TW201518669A - Heat dissipation module - Google Patents

Abstract

A heat dissipation module comprises a heat conducting plate, a set of stacked fins, at least one heat pipe and a plurality of heat fins. The heat conducting plate has an upper surface. The set of stacked fins is in thermal contact with the upper surface of the heat conducting plate. The at least one heat pipe has an evaporating end and a condensing end. The evaporating end is in thermal contact with the upper surface. The plurality of heat fins are above the upper surface and are disposed with an interval between each other. The plurality of heat fins each has at least one through hole, and each of the condensing ends is disposed through the through holes.

Description

Thermal module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having a structure in which a stacked fin group and a heat pipe are disposed with a plurality of heat dissipation fins.

Due to advances in technology, the processing power of electronic components continues to grow, and as the processing efficiency of electronic components continues to increase, so does the amount of heat generated. In general, in order to prevent the electronic components from increasing in temperature due to heat accumulation, the operation is unstable, and a heat sink is usually installed to serve as an auxiliary heat sink.

In recent years, the amount of heat generated by electronic components has increased. At present, the heat-dissipating module used in the industry uses a heat-conducting plate to contact a heat source, and then uses a heat pipe to conduct heat to a plurality of heat-dissipating fins (Fin), thereby dissipating heat generated by the electronic device. In the heat dissipation module, the heat pipe is provided with a plurality of heat dissipation fins, so that the volume of the entire heat dissipation module is difficult to be reduced. On the other hand, although the heat pipe has the disadvantage of occupying a volume, the heat pipe plays an important role in heat conduction, and the heat dissipation efficiency of the heat dissipation module may be significantly reduced if the heat pipe is lacking. Therefore, how to design a heat dissipation module that can be installed in a limited space and also has good heat dissipation efficiency is a problem that must be solved in the industry.

In view of the above problems, the present invention relates to a heat dissipation module, thereby improving the problem that the current heat dissipation module cannot be combined with a specific small amount and high heat dissipation efficiency.

A heat dissipation module according to an embodiment of the invention includes a heat conduction plate, a stacked fin set, at least one heat pipe, and a plurality of heat dissipation fins. The heat conducting plate has an upper surface. The stacked fin sets are disposed in thermal contact on the upper surface of the heat conducting plate. At least one heat pipe has an evaporation end and a condensation end, and the evaporation end is disposed in thermal contact with the upper surface. A plurality of heat dissipation fins are located on the upper surface and are spaced apart from each other. The fins individually have at least one perforation through which the condensation end passes.

A heat dissipation module according to another embodiment of the present invention includes a heat conduction plate, a stacked fin assembly, at least one heat pipe, and a plurality of heat dissipation fins having an upper surface and a lower surface. The stacked fin sets are disposed in thermal contact on the upper surface. At least one heat pipe has an evaporation end and a condensation end, and the evaporation end is disposed in thermal contact with the lower surface. A plurality of heat dissipation fins are located on the upper surface and are spaced apart from each other. The fins individually have at least one perforation through which the condensation end passes.

The heat dissipation module of the invention comprises a stacked fin set and a heat pipe through which a plurality of heat dissipation fins are disposed. The thickness of the heat dissipation module is reduced by the arrangement of the stacked fin sets, so that the heat dissipation module can be applied to an electronic device with limited internal internal space. Furthermore, the heat dissipation module of the above embodiment still has a heat pipe through which a plurality of heat dissipation fins are disposed, and the heat conduction is performed by the heat pipe, so that the heat dissipation module can have good heat dissipation efficiency. Therefore, the heat dissipation module of the present invention can be loaded Set in a limited space, it can also have good heat dissipation efficiency.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.

10‧‧‧ Thermal Module

12‧‧‧heat source

14‧‧‧heat conducting plate

141‧‧‧ upper surface

143‧‧‧ lower surface

16‧‧‧Stacked fin sets

18‧‧‧heat pipe

181‧‧‧Evaporation end

183‧‧‧ Condensed end

20‧‧‧ Heat sink fins

201‧‧‧Perforation

H1‧‧‧first distance

H2‧‧‧Second distance

30‧‧‧ Thermal Module

32‧‧‧heat source

34‧‧‧heat conducting plate

341‧‧‧ upper surface

343‧‧‧ lower surface

36‧‧‧Stacked fin sets

38‧‧‧heat pipe

381‧‧‧Evaporation end

383‧‧‧condensing end

40‧‧‧ Heat sink fins

401‧‧‧Perforation

H1’‧‧‧First distance

H2’‧‧‧Second distance

1 is a perspective view showing the structure of a heat dissipation module according to an embodiment of the present invention.

Fig. 2 is a front elevational view showing the structure of a heat dissipation module according to an embodiment of the present invention.

3 is a perspective view showing the structure of a heat dissipation module according to another embodiment of the present invention.

Fig. 4 is a front elevational view showing the structure of a heat dissipation module according to another embodiment of the present invention.

Please refer to Figure 1 and Figure 2. 1 is a perspective view showing the structure of a heat dissipation module according to an embodiment of the present invention. Fig. 2 is a front elevational view showing the structure of a heat dissipation module according to an embodiment of the present invention.

The heat dissipation module 10 of an embodiment of the invention comprises a heat conducting plate 14, a stacked fin set 16, four heat pipes 18 and a plurality of heat radiating fins 20.

The heat conducting plate 14 has an upper surface 141 and a lower surface 143. In this embodiment, the lower surface 143 is in thermal contact with a heat source 12, but This is limited. For example, in another embodiment of the present invention, the lower surface of the heat conducting plate is not in direct thermal contact with the heat source 12, but is directly in thermal contact with the heat source by using the evaporation end of the heat pipe. The details are described in another embodiment of the present invention. Therefore, I will not go into details here. In the present embodiment, the heat conducting plate 14 is, for example, a Vapor Chamber. The function and working principle of the temperature equalizing plate are similar to those of the heat pipe, and it is driven by the evaporation condensation cycle of the actuating fluid enclosed in the plate cavity, so that it has the characteristics of rapid average temperature, and thus has the functions of rapid heat conduction and heat diffusion. However, the heat transfer mode of the heat pipe is one-dimensional, and the temperature equalization plate is two-dimensional, so that the temperature equalization plate has a rapid heat diffusion function in addition to the conventional function of the heat pipe that conducts heat from the heat source to the heat dissipation region. Therefore, the uniform temperature plate of the embodiment can achieve the effect of rapidly transferring the thermal energy of the heat source to the heat dissipation region. It should be noted that, in this embodiment, the heat conducting plate 14 is a temperature equalizing plate, but is not limited thereto. In other embodiments, the heat conducting plate may also be a plate made of aluminum or copper.

Stacked fins 16 are horizontally disposed on the upper surface 141 of the heat conducting plate 14. In detail, the stacked fin group 16 is formed by stacking a plurality of heat sink fins, but since the stacked fin sets are horizontally placed, each fin of the stacked fin group has a direction perpendicular to the heat conduction. board. In addition, the top end of the stacked fin set 16 is separated from the thermal conductive plate 14 by a first distance H1. The stacked fin sets 16 are in thermal contact with the heat conducting plates 14. That is, since the stacked fin sets 16 are in thermal contact with the thermally conductive plates 14, the thermally conductive plates 14 can conduct thermal energy from the heat source 12 to the stacked fin sets 16, thereby dissipating thermal energy from the stacked fin sets 16. In this embodiment, the stacked fin set 16 is made of copper, but Not limited to this.

The four heat pipes 18 individually have an evaporation end 181 and a condensation end 183. The evaporation end 181 is disposed on the upper surface 141 of the heat conducting plate 14, and the evaporation end 181 is in thermal contact with the upper surface 141 of the heat conducting plate 14 (as shown in Fig. 2). In addition, the top end of the condensation end 183 of each heat pipe 18 is spaced apart from the heat conductive plate 14 by a second distance H2, and the first distance H1 is smaller than the second distance H2 (as shown in FIG. 2). It should be noted that in the present embodiment, the number of heat pipes 18 is four, but the invention is not limited thereto. In other embodiments, the number of heat pipes may also be one, two, three or greater than or equal to five. A plurality of heat dissipation fins 20 are located above the upper surface 141 of the heat conduction plate 14, and the heat dissipation fins 20 are spaced apart from each other. That is to say, the heat dissipation fins 20 are stacked one on another at a distance. Each of the heat dissipation fins 20 has four through holes 201 corresponding to the four heat pipes 18. It should be noted that in the present embodiment, each of the heat dissipation fins 20 has four perforations 201, but the invention is not limited thereto. In other embodiments, the number of perforations of each of the heat dissipating fins can be adjusted according to the number of heat pipes, so the number of perforations can also be one, two, three or greater than or equal to five. The condensing ends 183 of each heat pipe 18 are respectively bored with the through holes 201. In this way, since the evaporation end 181 of each heat pipe 18 is in thermal contact with the upper surface 141 of the heat conducting plate 14, and the condensation end 183 of each heat pipe 18 is individually pierced through the through hole 201, the heat energy of the heat source can be conducted from the heat conducting plate 14 to The evaporation end 181 of each heat pipe 18 is transferred to the condensation end 183 of each heat pipe 18 by heat conduction. Finally, the heat energy of the heat source 32 is dissipated via the heat dissipation fins 20 that are passed through the four heat pipes 18.

As shown in FIG. 1 and FIG. 2 , the heat dissipation module 10 of the embodiment of the present invention includes a stacked fin set 16 and a heat pipe 18 having a plurality of heat dissipation fins 20 . In the heat dissipation module 10, the first distance H1 of the top end of the stacked fin group 16 from the heat conductive plate 14 is smaller than the second distance H2 between the top end of the condensation end 183 of each heat pipe 18 and the heat conductive plate 14. Therefore, for the electronic device with limited local internal space, the heat dissipation module 10 of the embodiment can utilize the arrangement of the stacked fin sets 16 to reduce the effect of occupying the internal space of the electronic device. In addition, in the heat dissipation module 10 of the embodiment of the present invention, the heat pipe 18 is further provided with a plurality of heat dissipation fins 20, and the heat dissipation is performed by the heat pipe 18, so that the heat dissipation module 10 can heat the heat source 12 Efflux of efficiency. Therefore, the heat dissipation module 10 according to an embodiment of the present invention can be installed in a limited space, and can also have good heat dissipation efficiency.

Please refer to Figures 3 and 4. 3 is a perspective view showing the structure of a heat dissipation module according to another embodiment of the present invention. Fig. 4 is a front elevational view showing the structure of a heat dissipation module according to another embodiment of the present invention.

The heat dissipation module 30 of another embodiment of the present invention includes a heat conduction plate 34, a stacked fin group 36, four heat pipes 38, and a plurality of heat dissipation fins 40.

The heat conducting plate 34 has an upper surface 341 and a lower surface 343. In the present embodiment, the heat conducting plate 34 is, for example, a Vapor Chamber. The principle and function of the temperature equalizing plate have been described in the previous embodiment, so the description will not be repeated here. It should be noted that, in this embodiment, the heat conducting plate 34 is a temperature equalizing plate, but is not limited thereto. In other embodiments, the heat conducting plate may also be made of aluminum or Copper plate body.

The stacked fin sets 36 are horizontally disposed on the upper surface 341 of the heat conducting plate 34. In detail, the stacked fin group 36 is formed by stacking a plurality of heat sink fins, but since the stacked fin sets are horizontally placed, each fin of the stacked fin group has a direction perpendicular to the heat conduction. board. In addition, the top end of the stacked fin set 36 is spaced apart from the thermally conductive plate 34 by a first distance H1'. The stacked fin sets 36 are in thermal contact with the heat conducting plates 34. That is, since the stacked fin sets 36 are in thermal contact with the thermally conductive plates 34, the thermally conductive plates 34 can conduct thermal energy to the stacked fin sets 36, thereby dissipating thermal energy via the stacked fin sets 36. In this embodiment, the material of the stacked fin group 36 is copper, but is not limited thereto.

The four heat pipes 38 individually have an evaporation end 381 and a condensation end 383. The condensation end 383 is disposed on the upper surface 341 of the heat conducting plate 34. The evaporation end 381 is in thermal contact with the lower surface 343 of the heat conducting plate 34, and the evaporation end is in thermal contact with the heat source 32 away from one side of the lower surface 343 (as shown in Fig. 4). Further, the top end of the condensation end 383 of each heat pipe 38 is spaced apart from the heat conductive plate 34 by a second distance H2', and the first distance H1' is smaller than the second distance H2' (as shown in Fig. 4). It should be noted that in the present embodiment, the number of heat pipes 38 is four, but the invention is not limited thereto. In other embodiments, the number of heat pipes may also be one, two, three or greater than or equal to five. A plurality of heat dissipation fins 40 are located above the upper surface 341 of the heat conduction plate 34, and the heat dissipation fins 40 are spaced apart from each other. That is to say, the heat dissipation fins 40 are stacked one on another at a distance. Each of the heat dissipation fins 40 has four through holes 401 corresponding to the four heat pipes 38. Need to pay attention That is, in the present embodiment, each of the heat dissipation fins 40 has four perforations 401, but the invention is not limited thereto. In other embodiments, the number of perforations of each of the heat dissipation fins can be adjusted according to the number of heat pipes. Therefore, each of the heat dissipation fins may have a number of perforations of one, two, three or greater than or equal to five. The condensing ends 383 of each heat pipe 38 are respectively passed through the through holes 401. In this way, since the evaporation end 381 of each heat pipe 38 is in direct thermal contact with the heat source 32, and the condensation end 383 of each heat pipe 38 is individually pierced through the through hole 401, the heat energy of the heat source can be conducted from the evaporation end 381 to each heat pipe 38. The condensation end 383. Finally, the heat energy of the heat source 32 is dissipated via the heat dissipation fins 40 that are passed through the four heat pipes 38.

As shown in FIG. 3 and FIG. 4 , the heat dissipation module 30 of the other embodiment of the present invention includes a stacked fin set 36 and a heat pipe 38 that are provided with a plurality of heat dissipation fins 40 . In the heat dissipation module 30, the first distance H1' of the top end of the stacked fin group 16' from the heat conductive plate 34 is smaller than the second distance H2' of the top end of the condensation end 383 of each heat pipe 38 and the heat conductive plate 34. . Therefore, for the electronic device with limited local internal space, the heat dissipation module 30 of the embodiment can utilize the arrangement of the stacked fin sets 36 to reduce the effect of occupying the internal space of the electronic device. In addition, in the heat dissipation module 30 of another embodiment of the present invention, the heat pipe 38 is further provided with a design of a plurality of heat dissipation fins 40, and the heat pipe 38 is in direct thermal contact with the heat source. The heat conduction by the heat pipe 38 enables the heat dissipation module 30 to efficiently dissipate the heat energy of the heat source 32. Therefore, the heat dissipation module 30 of another embodiment of the present invention can be installed in a limited space, and can also have good heat dissipation efficiency.

According to the heat dissipation module of the above embodiment, the stacked fin set and the heat pipe are provided with a plurality of heat dissipation fins. The thickness of the heat dissipation module is reduced by the arrangement of the stacked fin sets, so that the heat dissipation module can be applied to an electronic device with limited internal internal space. Furthermore, the heat dissipation module of the above embodiment is further provided with a heat pipe through which a plurality of heat dissipation fins are designed, and the heat dissipation is performed by the heat pipe, so that the heat dissipation module can have good heat dissipation efficiency. Therefore, the heat dissipation module of the present invention can be installed in a limited space, and can also have good heat dissipation efficiency.

In addition, according to the heat dissipation module of the above embodiment, the temperature equalization plate is used as the heat conduction plate. The heat dissipation module of the invention can have good heat dissipation efficiency by the rapid temperature diffusion function of the temperature equalization plate.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10‧‧‧ Thermal Module

12‧‧‧heat source

14‧‧‧heat conducting plate

16‧‧‧Stacked fin sets

18‧‧‧heat pipe

20‧‧‧ Heat sink fins

201‧‧‧Perforation

Claims (10)

A heat dissipation module comprising: a heat conducting plate having an upper surface; a stacked fin set horizontally disposed on the upper surface of the heat conducting plate; at least one heat pipe having an evaporation end and a condensation end The evaporation end is disposed in thermal contact with the upper surface; and a plurality of heat dissipation fins are disposed on the upper surface and are spaced apart from each other. The fins individually have at least one through hole, and the condensation end penetrates the through holes. The heat dissipation module of claim 1, wherein the heat conduction plate is a temperature equalization plate. The heat dissipation module of claim 1, wherein the heat conductive plate is made of aluminum or copper. The heat dissipation module of claim 1, wherein a top end of the stacked fin group is spaced apart from the heat conductive plate by a first distance, and a top end of the condensation end is spaced apart from the heat conductive plate by a second distance, and the first A distance is less than the second distance. The heat dissipation module of claim 1, wherein the heat conduction plate further has a lower surface, the lower surface being in thermal contact with a heat source. A heat dissipation module comprising: a heat conducting plate having an upper surface and a lower surface; a stacked fin group disposed horizontally on the upper surface in thermal contact; at least one heat pipe having an evaporation end and a condensation end, the evaporation end being thermally contacted And the plurality of heat dissipation fins are located on the upper surface and are spaced apart from each other, and the fins individually have at least one through hole, and the condensation end penetrates the through holes. The heat dissipation module of claim 6, wherein the heat conduction plate is a temperature equalization plate. The heat dissipation module of claim 6, wherein the heat conductive plate is made of aluminum or copper. The heat dissipation module of claim 6, wherein a top end of the stacked fin group is spaced apart from the heat conductive plate by a first distance, and a top end of the condensation end is spaced apart from the heat conductive plate by a second distance, and the first A distance is less than the second distance. The heat dissipation module of claim 6, wherein the evaporation end is in thermal contact with a heat source with respect to the other side of the lower surface.