NO941963D0 - Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström - Google Patents

Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström

Info

Publication number: NO941963D0
Authority: NO; Norway
Prior art keywords: fuse; well; metal layer; overcurrent; protecting
Prior art date: 1993-05-28

Application number

NO941963A

Other languages

English (en)

Other versions

NO941963L (no

NO306036B1 (no

Inventor

Stefan Lof

Original Assignee

Ericsson Telefon Ab L M

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-05-28

Filing date

1994-05-26

Publication date

1994-05-26

1994-05-26 Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M

1994-05-26 Publication of NO941963D0 publication Critical patent/NO941963D0/no

1994-11-29 Publication of NO941963L publication Critical patent/NO941963L/no

1999-09-06 Publication of NO306036B1 publication Critical patent/NO306036B1/no

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49107—Fuse making

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Fuses (AREA)
Emergency Protection Circuit Devices (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Selective Calling Equipment (AREA)

NO941963A 1993-05-28 1994-05-26 Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström NO306036B1 (no)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SE9301825A SE505448C2 (sv)	1993-05-28	1993-05-28	Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring

Publications (3)

Publication Number	Publication Date
NO941963D0 true NO941963D0 (no)	1994-05-26
NO941963L NO941963L (no)	1994-11-29
NO306036B1 NO306036B1 (no)	1999-09-06

Family

ID=20390084

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO941963A NO306036B1 (no)	1993-05-28	1994-05-26	Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström

Country Status (10)

Country	Link
US (1)	US5543774A (no)
EP (1)	EP0626714B1 (no)
AT (1)	ATE150901T1 (no)
AU (1)	AU672296B2 (no)
DE (1)	DE69402247T2 (no)
DK (1)	DK0626714T3 (no)
ES (1)	ES2102798T3 (no)
FI (1)	FI942492L (no)
NO (1)	NO306036B1 (no)
SE (1)	SE505448C2 (no)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5914648A (en)	1995-03-07	1999-06-22	Caddock Electronics, Inc.	Fault current fusing resistor and method
US5760674A (en) *	1995-11-28	1998-06-02	International Business Machines Corporation	Fusible links with improved interconnect structure
US5699032A (en) *	1996-06-07	1997-12-16	Littelfuse, Inc.	Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5977860A (en) *	1996-06-07	1999-11-02	Littelfuse, Inc.	Surface-mount fuse and the manufacture thereof
US5923239A (en) *	1997-12-02	1999-07-13	Littelfuse, Inc.	Printed circuit board assembly having an integrated fusible link
JP3812865B2 (ja) *	1998-09-21	2006-08-23	矢崎総業株式会社	電気回路の安全装置
US6456186B1 (en) *	1999-10-27	2002-09-24	Motorola, Inc.	Multi-terminal fuse device
GB0001573D0 (en) *	2000-01-24	2000-03-15	Welwyn Components Ltd	Printed circuit board with fuse
US20030048620A1 (en) *	2000-03-14	2003-03-13	Kohshi Nishimura	Printed-circuit board with fuse
DE10143277A1 (de) *	2001-09-04	2003-06-26	Siemens Ag	Schutzschaltung für Kommunikationseinrichtungen
US7385475B2 (en) *	2002-01-10	2008-06-10	Cooper Technologies Company	Low resistance polymer matrix fuse apparatus and method
JP3952271B2 (ja) *	2002-01-31	2007-08-01	富士通株式会社	半導体装置及びその製造方法
GB0307306D0 (en) *	2003-03-29	2003-05-07	Goodrich Control Sys Ltd	Fuse arrangement
PL360332A1 (en) *	2003-05-26	2004-11-29	Abb Sp.Z O.O.	High voltage high breaking capacity thin-layer fusible cut-out
US20070062031A1 (en) *	2003-10-17	2007-03-22	Koninklijke Philips Electronics N.V.	Printed circuit board including a fuse
US7477130B2 (en) *	2005-01-28	2009-01-13	Littelfuse, Inc.	Dual fuse link thin film fuse
TW200929310A (en) *	2007-12-21	2009-07-01	Chun-Chang Yen	Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof
US8525633B2 (en) *	2008-04-21	2013-09-03	Littelfuse, Inc.	Fusible substrate
ES2563170T3 (es) *	2010-07-16	2016-03-11	Schurter Ag	Elemento de fusible
DE102010063832B4 (de) *	2010-12-22	2020-08-13	Tridonic Gmbh & Co Kg	Leiterbahnsicherung, Leiterplatte und Betriebsschaltung für Leuchtmittel mit der Leiterbahnsicherung
US10064266B2 (en) *	2011-07-19	2018-08-28	Whirlpool Corporation	Circuit board having arc tracking protection
US9673012B2 (en) *	2012-05-16	2017-06-06	Littelfuse, Inc.	Low-current fuse stamping method
JP2017204525A (ja) *	2016-05-10	2017-11-16	住友電工プリントサーキット株式会社	フレキシブルプリント配線板及び電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2053881A5 (no) *	1969-07-22	1971-04-16	Avril Jean
IT1092128B (it) *	1977-01-27	1985-07-06	Bosch Gmbh Robert	Dispositivo elettrico di sicurezza per tronchi di piste conduttrici in una disposizione di utilizzatore
US4140988A (en) *	1977-08-04	1979-02-20	Gould Inc.	Electric fuse for small current intensities
US4296398A (en) *	1978-12-18	1981-10-20	Mcgalliard James D	Printed circuit fuse assembly
US4376927A (en) *	1978-12-18	1983-03-15	Mcgalliard James D	Printed circuit fuse assembly
US4394639A (en) *	1978-12-18	1983-07-19	Mcgalliard James D	Printed circuit fuse assembly
JPS5649178U (no) *	1979-09-21	1981-05-01
US4356627A (en) *	1980-02-04	1982-11-02	Amp Incorporated	Method of making circuit path conductors in plural planes
US5476970A (en) *	1984-02-16	1995-12-19	Velsicol Chemical Corporation	Method for preparing aryl ketones
DE3604882A1 (de) *	1986-02-15	1987-08-20	Bbc Brown Boveri & Cie	Leistungshalbleitermodul und verfahren zur herstellung des moduls
JPH0831303B2 (ja) *	1986-12-01	1996-03-27	オムロン株式会社	チツプ型ヒユ−ズ
US5027101A (en) *	1987-01-22	1991-06-25	Morrill Jr Vaughan	Sub-miniature fuse
US5254969A (en) *	1991-04-02	1993-10-19	Caddock Electronics, Inc.	Resistor combination and method
US5166656A (en) *	1992-02-28	1992-11-24	Avx Corporation	Thin film surface mount fuses

