M319476 八、新型說明·· 【新型所屬之技術領域】 本新型係與電子裝置之散熱器有關，特別 空間之扇平化散熱器結構，且其散熱鰭片 i用於狹小 •【先前技術】 尺竹裁切調整者。 置之效能逐漸提昇’伴隨而來的散熱問題也 作當中需要進行高速邏輯演算的電子 3 部的中央處理器、顯示晶片組 專寺此類電子兀件由於運算時脈的不斷上升，使 高的電功率而產生更多的廢熱，這些大量的廢熱會在财間 整個電子裝置的溫度快速升高，因此， 此 ^ Β = 廢熱迅速排除’便會使電子裝置一直處於高 =:r裝置_作，造成㈣置 就目前-般個人電腦之中央處理器的散熱器而言，雖铁業尺 祕出各種利用液體進行熱交換的熱傳裝置，例如 哭 或熱導管等等可加強熱傳效率之步 b '政… 為導熱介質的散熱裝置有都有絲較。液態卫作流體 須搭配散熱籍片及風扇來對工作流體進狀卻^因此而== ，搭配風扇仍然為個人電腦之中央處理器上最常見二 以鰭片式散熱器的製作方式來分3 為一 _及接合式二種，其中_=== M319476 鋁為製作材料，主要是利用鋁的熱阻抗低、重量輕、成本低以及 易於链播成型等優點，但是—體成型式散熱鰭片組因受限於銘擠 成1的‘程，使政熱益籍片的密度無法有效增加，以致於無法在 有限的雜下進-步提昇散熱表面積，因itt便發展出能以極小間 距排列則的接合式鰭片組，以增加則的設置密度來提昇籍片 組的散熱表面積’而進-步提昇鰭片式散熱器之散熱效率。M319476 VIII. New description·· 【New technology field】 This new type is related to the heat sink of the electronic device. The fan plane of the special space is flattened, and the heat sink fin i is used for narrowness. [Prior Art] Bamboo cutting adjuster. The performance of the device is gradually improved. The heat dissipation problem that comes with it is also the central processing unit of the electronic 3, which is required to perform high-speed logic calculation, and the electronic components of the display chip set temple are high due to the rising clock. The electric power generates more waste heat. These large amounts of waste heat will rise rapidly in the temperature of the entire electronic device. Therefore, this Β = waste heat is quickly eliminated, and the electronic device will always be at a high =: r device. In the case of (4) the heat sink of the central processor of the current personal computer, although the iron industry has a variety of heat transfer devices that use liquid for heat exchange, such as crying or heat pipes, etc., the heat transfer efficiency can be enhanced. b 'Government... The heat sink for the heat transfer medium has a silky contrast. The liquid-powered fluid must be matched with the heat-dissipating film and the fan to make the working fluid into shape. Therefore, the replacement fan is still the most common type of fin-type heat sink on the central processing unit of the personal computer. It is a kind of _ and joint type, of which _=== M319476 aluminum is made of materials, mainly using aluminum, which has the advantages of low thermal resistance, light weight, low cost and easy chain forming, but the body-formed heat sink fins Because the group is limited by the 'crowding' of 1 , the density of the political heat tablets can not be effectively increased, so that the heat dissipation surface area cannot be increased in a limited way, because the itt is developed to be arranged at a very small pitch. In the case of the bonded fin group, the heat dissipation surface area of the chip group is increased by increasing the installation density, and the heat dissipation efficiency of the fin heat sink is further improved.
如中華民國新型專利M269700號，即為本案創作人針對一般 個人電腦之巾央處麵所提㈣—雜合式則散熱器，其中創 作人因深赫練昇散絲面毅能有效提高散熱錄熱效率的 原理為眾所皆知，但是在電腦裝置财極小化的發展趨勢下，如 何在有限的空間下增加則的設置密度才是更重要轉題，因而 在M269700案中提出了環形排列組扣之散熱籍片組，藉以在不佔 用太多雜下使㈣的設置密度_最佳化，不僅能提高籍片式 散熱器的散熱鱗，也可⑽雜器、轉在適#的體積。 雖然M269700案中所揭露之環形接合式散熱韓片組足以符合 -般個人電腦之中央處理輯空間的要求，蚁對於—些並列插 ，在南效料㈣腦上的高_示晶奸，或是電子元件排列緊 密之工㈣腦及储社_言，因其高發鍾子 排列裝設，麟料高賴電子元件上 =山也 (垂直電路板方向)空間更加狹小 L、、、衣的縱向 缝片組因具有-定的縱向高度，而之散熱 Γ工間之要求。可想而知，要在減少縱向高度的前提下作又不 犧牲總散熱表面積，只好將散_組之則朝橫向空間(平行電 6 M319476 長度，但是此舉勢必會與熱源周邊的電路組件(如電 谷等等)有所干涉.，或者是影響㈣路板的組裝關係，以及 牽涉賴_方式，這些較急需解_題。因此，本宰 ，即為創作人針對前述散侧組存在的問題，在歷案之竿 構下進一步提出更加完善的解決之道。 ^ 【新型内容】 • 先前技術中之散賴片組因具有一定的縱向高度，而無法適 、用於排列緊密的高發熱電子元件上。鐾於以上的問題，本新型的 =目的麵提供―種具衫間錄且則尺寸可雜之散熱器 、⑺構、’以解決習知散熱鰭片組所存在的問題。 為解決前述之問題，本創作之目的在提供—種散熱器結構， 用以對於—設置於狹小空間中之熱源進行散熱，其中此一散執哭 結構ί括有—導熱塊、—散_片組以及1定件。