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TW200725199A - Sealing-contact type exposure apparatus - Google Patents

Sealing-contact type exposure apparatus

Info

Publication number
TW200725199A
TW200725199A TW095127699A TW95127699A TW200725199A TW 200725199 A TW200725199 A TW 200725199A TW 095127699 A TW095127699 A TW 095127699A TW 95127699 A TW95127699 A TW 95127699A TW 200725199 A TW200725199 A TW 200725199A
Authority
TW
Taiwan
Prior art keywords
substrate
frame
sealing
suction
exposure apparatus
Prior art date
Application number
TW095127699A
Other languages
Chinese (zh)
Other versions
TWI383272B (en
Inventor
Akira Igarashi
Yosuke Taguchi
Original Assignee
Adtec Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adtec Eng Co Ltd filed Critical Adtec Eng Co Ltd
Publication of TW200725199A publication Critical patent/TW200725199A/en
Application granted granted Critical
Publication of TWI383272B publication Critical patent/TWI383272B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Provided is a sealing-contact type exposure apparatus capable of providing high airtightness between photomask and substrate. A frame 3 is mounted outside the peripheral of a substrate 2, and is suction-fixed by suction ports 56. The airtightness between a photomask and the substrate can be increased by the frame 3. Moreover, since the frame 3 is an integral, it can be securely fixed by suction, simply removed, and ready for automation. Flowing passages 30 are formed in an inner side of the frame 3, via which suction of a gap 35 formed between the frame 3 and the substrate 2 is performed, so as to reliably produce the airtightness between the photomask 1 and the substrate 2.
TW095127699A 2005-12-22 2006-07-28 Sealing-contact type exposure apparatus TWI383272B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005370037A JP2007171621A (en) 2005-12-22 2005-12-22 Contact exposure device

Publications (2)

Publication Number Publication Date
TW200725199A true TW200725199A (en) 2007-07-01
TWI383272B TWI383272B (en) 2013-01-21

Family

ID=38184501

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127699A TWI383272B (en) 2005-12-22 2006-07-28 Sealing-contact type exposure apparatus

Country Status (4)

Country Link
JP (1) JP2007171621A (en)
KR (1) KR20070066832A (en)
CN (1) CN1987655A (en)
TW (1) TWI383272B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694540B (en) * 2016-03-01 2020-05-21 日商牛尾電機股份有限公司 Exposure device for printed circuit board

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4651648B2 (en) * 2007-09-12 2011-03-16 日立ビアメカニクス株式会社 Contact exposure method and apparatus
JP4949195B2 (en) * 2007-10-26 2012-06-06 株式会社アドテックエンジニアリング Exposure apparatus and substrate correction apparatus
JP6035670B2 (en) * 2012-08-07 2016-11-30 株式会社ニコン Exposure method, flat panel display manufacturing method, device manufacturing method, and exposure apparatus
KR101451094B1 (en) * 2013-10-04 2014-10-15 주식회사 옵티레이 Close-type exposure apparatus
KR101600810B1 (en) 2014-05-12 2016-03-08 주식회사 옵티레이 Roll to roll exposure device
CN104076619A (en) * 2014-07-03 2014-10-01 无锡宏纳科技有限公司 Contact type photoetching machine sucking disc
CN104932208B (en) * 2015-07-07 2017-01-18 仓和精密制造(苏州)有限公司 Exposure jig and work process thereof
CN109143791B (en) * 2018-08-29 2020-03-20 中国科学院光电技术研究所 Vacuum attaching device for contact type photoetching of flexible film substrate
JP7239388B2 (en) * 2019-05-09 2023-03-14 株式会社アドテックエンジニアリング Direct exposure system
JP6789368B2 (en) * 2019-12-25 2020-11-25 株式会社アドテックエンジニアリング Exposure equipment for printed circuit boards
CN115623690A (en) * 2022-07-20 2023-01-17 上海美维电子有限公司 Automatic exposure fixing method for printed circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2850061B2 (en) * 1991-04-04 1999-01-27 日立電子エンジニアリング株式会社 Substrate exposure equipment
JP3070012B1 (en) * 1999-07-30 2000-07-24 株式会社オーク製作所 Spacer for exposure equipment
FR2842617B1 (en) * 2002-07-17 2005-01-21 Automa Tech Sa PRINTED CIRCUIT PANEL EXPOSURE MACHINE
JP4192039B2 (en) * 2003-06-06 2008-12-03 株式会社オーク製作所 Exposure method of exposure apparatus
JP4298399B2 (en) * 2003-06-26 2009-07-15 キヤノン株式会社 Electron beam apparatus and electron beam drawing apparatus using the electron beam apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694540B (en) * 2016-03-01 2020-05-21 日商牛尾電機股份有限公司 Exposure device for printed circuit board

Also Published As

Publication number Publication date
JP2007171621A (en) 2007-07-05
KR20070066832A (en) 2007-06-27
TWI383272B (en) 2013-01-21
CN1987655A (en) 2007-06-27

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