1993
- 1993-05-28 SE SE9301825A patent/SE505448C2/sv not_active IP Right Cessation
1994
- 1994-05-26 AU AU63357/94A patent/AU672296B2/en not_active Ceased
- 1994-05-26 NO NO941963A patent/NO306036B1/no not_active IP Right Cessation
- 1994-05-27 ES ES94850094T patent/ES2102798T3/es not_active Expired - Lifetime
- 1994-05-27 FI FI942492A patent/FI942492L/fi unknown
- 1994-05-27 DK DK94850094.7T patent/DK0626714T3/da active
- 1994-05-27 EP EP94850094A patent/EP0626714B1/en not_active Expired - Lifetime
- 1994-05-27 US US08/249,987 patent/US5543774A/en not_active Expired - Lifetime
- 1994-05-27 DE DE69402247T patent/DE69402247T2/de not_active Expired - Fee Related
- 1994-05-27 AT AT94850094T patent/ATE150901T1/de not_active IP Right Cessation

Also Published As

Publication number	Publication date
SE9301825D0 (sv)	1993-05-28
AU672296B2 (en)	1996-09-26
EP0626714A1 (en)	1994-11-30
NO941963L (no)	1994-11-29
DK0626714T3 (da)	1997-10-13
EP0626714B1 (en)	1997-03-26
SE9301825L (sv)	1994-11-29
ATE150901T1 (de)	1997-04-15
FI942492L (fi)	1994-11-29
DE69402247D1 (de)	1997-04-30
NO306036B1 (no)	1999-09-06
DE69402247T2 (de)	1997-07-10
US5543774A (en)	1996-08-06
FI942492A0 (fi)	1994-05-27
SE505448C2 (sv)	1997-09-01
ES2102798T3 (es)	1997-08-01
AU6335794A (en)	1994-12-01

Publication	Publication Date	Title
NO306036B1 (no)	1999-09-06	Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström
TW407438B (en)	2000-10-01	Printed circuit board assembly having an integrated fusible link
US5262594A (en)	1993-11-16	Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
DK0755619T3 (da)	1999-04-12	Arrangement til afskærmning og/eller afkøling af elektroniske komponenter monteret på et kredsløbskort
BR9806147B1 (pt)	2011-10-04	disposição, sobretudo para o emprego em um equipamento de comando eletrÈnico, abrangendo uma placa de circuito impresso e um dissipador térmico e processo para a fabricação de uma disposição.
EP0649699A3 (en)	1995-07-12	Method, device for soldering electronic assemblies on printed circuit boards, assembling these assemblies and printed circuit boards contained by soldering.
ES2038349T3 (es)	1993-07-16	Placa de circuito impreso con un dispositivo de refrigeracion.
US5099219A (en)	1992-03-24	Fusible flexible printed circuit and method of making same
BR9807975A (pt)	2000-03-08	Composição de solda, solda, utilização de uma solda, método de união de dois ou mais componentes e componente eletrônico ou placa de circuito impresso
DE69620273D1 (de)	2002-05-02	Verfahren zur Herstellung von Abstandshaltern auf einer elektrischen Leiterplatte
DE69016564D1 (de)	1995-03-16	Antistatisches Klebeband.
ES2128450T3 (es)	1999-05-16	Subconjunto electrico.
ATE117869T1 (de)	1995-02-15	Mischleiterplatten und verfahren zu ihrer herstellung.
DE69201823D1 (de)	1995-05-04	Verbesserte Gleichförmigkeit beim Kupferätzen bei der Herstellung von mehrschichtig gedruckten Schaltungsplatinen.
JP2007508706A (ja)	2007-04-05	ヒューズを含むプリント回路基板
EP1667502A3 (en)	2007-07-25	Printed wiring board and method of manufacturing the same
GB2324753B (en)	1999-09-01	Printed circuit and printed wiring boards and methods of manufacture
EP0711105A3 (en)	1998-10-14	Method of forming solder mask
SE9801528D0 (sv)	1998-04-30	Mönsterkort och metod för bearbetning av mönsterkort
WO1999034657A3 (de)	1999-10-21	Hybridschaltung mit einem system zur wärmeableitung
McGrath	1998	Multilayer PCB Manufacture
JPS5980987A (ja)	1984-05-10	印刷配線板
IT8921715A0 (it)	1989-09-14	Apparecchiatura per rilevare il posizionamento appropriato di terminali elettrici, in particolare terminali di componenti elettronici su schede, pannelli di circuiti stampati e/o simili.
JPS5980986A (ja)	1984-05-10	印刷配線板
JPS63211691A (ja)	1988-09-02	プリント基板

Legal Events

Date	Code	Title	Description
2002-01-02	MM1K	Lapsed by not paying the annual fees	Free format text: LAPSED IN NOVEMBER 2001