導熱塊之底 面緊_附至熱源，而導熱塊了細設置有—間隔件。散熱韓片組 •彡、’片狹長形之韓片沿間隔件外緣排列組接於導熱塊上，i '中^片之長側係與導熱塊平行擺置，使散熱鰭片組呈扁平圓環 ，首……曰片°且上具有由鰭片環接形成之一導熱面及一凹槽，其 l:、、面緊4_至導熱塊之頂面，使熱源之熱能可以經由導熱 塊及導熱面魏地傳遞至則上進行散熱。固定件位於觸片組 之=槽中亚藉由間·組裝至導熱塊，而將散鱗片組夾持固定 於導熱塊上。其中散熱續片組具有較低之縱向(垂直熱源或導熱塊 方向)回度’且散熱韓片組之各韓片可被裁切至適當尺寸，藉以在 不減少總散熱表面積之前提下，提供具有空間優勢之散熱器結 7 M319476 t = ’摘鱗可配合雜風敍解料設置 ㊁=當尺寸使散熱風扇及熱導管可埋入細片組中= 不衫+其空間優勢下進一步提高散熱效率。 •狀，ΟΓΓΓ效在於，散熱器結構之散熱則組為扁平圓環 ‘斤人姑 總散熱表面積下控制散熱器結構之縱向高度，以 雜發熱電子蝴於蝴用上之要求，且散敛 進而可節省散熱器之二成本。結構㈣用範圍較廣泛， 以下在實施方式中詳細敘述本新型之詳細特徵以真 .相關技藝者了解本新型之技術内二★ =且根縣_書_叙_、㈣翻麵及圖式，任何 无、白相闕翻者可輕祕理解本新型_之目的及優點。 以上之關於本新型内容之說明及以下之實施方式之說明係用 ==本_理，並域供本新型之專利申請範圍更 【實施方式】 秘對梓_目的、構造、雜、及其魏錢_步的瞭 解，鉍配合貫施例詳細說明如下。 、 :减丰1圖」及「第2圖」所示，為本創作提供之 讀構的第-實施例，其包含有—導熱塊2。、一散编組^ 間Μ牛50及-固定件6〇 ’此一散熱器結構係用以對於—熱源 〇進行散熱，其中熱源10可以是設置於狹小空間中之高發熱電 M319476 子元件(晶片），例如並排設置之高階顯示卡的處理a ' 工業電腦内部排列緊密之電路板的處理晶片等等。日Β α盗或 導熱塊20可由紹、銅或其他易導熱材料所製成並配 10形成匹配之外觀輪廓，例如矩形狀之板塊。導熱塊2 /、 • 22緊密_至熱源1()，而導熱塊2G之頂面21則緊密貼附至= ‘籍片組30，使_ 1G之熱能可經由導熱塊2Q傳遞至散熱韓= 30之各籍片34上，且導熱塊2〇上形成二螺孔23。另，、‘編 20與熱源1〇之間可塗覆一散熱膏，以填滿兩者貼附時的办^ 藉以保持良好料熱效果。間隔件5Q可_、銅或其他易^材 料所製成並呈圓盤狀，且間隔件5〇上形成二對應於螺 ^ 孔51。 <牙 請續參閱「第3圖」、「第4圖」、「第5A圖」及「第 所示，散熱籍片組30係由複數片狹長狀之籍片34沿間隔件= 緣排顺接，射則34之個係與導熱塊2Q平行擺置， 熱鰭片組30之外觀呈現扁平圓環狀，藉以在不減少散熱月 30的總散熱表面積下降低散熱鰭片組3〇的凸出於導熱塊^之二 度。散鏡片組3G之底部形成—導熱面31，且導熱面31係: 貝占附於導熱塊2G之頂面21，使導熱塊2G上的熱能可經由導^ 3咖至㈣34上進行賴。散_組3Q之_彳㈣凹、= 形成-凹槽32，以容置散熱n結構的其它的組件而不會凸出至= 熱鰭片組30外。另，導熱面31與導熱塊2Q之間可塗覆θ—散^ 以填滿兩者朗時的空隙，藉以簡良好的導熱效果。、月 各鰭片34可由紹、銅或其他易導熱且容易衝墨成型的材料所 M319476 製成之狹長形薄板片，其包含有一主體部341、二相對之扣片 342、二相對之扣持部343及一延伸部344。主體部341為鰭片34 上表面積最大之板片，亦為鰭片34上主要提供熱能與週遭空氣進 行熱交換之區域。各扣片342係為一自主體部341邊緣向外延伸 ，之板片，而各扣持部343為一自主體部34i垂直延伸出並對應於 ‘扣片342之板片。各扣持部343上形成一扣孔345及—缺孔撕， ‘其中扣孔345係用以扣住另一鰭片34之扣片342，使各鰭片％ 籲之扣持部343扣住另-鰭片34之扣片342，以複數片鰭片％環 接組扣成散熱鰭片組30,而缺孔346則用以容置另一鰭片34之 扣持部343，使組扣後之鰭片34時仍然可以相對地擺動位移而排 列成壞狀。延伸部344係自主體部341朝間隔件5〇延伸出，且延 伸部344底部形成一斜板347，其中各鰭片34之斜板347係環接 形成散熱鰭片組30底部之導熱面31，而各鰭片34之主體部341 -侧與延伸部344之頂部則一起環接形成散熱鰭片組3〇 τ頁部之 • 凹槽32。 、 • 固定件60可由鋁、銅或其他易導熱材料所製成並呈圓形盤 -狀，其盤面的直徑係小於散熱韓片組30之凹槽32的直徑，而可 -以經由凹槽32放置入散熱籍片組3〇巾。固定件6〇上具有二對應 於，孔23之穿孔61，其中螺固件90係穿過穿孔61及間隔件50 之牙孔51而旋入螺孔23，使間隔件5〇組裝至導熱塊上，並 透過間隔件50將固定件60組裝至導熱塊2〇，藉以利用固定件6〇 將散熱續片組30穩定地夾固於導熱塊2〇上。當使用者利用螺固 件90將固定件60鎖固至導熱塊2〇時，固定件6〇即抵壓韓片料 10 M319476 之延伸部344頂部，使散熱鰭片組3G底部之導熱面3i緊密貼附 至導熱塊20之頂面21。 請再續參閱「第2圖」、「第6圖」及「第7圖」所示，熱源 之熱能可經岭熱塊2Q及麵則組3()之導熱面Η迅速地 ，導至各韓片34上’而在各籍片34之表面與周圍的空氣進行熱 、、、使工氣將各备片上來自熱源1〇之熱能迅速地帶走，以 達成對熱源10進行迅速散熱之功效。 本創作之散熱|§結構可裝設於一電路板1〇〇，例如是個人電 腦之擴充齡卡、工魏腦翻翻之主機板料，其中因為散 熱鰭片組3〇呈4平郷狀，而使散齡結構具有較低之縱维 直於電路板1GG之方向)高度，所以當多個電路板〗⑻並排設置 時’本創作之散熱器 1吉構並不會影響到另—個電路板1〇〇之設置 空間。另，散熱則組30之各，鰭片34可針對電路板勘上的其 他電路組件搬(如電阻、電容等等)裁切至適當尺寸(如「第7圖」 所示），或是針對散舖片組30與金屬接腳1〇1干涉的區域予以」 裁切(如「第6圖」所示），使散熱韓片組3〇於橫向(平行於電路板 100之方向戌間上可調整尺寸，以避免散熱鰭片組3Q之各韓片For example, the new patent of the Republic of China, M269700, is the creator of the case for the general personal computer. (4) - Hybrid type radiator, in which the creator can effectively improve the heat-discharging efficiency due to the deep-lifting The principle is well known, but under the development trend of miniaturization of computer devices, how to increase the density of settings in a limited space is a more important issue. Therefore, in the M269700 case, a circular arrangement is proposed. The heat-dissipating film group can optimize the setting density of (4) without occupying too much miscellaneous, and can not only improve the heat-dissipating scale of the chip-type heat sink, but also (10) the volume of the miscellaneous device. Although the ring-joined heat-dissipating Korean film set disclosed in the M269700 case is sufficient to meet the requirements of the central processing space of the PC, the ants are arbitrarily inserted into the brain, and the high _ lining on the brain of the south material (4), or It is the work of closely arranging electronic components (4) Brain and storage society _ words, because of its high-incidence clock arrangement, the material is high on the electronic components = mountain (vertical board direction) space is more narrow L,,, clothing longitudinal seam The film set has a fixed longitudinal height, and the heat sink is required. It is conceivable that the length of the vertical height should be reduced without sacrificing the total heat dissipation surface area, so that the _ group should face the horizontal space (parallel electricity 6 M319476 length, but this will inevitably be related to the circuit components around the heat source ( Such as electricity valley, etc.) have interference, or influence (4) the assembly relationship of the road board, and the involvement of the _ method, these are more urgent need to solve the problem. Therefore, the slay, that is, the creator for the aforementioned scattered side group exists The problem is to further propose a more perfect solution under the circumstance of the case. ^ [New content] • The previous technology in the loose film group has a certain vertical height, which is not suitable for the arrangement of high heat On the electronic components, in view of the above problems, the new target surface of the present invention provides a heat sink with a size that can be mixed between the shirts, and a structure that can be used to solve the problems of the conventional heat sink fin group. To solve the foregoing problems, the purpose of the present invention is to provide a heat sink structure for dissipating heat to a heat source disposed in a narrow space, wherein the sparse crying structure includes a heat conducting block and a bulk film. And a fixed piece. The bottom of the heat-conducting block is tightly attached to the heat source, and the heat-conducting block is thinly provided with a spacer. The heat-dissipating Korean chip group • 彡, 'The long and narrow piece of the piece is arranged along the outer edge of the spacer to be connected to the heat conduction. On the block, the long side of the i 'middle piece is placed parallel to the heat conducting block, so that the heat dissipating fin set is a flat ring, and the first piece has a heat conducting surface formed by the fin ringing and one. The groove, the l:, the surface is tightly 4_ to the top surface of the heat conducting block, so that the heat energy of the heat source can be transmitted to the heat through the heat conducting block and the heat conducting surface, and the heat is dissipated. The fixing member is located in the contact group = slot The scaly chip set is clamped and fixed to the heat conducting block by being assembled to the heat conducting block, wherein the heat sinking slab group has a lower longitudinal direction (vertical heat source or heat conducting block direction) and the heat radiating film group The Korean film can be cut to the appropriate size so that it can be lifted before the total heat dissipation surface area is reduced, providing a radiator with a space advantage. 7 M319476 t = 'The scale can be matched with the wind replenishing material setting two=When the size makes the heat dissipation Fans and heat pipes can be buried in the fine film group = no shirt + its space advantage further High heat dissipation efficiency. • The shape is effective. The heat dissipation of the radiator structure is set to the flat ring. The longitudinal height of the radiator structure is controlled by the total heat dissipation surface area. Moreover, the cost of the heat sink can be saved, and the structure (4) is widely used. In the following, the detailed features of the present invention are described in detail in the embodiment. The relevant art knows the technology of the present invention. The book _ _ _, (four) face and schema, any no, white 阙 可 can understand the purpose and advantages of this new _. The above description of the new content and the following description of the implementation of the system == The scope of the patent application for this new type is more [Embodiment] The understanding of 目的 _ purpose, structure, miscellaneous, and its Wei _ step, as described in detail with the following examples. 1 and 2, the first embodiment of the reading provided for the creation includes a heat conducting block 2. , a scatter group ^ Μ 牛 50 and - fixing member 6 〇 'this heat sink structure is used for heat dissipation of the heat source ,, wherein the heat source 10 can be a high-heating electric M319476 sub-component disposed in a small space ( Wafer), for example, processing of high-order display cards arranged side by side a' processing chips of a circuit board in which an industrial computer is closely arranged, and the like. The Β Β or the thermal block 20 can be made of slag, copper or other thermally conductive material and is provided with a matching profile, such as a rectangular plate. The heat conducting block 2 /, • 22 is tight_to the heat source 1 (), and the top surface 21 of the heat conducting block 2G is closely attached to the = 'slice group 30, so that the heat energy of the _1G can be transferred to the heat sink via the heat conducting block 2Q. On each of the sheets 34 of the 30, two screw holes 23 are formed in the heat conducting block 2''. In addition, a heat-dissipating paste can be applied between the stencil 20 and the heat source 1 填 to fill the two when the two are attached to maintain a good heat-heating effect. The spacer 5Q can be made of _, copper or other easy material and has a disk shape, and the spacer 5 is formed on the spacer 5 corresponding to the screw hole 51. <Tooth please continue to refer to "3", "4th", "5A" and "Third", the heat-dissipating group 30 is composed of a plurality of long and narrow pieces 34 along the spacer = edge Sequentially, the radiation system 34 is placed parallel to the heat conduction block 2Q, and the appearance of the heat fin group 30 is flat annular shape, thereby reducing the heat dissipation fin group 3〇 without reducing the total heat dissipation surface area of the heat dissipation month 30. It protrudes from the heat conducting block twice. The bottom of the diffusing lens group 3G forms a heat conducting surface 31, and the heat conducting surface 31 is: the shell is attached to the top surface 21 of the heat conducting block 2G, so that the heat energy on the heat conducting block 2G can be guided through ^ 3 coffee to (four) 34 on the Lai. The _ group 3Q _ 彳 (four) concave, = formation - groove 32, to accommodate the other components of the heat dissipation n structure without protruding to = outside the hot fin group 30. In addition, between the heat conducting surface 31 and the heat conducting block 2Q, θ-scatter can be applied to fill the gap between the two, so that the heat conduction effect is simple, and the fins 34 can be made of heat, heat or the like. The elongated thin plate piece made of the material M319476 which is easy to be ink-molded, comprises a main body portion 341, two opposite buckle pieces 342, two opposite holding portions 343 and one The main body portion 341 is a plate having the largest surface area on the fin 34, and is also a region on the fin 34 which mainly supplies heat energy to exchange heat with the surrounding air. Each of the cleats 342 is an edge from the edge of the main body portion 341. Each of the fastening portions 343 is a plate extending perpendicularly from the main body portion 34i and corresponding to the 'depression piece 342. Each of the fastening portions 343 is formed with a buttonhole 345 and a tear hole, ' The buckle hole 345 is used to fasten the buckle piece 342 of the other fin 34, so that each of the fins acknowledging portion 343 is fastened to the buckle piece 342 of the other fin 34, and the plurality of fins are ring-connected. The group is fastened to the heat sinking fin group 30, and the notch 346 is used for accommodating the latching portion 343 of the other fin 34 so that the rear fins 34 can be relatively oscillated and arranged in a bad shape. The extending portion 344 extends from the main body portion 341 toward the spacer 5b, and a slanting plate 347 is formed at the bottom of the extending portion 344, wherein the slanting plate 347 of each fin 34 is looped to form a heat conducting surface 31 of the bottom of the heat dissipating fin group 30. The body portion 341 - side of each of the fins 34 and the top portion of the extending portion 344 are looped together to form a recess 32 of the heat sink fin group 3 页 page portion. • The fixing member 60 may be made of aluminum, copper or other heat-conductive material and has a circular disk shape, the diameter of the disk surface is smaller than the diameter of the groove 32 of the heat-dissipating Korean group 30, and may be through the groove 32. The heat-dissipating group 3 is placed in the heat-dissipating group 3. The fixing member 6 has two holes 61 corresponding to the holes 23, wherein the screw 90 is threaded through the holes 61 of the holes 61 and the spacers 50 and screwed into the screw holes 23, The spacers 5 are assembled to the heat conducting block, and the fixing member 60 is assembled to the heat conducting block 2 through the spacer 50, whereby the heat sinking block 30 is stably clamped to the heat conducting block 2〇 by the fixing member 6〇. When the user locks the fixing member 60 to the heat conducting block 2 by using the screw 90, the fixing member 6 is pressed against the top of the extending portion 344 of the Korean sheet 10 M319476, so that the heat conducting surface 3i at the bottom of the heat dissipating fin group 3G is tight. Attached to the top surface 21 of the thermally conductive block 20. Please continue to refer to "Figure 2", "Figure 6" and "Figure 7". The heat energy of the heat source can be quickly transferred to the heat conduction surface of the hot block 2Q and the face group 3 (). The Korean film 34 is 'on the surface of each piece 34 and the surrounding air is heated, so that the process quickly removes the heat from the heat source 1 on each of the sheets to achieve rapid heat dissipation of the heat source 10. . The heat dissipation of the creation| § structure can be installed on a circuit board, for example, the expansion card of a personal computer, the main board of the Wei Wei brain turning over, wherein the heat dissipation fin group is 4 flat, And the structure of the ground age has a lower vertical dimension than the direction of the board 1GG), so when multiple boards (8) are arranged side by side, the heat sink 1 of this creation does not affect another circuit. The setting space of the board 1〇〇. In addition, the heat dissipation is performed by each of the groups 30, and the fins 34 can be cut to an appropriate size (such as "resistance, capacitance, etc." for other circuit components (such as "Figure 7"), or for The area where the scattered sheet group 30 interferes with the metal pin 1〇1 is cut (as shown in Fig. 6), so that the heat-dissipating Korean group 3 is horizontally (parallel to the direction of the board 100) Adjustable size to avoid the Korean fins of the heat sink fin group 3Q
34與電路板100上的其他組件產生衝突，進而針對各種類型^電 路板1〇〇提供適用的客製化散熱器結構。 I 請參照「第8圖」及「第9圖」所示，為本創作散熱器結構 顺供之$二實_，其中第二實施例在第—實施例之架構下姆 加了-熱導管70，且熱導管70包含有—吸熱段71及_冷凝段ς 兩個主要區段。並請配合參閱「第5Α圖」及「第5β圖」所^， 11 M319476 各”，、s片34包含有一朝主體部341内部凹陷之缺口 348,各缺口 348 係環接形成散熱鰭片組3〇底部之環缺槽33，且環缺槽33係環繞 於導熱面31之外側。熱導管7〇之吸熱段71係嵌入導熱塊2〇中， 且及”、、& 71與‘熱塊2〇之間塗佈有一散熱膏，例如是錫膏或其 他具有高熱侧叙黏著f，以做為賴段γι與導熱塊2〇接觸 連接之介質，以提昇兩者之_熱傳效率。熱導管％之冷凝段 72係㈣熱段71延伸出並婉虫延攀附入散熱籍片組％底部之環缺 槽j3，而與各鰭片34進行接觸。34 conflicts with other components on board 100 to provide a suitable customized heat sink structure for various types of circuit boards. I Please refer to "Figure 8" and "Figure 9" for the creation of the heat sink structure. The second embodiment is a structure of the first embodiment. 70, and the heat pipe 70 comprises two main sections: an endothermic section 71 and a condensing section. Please refer to the "5th figure" and "5th figure", "11 M319476", the s piece 34 includes a notch 348 which is recessed toward the inside of the main body portion 341, and each notch 348 is looped to form a heat sink fin group. 3, the bottom ring lacks the groove 33, and the ring notch 33 surrounds the outer side of the heat conducting surface 31. The heat pipe 7 of the heat pipe 7 is embedded in the heat conducting block 2, and ",, & 71 and 'hot A heat-dissipating paste is applied between the blocks 2, for example, a solder paste or other high-heat side adhesive f, as a medium for contacting and connecting the γ ι to the heat-conducting block 2 to improve the heat transfer efficiency of the two. Condensation section of the heat pipe % 72 The (four) heat section 71 extends and the locusts are attached to the ring sill j3 at the bottom of the heat-dissipating group, and are in contact with the fins 34.
故’在弟二實施例中，熱源1〇之熱能不但可經由導熱塊 傳遞至政熱組30上的34，而湘週遭空氣進行散熱， 另方面熱源10之熱能也可以經由導熱塊2〇傳遞至熱導管％， 而利用熱導管70中工作流體的相變化進行來進行散熱’藉以透過 兩種散熱途#更有效率地進行散熱，熱導㈣也是組設於散 熱鰭片組30内，並不會與散熱器結構周圍的電路组件衝突。 請續參照「第1◦圖」及「第11圖」所示，為本創作散教哭 結構所提供之第三實施例，其中第三實施例在第—實施例之架、ς 下增加了-散熱風扇8G ’散熱風扇⑽組裝於固定件⑹上，例如 利==件81穿過散熱風扇8〇並旋入螺孔泣，且散熱風扇8〇 位於政熱鰭片組30之凹槽32中。散熱風扇8〇係用以帶動並產生 1 通過各鰭片Μ之表面，形成強制對流使單位時間通過 量加大，而提高鰭片34與空氣的熱交換效率， ==片組30之散熱效果。而且散熱風扇8〇組設於躺 ,，，丄且30中，有效地控制了散熱器結構之縱向(如「第6圖」 12 M319476 垂直Γ棘板1GG之方向)高度，不但增加了散熱效率 ，也不會影 響到散熱器結構本來的空間優勢。 請再參照「第12圖」及「第13圖」所示，為本創作散熱器 結構所提供之第四實施例，其中第四實施例在第二實施例之架構 下增力-口了-散熱風扇80，即對於本創作之第二實施例與第三實施 -例進行整合運用，立中孰導普％访五 、T”、、Vs 70與散熱風扇80之設置方式皆與 第二實施例與第三實施例相同，不在贅述。在細實施例中，献 源K)之熱能不但可透過兩個散熱途徑(熱導管％額片观週 更被散熱風扇㈣動為強制氣 >瓜通過各,、、、曰片34表面，使散執哭&丄播7 + 空間優勢™最佳的散熱效Γ 不影響其(縱向及橫向） =嫩讀舰射，幅_3_ 故：Γ在不減少總散熱表面積下控制散㈣結構之縱向高 度，以付合排雕密的高發熱電子元件對於㈣湘上之 ^散熱㈣組30之_ 3何針對週遭環叙障礙物或 放熱配件(散熱風扇8〇及埶導管7()>，敕 、、 用7〇)·尺寸，使散熱器結構的適 乾圍較廣泛，進而可蟥省散熱器之開發成本。 雖然本新型以前述之實施例揭露如上，铁 新型。在不脫離本新型之精神和範_，所 屬本新型之專利保護範圍。關於本新 均 所附之申請專利範圍。 π之保細園請參考 f圖式簡單說明】 第1圖為本創作第一實施例中散熱器結構之立體示意圖。 13 M319476 第2圖為本創作第一實施例中散熱器結構之分解示意圖。 第3圖為本創作中鰭片之立體示意圖。 第4圖為本創作中散熱鰭片組之分解示意圖。 第5A圖為本創作中散熱鰭片組之立體示意圖。 第5B圖為本創作中散熱鰭片組之立體示意圖。 第6圖為本創作第一實施例中散熱器結構組裝於電路板之 體不意圖。 第7圖為本創作第一實施例中散熱器結構組裝於電路板之立 體不意圖。 第8圖為本創作第二實施例中散熱器結構之分解示意圖。 第9圖為本創作第二實施例中散熱器結構之立體示意圖。 第10圖為本創作第三實施例中散熱器結構之分解示意圖。 