TW200721953A - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- TW200721953A TW200721953A TW094141537A TW94141537A TW200721953A TW 200721953 A TW200721953 A TW 200721953A TW 094141537 A TW094141537 A TW 094141537A TW 94141537 A TW94141537 A TW 94141537A TW 200721953 A TW200721953 A TW 200721953A
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- heat
- heat dissipation
- dissipation device
- electronic unit
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 4
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device for an electronic unit comprises a base for contacting with the electronic unit, a plate spaced from the base, a plurality of fins arranged between the base and the plate, a first heat pipe and a second heat pipe. The first heat pipe has a first end attached to the base and a second end connected with the fins. Accordingly, heat generated by the electronic unit can be quickly absorbed by the base and distributed evenly over the base. Therefore, the first and second heat pipes together mounted to the heat sink increase heat dissipation efficiency of the heat dissipation device greatly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94141537A TWI294763B (en) | 2005-11-25 | 2005-11-25 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94141537A TWI294763B (en) | 2005-11-25 | 2005-11-25 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200721953A true TW200721953A (en) | 2007-06-01 |
TWI294763B TWI294763B (en) | 2008-03-11 |
Family
ID=45068240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94141537A TWI294763B (en) | 2005-11-25 | 2005-11-25 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI294763B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104582234A (en) * | 2013-10-12 | 2015-04-29 | 富葵精密组件(深圳)有限公司 | Heat dissipation device, manufacturing method thereof and flexible circuit board with heat dissipation device |
-
2005
- 2005-11-25 TW TW94141537A patent/TWI294763B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI294763B (en) | 2008-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |