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PL3191790T3 - Urządzenie do pomiaru zaciśnięcia - Google Patents

Urządzenie do pomiaru zaciśnięcia

Info

Publication number
PL3191790T3
PL3191790T3 PL16767365T PL16767365T PL3191790T3 PL 3191790 T3 PL3191790 T3 PL 3191790T3 PL 16767365 T PL16767365 T PL 16767365T PL 16767365 T PL16767365 T PL 16767365T PL 3191790 T3 PL3191790 T3 PL 3191790T3
Authority
PL
Poland
Prior art keywords
measuring device
crimping
crimping measuring
measuring
Prior art date
Application number
PL16767365T
Other languages
English (en)
Inventor
Luc Sneyders
Original Assignee
Exmore Benelux Bvba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exmore Benelux Bvba filed Critical Exmore Benelux Bvba
Publication of PL3191790T3 publication Critical patent/PL3191790T3/pl

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
    • G01B5/061Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness height gauges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048Crimping apparatus or processes
    • H01R43/0488Crimping apparatus or processes with crimp height adjusting means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70625Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
PL16767365T 2015-12-02 2016-08-31 Urządzenie do pomiaru zaciśnięcia PL3191790T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
BE2015/5778A BE1023160B1 (nl) 2015-12-02 2015-12-02 Krimp meetapparaat
EP16767365.6A EP3191790B1 (en) 2015-12-02 2016-08-31 Crimping measuring device
PCT/IB2016/055190 WO2017093815A1 (en) 2015-12-02 2016-08-31 Crimping measurement device

Publications (1)

Publication Number Publication Date
PL3191790T3 true PL3191790T3 (pl) 2018-06-29

Family

ID=55352954

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16767365T PL3191790T3 (pl) 2015-12-02 2016-08-31 Urządzenie do pomiaru zaciśnięcia

Country Status (9)

Country Link
US (1) US9903706B2 (pl)
EP (1) EP3191790B1 (pl)
JP (1) JP6291630B1 (pl)
CN (1) CN107532876A (pl)
BE (1) BE1023160B1 (pl)
HU (1) HUE038948T2 (pl)
MX (1) MX2017003668A (pl)
PL (1) PL3191790T3 (pl)
WO (1) WO2017093815A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112461081A (zh) * 2020-11-21 2021-03-09 杭州锦航日用品制造有限公司 一种木质工艺品外形尺寸检测装置
CN113048318B (zh) * 2021-04-13 2024-10-22 南京晨光东螺波纹管有限公司 一种在线监测位移的波纹管补偿器及在线监测位移的方法
CN115319540B (zh) * 2022-07-26 2023-08-25 南阳煜众精密机械有限公司 一种在机刀具偏心参数的视觉测量方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5263443U (pl) * 1975-11-05 1977-05-11
JP2645095B2 (ja) * 1988-08-12 1997-08-25 矢崎総業株式会社 バリ高さ測定法及び測定具
US4856186A (en) * 1988-11-04 1989-08-15 Amp Incorporated Apparatus and method for determination of crimp height
US5421101A (en) * 1994-04-14 1995-06-06 Ut Automotive, Inc. Dedicated crimp measuring gauge
JP3379306B2 (ja) * 1995-10-26 2003-02-24 住友電装株式会社 圧着端子のかしめ部測定装置
JPH10332307A (ja) * 1997-05-30 1998-12-18 Mitsuboshi Belting Ltd 歯付ベルトの背厚測定器
EP0964485A1 (en) * 1998-06-11 1999-12-15 The Whitaker Corporation Crimp height measuring device
JP3525072B2 (ja) * 1999-03-15 2004-05-10 矢崎総業株式会社 マイクロメータ
EP1780846B1 (de) * 2005-10-27 2009-03-18 komax Holding AG Messkopf und Verfahren zur Bestimmung der Crimphöhe eines Leitercrimps
US20120263344A1 (en) 2011-04-12 2012-10-18 Stefan Viviroli Measuring apparatus and method for determining at least of the crimp height of a conductor crimp
JP6013847B2 (ja) * 2012-09-14 2016-10-25 矢崎総業株式会社 端子圧着状態の検査方法及びその装置
WO2014129095A1 (ja) * 2013-02-23 2014-08-28 古河電気工業株式会社 接続構造体の製造方法、及び接続構造体の製造装置
CN104457652A (zh) * 2013-09-25 2015-03-25 珠海格力电器股份有限公司 端子压接质量检测装置、方法及端子压接系统

Also Published As

Publication number Publication date
BE1023160B1 (nl) 2016-12-05
EP3191790B1 (en) 2018-03-07
MX2017003668A (es) 2017-10-31
HUE038948T2 (hu) 2018-12-28
US9903706B2 (en) 2018-02-27
US20170307356A1 (en) 2017-10-26
CN107532876A (zh) 2018-01-02
EP3191790A1 (en) 2017-07-19
JP2018507384A (ja) 2018-03-15
JP6291630B1 (ja) 2018-03-14
WO2017093815A1 (en) 2017-06-08

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