第11圖為本創作第三實施例中散熱器結構之立體示意圖。 第12圖為本創作第四實施例中散熱器結構之分解示意圖。 第13圖為本創作第四實施例中散熱器結構之立體示意圖。 【主要元件符號說明】 10.............................熱源 20 .............................導熱塊 21 .............................頂面 22 .............................底面 23 .............................螺孔 30 .............................散熱鰭片組 31 .............................導熱面 14 M319476 32 .............................凹槽 33 .............................環缺槽 34 .............................鰭片 341 ...........................本體部 342 ...........................扣片 343 ...........................扣持部 344 ........... 延伸部 345 ...........................扣孔 346 ...........................缺孔 347 ...........................斜板片 348 ...........................缺口 50 ..........................…間隔件 51 .............................穿孔 60 .............................固定件 61 .............................穿孔 62 .............................螺孔 70 .............................熱導管 71 .............................吸熱段 72 .......................................冷凝段 80.............................散熱風扇 81···.···......................螺固件 90.............................螺固件 電路板 15 100 M319476 101 金屬接腳Therefore, in the second embodiment, the heat energy of the heat source can be transmitted not only to the heat-dissipating group 30 via the heat-conducting block 34, but also to the heat of the air, and the heat energy of the heat source 10 can also be transmitted via the heat-conducting block 2 To the heat pipe %, the heat transfer is performed by the phase change of the working fluid in the heat pipe 70, so that the heat dissipation is more efficiently performed through the two heat dissipation paths, and the heat guide (4) is also disposed in the heat dissipation fin group 30, and It does not conflict with circuit components around the heat sink structure. Please refer to the "Example 1" and "Figure 11" for the third embodiment provided for the creation of the crying structure. The third embodiment is added to the frame of the first embodiment. - The cooling fan 8G 'The cooling fan (10) is assembled on the fixing member (6), for example, the member 81 passes through the cooling fan 8 and is screwed into the screw hole, and the cooling fan 8 is located in the recess 32 of the political fin group 30. in. The cooling fan 8 is used to drive and generate 1 through the surface of each fin, forming forced convection to increase the throughput per unit time, and improving the heat exchange efficiency between the fin 34 and the air, == heat dissipation effect of the chip set 30 . Moreover, the heat dissipating fan 8〇 is disposed in the lying, and, and 30, effectively controlling the longitudinal direction of the heat sink structure (such as the “Fig. 6” 12 M319476 vertical Γ 板 1 GG direction) height, which not only increases the heat dissipation efficiency. It will not affect the original space advantage of the radiator structure. Please refer to the "12th" and "13th" drawings for the fourth embodiment provided for the structure of the heat sink. The fourth embodiment is enhanced in the structure of the second embodiment - The cooling fan 80, that is, the second embodiment of the present invention and the third embodiment-example are integrated and utilized, and the setting manners of the Lizhong, the V, the Vs 70, and the cooling fan 80 are both implemented and the second implementation. The example is the same as the third embodiment, and is not described in detail. In the detailed embodiment, the heat energy of the source K) can be transmitted not only through two heat dissipation paths (the heat pipe % is paid by the cooling fan (4) as a forced gas> melon Through the surface of each,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Control the longitudinal height of the bulk (four) structure without reducing the total heat dissipation surface area, so as to pay for the high heat-generating electronic components. (4) Xiangshang's heat dissipation (four) group 30 _ 3 What are the surrounding obstacles or heat release accessories ( Cooling fan 8〇 and 埶 conduit 7()>, 敕, 7 用)·size, make the radiator structure The invention is applicable to the development cost of the heat sink. Although the present invention is disclosed in the foregoing embodiments, the iron type is novel, and the scope of patent protection of the present invention is not deviated from the spirit and scope of the present invention. The scope of the patent application attached to the new one. Please refer to the simple description of the f-pattern for the π-protected garden. The first picture is a three-dimensional schematic diagram of the heat sink structure in the first embodiment of the creation. 13 M319476 The second picture is the first creation FIG. 3 is a schematic exploded view of the fin assembly of the present invention. FIG. 4 is an exploded view of the heat sink fin set in the present invention. Fig. 5B is a perspective view of the heat sink fin set in the present invention. Fig. 6 is a schematic view of the first embodiment of the heat sink structure assembled on the circuit board. In the example, the heat sink structure is assembled on the circuit board. FIG. 8 is an exploded perspective view of the heat sink structure in the second embodiment of the present invention. FIG. 9 is a heat sink junction in the second embodiment of the present invention. 10 is a schematic exploded view of the heat sink structure in the third embodiment of the present invention. FIG. 11 is a perspective view of the heat sink structure in the third embodiment of the present invention. FIG. 12 is a fourth embodiment of the present invention. Fig. 13 is a perspective view showing the structure of the heat sink in the fourth embodiment of the present invention. [Explanation of main component symbols] 10................. ............heat source 20 .............................thermal block 21 .... .........................Top 22 ...................... .......bottom 23 ............................. screw hole 30 ......... ....................Fixed fin set 31 ......................... .... Thermal surface 14 M319476 32 ............................ Groove 33 ......... .................... ring missing slot 34.............................. ...Fin 341 ........................... Body part 342 .............. .............Buckle 343 ...........................Bucking section 344 ... ........ Extension 345 ........................... buttonhole 346 ......... .................. lack of holes 347. .......................... oblique plate 348 ................... ....... gap 50 .............................spacer 51 ........... ..................Perforation 60 .............................Fixed Pieces 61 .............................Perforation 62 ................ ............Spiral hole 70 .............................heat pipe 71 ... .......................... Endothermic section 72 ..................... .................. Condensation section 80............................. Cooling fan 81·······................... screw firmware 90............... .............. Screw firmware board 15 100 M319476 101 Metal pin
1616