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TW200702620A - Heat dissipation device with heat pipe - Google Patents

Heat dissipation device with heat pipe

Info

Publication number
TW200702620A
TW200702620A TW094124086A TW94124086A TW200702620A TW 200702620 A TW200702620 A TW 200702620A TW 094124086 A TW094124086 A TW 094124086A TW 94124086 A TW94124086 A TW 94124086A TW 200702620 A TW200702620 A TW 200702620A
Authority
TW
Taiwan
Prior art keywords
heat pipe
heat
base
dissipation device
heat dissipation
Prior art date
Application number
TW094124086A
Other languages
Chinese (zh)
Other versions
TWI265267B (en
Inventor
Chun-Chi Chen
Shi-Wen Zhou
Meng Fu
Dong-Bo Zheng
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94124086A priority Critical patent/TWI265267B/en
Application granted granted Critical
Publication of TWI265267B publication Critical patent/TWI265267B/en
Publication of TW200702620A publication Critical patent/TW200702620A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device with heat pipe includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a bent first portion and a second portion substantially parallel to a plane where the first portion is in. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is remote from the base, and thermally engages with the plurality of fins. The heat dissipation device of the present invention has large contacting area between the heat pipe and the base, thereby more heat can being rapidly transferred to the fins by the heat pipe.
TW94124086A 2005-07-15 2005-07-15 Heat dissipation device with heat pipe TWI265267B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94124086A TWI265267B (en) 2005-07-15 2005-07-15 Heat dissipation device with heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94124086A TWI265267B (en) 2005-07-15 2005-07-15 Heat dissipation device with heat pipe

Publications (2)

Publication Number Publication Date
TWI265267B TWI265267B (en) 2006-11-01
TW200702620A true TW200702620A (en) 2007-01-16

Family

ID=38122154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94124086A TWI265267B (en) 2005-07-15 2005-07-15 Heat dissipation device with heat pipe

Country Status (1)

Country Link
TW (1) TWI265267B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8002019B2 (en) 2008-03-20 2011-08-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
TWI603046B (en) * 2015-10-09 2017-10-21 黃崇賢 Heat sink assemblyr

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8002019B2 (en) 2008-03-20 2011-08-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
TWI603046B (en) * 2015-10-09 2017-10-21 黃崇賢 Heat sink assemblyr

Also Published As

Publication number Publication date
TWI265267B (en) 2006-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees