Patents

Abstract

The invention discloses a memory heat-dissipating device which includes a first heat dissipating sheet, a second heat dissipating sheet, a plurality of fins, and a C-shaped clamping part. The C-shaped clamping part can clamp the first heat dissipating sheet and the second heat dissipating sheet on two opposite heating surfaces of a memory module for dissipating heat produced by the memory module. The plurality of fins extend outward from the first heat dissipating sheet relative to the second heat dissipating sheet. The plurality of fins form a clamp slot therebetween. When the C-shaped clamping part clamps the first heat dissipating sheet and the second heat dissipating sheet on the memory module, the C-shaped clamping part is located in the clamp slot.

Description

Memory heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of a memory.

Generally, the components that solve the overheating of the internal components of the computer are mostly attached or locked to the overheated components (such as the central processing unit, the south bridge, the north bridge, etc.), but not every overheated component can be sufficient. The space is provided with heat sink fins. At this time, such components can usually only rely on the heat dissipation airflow in the main body (usually generated by a heat dissipation fan) to dissipate heat. In the case of a memory module, the computer host usually has a plurality of memory modules arranged side by side on the motherboard, so that the heat generated by the memory module is not easy to dissipate. As the processing speed of the central processor is greatly increased, the frequency of accessing the memory is also greatly increased. Therefore, if the heat generated by the memory module is not effectively eliminated, the memory module cannot be operated normally or even stopped. There are currently heat sinks for memory modules. For example, a U-shaped fastener is disposed on one side of the memory module and combined with a heat sink disposed on the other side of the memory module to enable the heat sink to be in close contact with the memory module to achieve heat dissipation. Purpose, but only one side of the memory module to dissipate heat. For example, when the memory module is plugged into a circuit board in a flat manner, the heat sink is locked on the circuit board so that the heat sink can be pressed against the memory module to achieve heat dissipation. However, only one side of the memory module can be dissipated, and the assembly operation is cumbersome and time consuming. For example, the two heat sink plates are clamped on both sides of the memory module by the clips, and the heat dissipation plate is used to dissipate heat on both sides of the memory module. However, the heat dissipation surface of the simple heat sink plate is limited, so the heat dissipation efficiency is limited.

In view of the problems in the prior art, the present invention provides a memory heat sink that is simple to assemble, can dissipate heat from both sides of the memory module, and has heat dissipation fins to improve heat dissipation efficiency.

The memory heat sink according to the present invention comprises a first heat sink, a second heat sink, a plurality of heat sink fins and a C-shaped clip. The first heat sink has a first heat conducting surface and a first heat dissipating surface opposite to the first heat conducting surface, and the first heat sink has the first heat conducting surface and a first side heat generating surface of a memory module Thermally coupled. The second heat sink has a second heat conducting surface and a second heat dissipating surface opposite to the second heat conducting surface, and the second heat sink is heated by the second heat conducting surface and the memory module relative to the first side One of the faces of the second side of the heating surface is thermally coupled. The plurality of heat dissipation fins extend outward from the first heat dissipation surface to form a clamping groove between the plurality of heat dissipation fins. The C-shaped clip is configured to clamp the first heat sink and the second heat sink on the memory module and is located in the clamping slot. Therefore, the memory heat sink is convenient to use, the memory module can dissipate heat through the first heat sink and the second heat sink, and the first heat sink is provided with heat dissipation fins, which can further improve heat dissipation efficiency.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

Please refer to Figure 1 to Figure 3. A memory heat sink 1 includes a first heat sink 12, a second heat sink 14, a plurality of heat sink fins 16, and a C-shaped clip 18, in accordance with an embodiment of the present invention. The first heat sink 12 has a first heat conducting surface 122 and a first heat radiating surface 124 opposite to the first heat conducting surface 122. The second heat sink 14 has a second heat transfer surface 142 and a second heat dissipation surface 144 opposite to the second heat transfer surface 142 . The plurality of heat dissipation fins 16 extend outward from the first heat dissipation surface. A clamping groove 17 is formed between the plurality of heat dissipation fins 16 . When the memory heat sink 1 is assembled to a memory module 3 (in the embodiment, the overall structure is a plate shape), the first heat sink 12 has the first heat conducting surface 122 and the memory module 3 One side heat generating surface 32 is thermally coupled (so that heat can be transferred between the first heat conducting surface 122 and the first side heat generating surface 32), and the second heat sink 14 is opposite to the first side of the second heat conducting surface 142 and the memory module 3 One of the heat generating faces 32 is thermally coupled to the second side heat generating surface 34 (so that heat can be transferred between the second heat conducting surface 142 and the second side heat generating surface 34), and the C-shaped clip member 18 has the first heat sink 12 and the second heat sink 14 is clamped on the memory module 3, and the C-shaped clip 18 is located in the clamping slot 17, so that the heat generated by the memory module 3 passes through the first heat conduction surface 32 and the second side heat generating surface 34 respectively through the first heat conduction. The surface 122 and the second heat transfer surface 142 are transmitted to the first heat sink 12 and the second heat sink 14 . In addition to dissipating heat through the first heat dissipating surface 124 , the first heat sink 12 can also conduct heat to the plurality of heat dissipating fins 16 to dissipate heat through the plurality of heat dissipating fins 16 ; the second heat sink 14 dissipates heat through the second heat dissipating surface 144 . . In addition, the clamping groove 17 has a limiting effect on the C-shaped clip 18. In the present embodiment, the memory heat sink 1 uses three C-shaped clips 18 that are equidistantly disposed to clamp the first heat sink 12 and the second heat sink 14 to the memory module 3; Without being limited thereto, in principle, as long as the clamping force provided by the C-shaped clip 18 is sufficient, the memory heat sink 1 can use only one C-shaped clip 18 . In addition, in practice, the first heat sink 12 and the plurality of heat sink fins 16 may be integrally formed, for example, by an aluminum extrusion; however, the invention is not limited thereto, for example, in a plurality of combinations. The first heat sink 12 and the plurality of heat dissipation fins 16 extending therefrom are formed.

In addition, in the present embodiment, in order to increase the heat transfer efficiency between the first heat conducting surface 122 and the first side heat generating surface 32, the memory heat sink 1 further includes a heat conducting layer 20 that is in close contact with the first heat conducting surface 122. The first heat transfer surface 122 is attached to the first side heat generating surface 32 via the heat conductive layer 20 to be thermally coupled to the first side heat generating surface 32. Similarly, in order to increase the heat transfer efficiency between the second heat conducting surface 142 and the second heat generating surface 34, the memory heat sink 1 further includes another heat conducting layer 22, which is in close contact with the second heat conducting surface 142, and the second heat conducting surface 142 is attached to the second side heat generating surface 34 via the heat conductive layer 22 to be thermally coupled to the second side heat generating surface 34. In practice, the heat conducting layers 20, 22 can be made of a thermal pad, a thermal conductive adhesive or other material having a heat conducting effect and allowing deformation or filling of the voids, all of which can accommodate non-planar thermal coupling, thereby improving the thermal coupling effect.

In addition, in the embodiment, the C-clamp 18 includes a first clamping portion 182, a second clamping portion 184 opposite to the first clamping portion 182, and one of the first clamping portion 182 and the second clamping portion 184. Connection portion 186. When the C-clamp 18 clamps the first heat sink 12 and the second heat sink 14 to the memory module 3, the first clamping portion 182 abuts the clamping slot 17, and the second clamping portion 184 abuts the second clamping portion 184. The heat radiating surface 144 and the connecting portion 186 straddle the side edges of the first heat sink 12, the second heat sink 14, and the memory module 3.

In addition, in the embodiment, the first heat sink 12 has a substantially rectangular shape, and each of the heat dissipation fins 16 is along the longitudinal direction 12a of the first heat sink 12 (indicated by double arrows in the figure, that is, equivalent to the first heat sink The longitudinal direction of 12 extends, and the clip groove 17 extends along one lateral direction 12b of the first heat sink 12 (indicated by double arrows in the drawing, that is, in the short side direction of the first heat sink 12). Wherein, the plurality of heat dissipation fins 16 form a bottom portion 172 of the clamping groove 17 and two opposite side wall portions 174, 176 (in FIG. 1, the range is indicated by a broken line frame), so when the C-shaped clamping member 18 will be the first heat dissipation When the sheet 12 and the second heat sink 14 are clamped on the memory module 3, the first clip portion 182 abuts against the heat sink fin 16 (or the bottom portion 172 of the clamp groove 17). However, the present invention is not limited thereto. For example, the bottom 172 of a clip slot 17a is directly realized by the first heat dissipating surface 124 (as shown in FIG. 4; wherein the clip groove 17a is indicated by a broken line frame), so at this time, the C-shaped clip member When the first heat sink 12 and the second heat sink 14 are clamped to the memory module 3, the first clip portion 182 abuts against the first heat radiating surface 124 (or the bottom portion 172 of the clamping groove 17a). For another example, each of the heat dissipation fins 16 extends along the lateral direction 12b of the first heat dissipation fins 12, and a clamping groove 17b also extends along the lateral direction 12b. The two opposite side wall portions 174, 176 of the clamping groove 17b are realized by the two heat dissipation fins 16. The bottom portion 172 of the clamping groove 17b can be realized by a plurality of heat dissipation fins 16 (as shown in FIG. 5; wherein the clamping groove 17b is indicated by a broken line frame), or directly by the first heat dissipation surface 124 (the clamping groove shown in FIG. 6) 17c, indicated by a dashed box).

In addition, in the embodiment, the first clamping portion 182 has a positioning protrusion 1822 protruding toward the second clamping portion 184. When the C-shaped clip 18 clamps the first heat sink 12 and the second heat sink 14 to the memory module 3, the positioning bump 1822 is inserted into the adjacent two heat sink fins of the plurality of heat sink fins 16 Between the sheets 16 (or between two adjacent ones of the plurality of fins 16 forming the bottom 172 of the slot 17), as shown in FIG. This combination (the positioning bump 1822 snaps between the adjacent two heat sink fins 16) has the effect of positioning the C-clamp 18 in the lateral direction 12b.

In addition, in the embodiment, the second clamping portion 184 has a protrusion 1842 protruding toward the first clamping portion 182. The second fin 14 includes two protruding ribs 146 disposed in parallel on the second heat dissipating surface 144. When the C-clamp 18 clamps the first heat sink 12 and the second heat sink 14 to the memory module 3, the second clamping portion 184 abuts the second heat dissipation surface 144 and the protrusion 1842 snaps into the two protrusions. Between the ribs 146, as shown in FIG. This combination (the projection 1842 is snapped between the two ribs 146) has the effect of positioning the C-clamp 18 in the longitudinal direction 12a (or a limiting effect, such as when the distance between the two ribs 146 is greater than the projection 1842) When width).

In addition, in the embodiment, the second clamping portion 184 has a positioning protrusion 1844 disposed on the protrusion 1842 and protruding toward the first clamping portion 182. The second heat sink 14 has a positioning hole 148 formed on the second heat dissipation surface 144 and located between the two protruding ribs 146. When the C-shaped clip 18 clamps the first heat sink 12 and the second heat sink 14 to the memory module 3, the positioning protrusion 1844 snaps into the positioning hole 148. This combination (positioning of the protrusion 1844 snapped into the locating hole 148) has the effect of locating the C-clamp 18. In practice, the positioning (or limit) of the second clamping portion 184 can be implemented by alternatively implementing the two protruding ribs 146 (corresponding projections 1842) or positioning holes 148 (corresponding to the positioning projections 1844). In addition, in practice, the second heat sink 14 can be integrally formed by processing a metal plate through a stamping process; however, the invention is not limited thereto.

In addition, in the present embodiment, the clip groove 17 (the upper limit portion of the first clip portion 182 in the longitudinal direction 12a) and the heat dissipation fin 16 (the positioning protrusion 1822 of the first clip portion 182 are positioned in the lateral direction 12b) are paired with a C shape. The clamping member 18 has a positioning effect, and the two protruding ribs 146 (the longitudinal upper limit position of the second heat sink 14 on the protrusion 1842 of the second clamping portion 184) and the positioning hole 148 (the positioning protrusion to the second clamping portion 184) 1844 positioning) also has a positioning effect on the C-shaped clip 18, so in practice, the positioning effect on the C-shaped clip 18 can be implemented by an alternative implementation. In addition, in the present embodiment, the C-shaped clip 18 has a symmetrical structure, that is, the first clip portion 182 has the same structure as the second clip portion 184, and the structure is designed such that the C-clamp member 18 can be assembled in both the forward and reverse directions. The first heat sink 12 and the second heat sink 14 are disposed on the first heat sink 12 and the second heat sink 14 to facilitate assembly of the memory heat sink 1 . In practice, the C-clamp 18 can be integrally formed by processing a metal plate through a stamping process; however, the invention is not limited thereto. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1‧‧‧ memory heat sink

12‧‧‧First heat sink

12a‧‧‧Portrait

12b‧‧‧ Horizontal

122‧‧‧First heat conducting surface

124‧‧‧First heat sink

14‧‧‧Second heat sink

142‧‧‧Second thermal conduction surface

144‧‧‧second heat sink

146‧‧‧ rib

148‧‧‧Positioning holes

16‧‧‧Heat fins

17, 17a, 17b, 17c‧‧‧ slot

172‧‧‧ bottom

174, 176‧‧‧ Side wall

18‧‧‧C-shaped clips

182‧‧‧First clip

1822‧‧‧Positioning point

184‧‧‧Second clamp

1842‧‧‧Bumps

1844‧‧‧Positioning point

186‧‧‧Connecting Department

20, 22‧‧‧ Thermal layer

3‧‧‧ memory module

32‧‧‧First side heating surface

34‧‧‧The second side heating surface

1 is an exploded view of a memory heat sink according to an embodiment of the present invention. 2 is an exploded view of the memory heat sink of FIG. 1 from another perspective. 3 is a schematic view of the memory heat sink of FIG. 1 assembled to a memory module. 4 is a schematic diagram of a first heat sink and heat sink fins thereon according to another embodiment. FIG. 5 is a schematic diagram of a first heat sink and heat sink fins thereon according to another embodiment. FIG. 6 is a schematic diagram of a first heat sink and heat sink fins thereon according to another embodiment. 7 is a cross-sectional view of the memory heat sink of FIG. 3 assembled to the memory module along line X-X. Figure 8 is a cross-sectional view of the memory heat sink of Figure 3 assembled to the memory module along line Y-Y.

Claims (7)

A memory heat sink comprising: a first heat sink having a first heat conducting surface and a first heat dissipating surface opposite to the first heat conducting surface, the first heat sink having the first heat conducting surface and a memory One of the body modules is thermally coupled to the first side heat generating surface; a second heat sink having a second heat conducting surface and a second heat dissipating surface opposite to the second heat conducting surface, the second heat sink having the second heat conducting The surface is thermally coupled to the second side heating surface of the first side heating surface; the plurality of heat dissipation fins extend outward from the first heat dissipation surface to form between the plurality of heat dissipation fins a clamping slot; and a C-shaped clip for clamping the first heat sink and the second heat sink on the memory module and located in the clamping slot. The memory heat sink of claim 1, wherein the second heat sink has a positioning hole formed on the second heat dissipating surface, the C-shaped clip has a positioning protrusion, and when the C-shaped clip is used When a heat sink and the second heat sink are clamped on the memory module, the positioning protrusion is caught in the positioning hole. The memory heat sink of claim 1, wherein the first heat sink is integrally formed with the plurality of heat sink fins. The memory heat sink of claim 1, further comprising a heat conducting layer adhered to the first heat conducting surface, wherein the first heat conducting surface is attached to the first side heat generating surface via the heat conducting layer to One side of the heating surface is thermally coupled. The memory heat sink of claim 1, wherein each of the heat dissipation fins extends longitudinally along one of the first heat sinks, the clip slot extends laterally along one of the first heat sinks, and the plurality of heat sink fins are formed The C-shaped clip has a positioning protrusion, and the C-shaped clip clamps the first heat sink and the second heat sink on the memory module The positioning protrusion is caught between two adjacent ones of the plurality of heat dissipation fins. The memory heat sink of claim 1, wherein the C-clamp comprises a first clamping portion, a second clamping portion relative to the first clamping portion, and the first clamping portion and the second clamping member. a connecting portion, the second clamping portion has a protrusion protruding toward the first clamping portion, the second heat sink comprises a second protruding rib disposed on the second heat dissipating surface, when the C-shaped clip is to be When the first heat sink and the second heat sink are clamped on the memory module, the first clip portion abuts the clip slot, the second clip portion abuts the second heat dissipation surface and the tab card Between the two ribs. The memory heat sink of claim 6, wherein the second heat sink has a positioning hole formed on the second heat dissipation surface and located between the two protruding ribs, the second clamping portion has a positioning protrusion, and is disposed. And protruding from the protrusion and facing the first clamping portion, when the C-shaped clip clamps the first heat sink and the second heat sink on the memory module, the positioning protrusion is engaged in the positioning hole.