TW200727087A - Lithographic apparatus - Google Patents
Lithographic apparatusInfo
- Publication number
- TW200727087A TW200727087A TW095142513A TW95142513A TW200727087A TW 200727087 A TW200727087 A TW 200727087A TW 095142513 A TW095142513 A TW 095142513A TW 95142513 A TW95142513 A TW 95142513A TW 200727087 A TW200727087 A TW 200727087A
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- substrate
- lithographic apparatus
- removal device
- barrier member
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0277—Electrolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A barrier member is disclosed for use in immersion lithography. The barrier member comprises an extractor assembly on a bottom surface configured to face the substrate. The extractor assembly includes a plate configured to split the space between a liquid removal device and the substrate in two such that a meniscus is formed in an upper channel between the liquid removal device and the plate and below the plate between the plate and the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/274,888 US7656501B2 (en) | 2005-11-16 | 2005-11-16 | Lithographic apparatus |
US11/391,683 US7804577B2 (en) | 2005-11-16 | 2006-03-29 | Lithographic apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200727087A true TW200727087A (en) | 2007-07-16 |
TWI413867B TWI413867B (en) | 2013-11-01 |
Family
ID=37834224
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095142513A TWI413867B (en) | 2005-11-16 | 2006-11-16 | Lithographic apparatus |
TW100122979A TWI486718B (en) | 2005-11-16 | 2006-11-16 | Lithographic apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100122979A TWI486718B (en) | 2005-11-16 | 2006-11-16 | Lithographic apparatus |
Country Status (7)
Country | Link |
---|---|
US (4) | US7804577B2 (en) |
EP (1) | EP1955114B1 (en) |
KR (2) | KR101194325B1 (en) |
CN (1) | CN102156391B (en) |
DE (1) | DE602006019478D1 (en) |
TW (2) | TWI413867B (en) |
WO (1) | WO2007057673A1 (en) |
Cited By (1)
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---|---|---|---|---|
TWI658335B (en) * | 2012-04-10 | 2019-05-01 | 日商尼康股份有限公司 | Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium |
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US7804577B2 (en) * | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
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2006
- 2006-03-29 US US11/391,683 patent/US7804577B2/en not_active Expired - Fee Related
- 2006-11-16 KR KR1020107001243A patent/KR101194325B1/en active IP Right Grant
- 2006-11-16 WO PCT/GB2006/004275 patent/WO2007057673A1/en active Application Filing
- 2006-11-16 EP EP06808564A patent/EP1955114B1/en not_active Not-in-force
- 2006-11-16 DE DE602006019478T patent/DE602006019478D1/en active Active
- 2006-11-16 CN CN2011101156935A patent/CN102156391B/en not_active Expired - Fee Related
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI658335B (en) * | 2012-04-10 | 2019-05-01 | 日商尼康股份有限公司 | Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium |
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US20220113641A1 (en) | 2022-04-14 |
TWI486718B (en) | 2015-06-01 |
US20100321653A1 (en) | 2010-12-23 |
EP1955114B1 (en) | 2011-01-05 |
US7804577B2 (en) | 2010-09-28 |
US20070110213A1 (en) | 2007-05-17 |
DE602006019478D1 (en) | 2011-02-17 |
US8421996B2 (en) | 2013-04-16 |
TW201205203A (en) | 2012-02-01 |
EP1955114A1 (en) | 2008-08-13 |
CN102156391B (en) | 2012-12-05 |
CN102156391A (en) | 2011-08-17 |
TWI413867B (en) | 2013-11-01 |
WO2007057673A1 (en) | 2007-05-24 |
US11209738B2 (en) | 2021-12-28 |
US20200401057A1 (en) | 2020-12-24 |
US11789369B2 (en) | 2023-10-17 |
KR101194325B1 (en) | 2012-10-24 |
KR20100023036A (en) | 2010-03-03 |
KR100968234B1 (en) | 2010-07-06 |
KR20080068138A (en) | 2008-07-22 |
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