Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
  • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
  • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Inorganic Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)

Applications Claiming Priority (1)

Publications (2)

Family

ID=5949067

Family Applications (1)

Country Status (9)

Cited By (1)

Families Citing this family (5)

• 1975
  • 1975-06-13 DE DE2526553A patent/DE2526553C3/de not_active Expired
• 1976
  • 1976-04-14 CH CH473776A patent/CH604344A5/xx not_active IP Right Cessation
  • 1976-04-20 NL NL7604158A patent/NL7604158A/xx not_active Application Discontinuation
  • 1976-05-17 AT AT358776A patent/AT359583B/de not_active IP Right Cessation
  • 1976-05-18 GB GB20417/76A patent/GB1540112A/en not_active Expired
  • 1976-06-04 JP JP51065491A patent/JPS5210569A/ja active Pending
  • 1976-06-09 IT IT24064/76A patent/IT1063970B/it active
  • 1976-06-11 FR FR7617770A patent/FR2314585A1/fr active Granted
  • 1976-06-11 SE SE7606715A patent/SE421852B/xx unknown
• 1981
  • 1981-07-07 JP JP1981100259U patent/JPS5731876U/ja active Pending

Also Published As

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