[go: up one dir, main page]

ATE150901T1 - Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung - Google Patents

Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung

Info

Publication number
ATE150901T1
ATE150901T1 AT94850094T AT94850094T ATE150901T1 AT E150901 T1 ATE150901 T1 AT E150901T1 AT 94850094 T AT94850094 T AT 94850094T AT 94850094 T AT94850094 T AT 94850094T AT E150901 T1 ATE150901 T1 AT E150901T1
Authority
AT
Austria
Prior art keywords
fuse
well
producing
circuit board
metal layer
Prior art date
Application number
AT94850094T
Other languages
English (en)
Inventor
Stefan Loef
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of ATE150901T1 publication Critical patent/ATE150901T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Selective Calling Equipment (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT94850094T 1993-05-28 1994-05-27 Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung ATE150901T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9301825A SE505448C2 (sv) 1993-05-28 1993-05-28 Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring

Publications (1)

Publication Number Publication Date
ATE150901T1 true ATE150901T1 (de) 1997-04-15

Family

ID=20390084

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94850094T ATE150901T1 (de) 1993-05-28 1994-05-27 Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung

Country Status (10)

Country Link
US (1) US5543774A (de)
EP (1) EP0626714B1 (de)
AT (1) ATE150901T1 (de)
AU (1) AU672296B2 (de)
DE (1) DE69402247T2 (de)
DK (1) DK0626714T3 (de)
ES (1) ES2102798T3 (de)
FI (1) FI942492L (de)
NO (1) NO306036B1 (de)
SE (1) SE505448C2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914648A (en) 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
US5760674A (en) * 1995-11-28 1998-06-02 International Business Machines Corporation Fusible links with improved interconnect structure
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
JP3812865B2 (ja) * 1998-09-21 2006-08-23 矢崎総業株式会社 電気回路の安全装置
US6456186B1 (en) * 1999-10-27 2002-09-24 Motorola, Inc. Multi-terminal fuse device
GB0001573D0 (en) * 2000-01-24 2000-03-15 Welwyn Components Ltd Printed circuit board with fuse
WO2001069988A1 (fr) * 2000-03-14 2001-09-20 Rohm Co., Ltd. Carte a circuits imprimes comprenant un fusible
DE10143277A1 (de) * 2001-09-04 2003-06-26 Siemens Ag Schutzschaltung für Kommunikationseinrichtungen
US7385475B2 (en) * 2002-01-10 2008-06-10 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
JP3952271B2 (ja) * 2002-01-31 2007-08-01 富士通株式会社 半導体装置及びその製造方法
GB0307306D0 (en) * 2003-03-29 2003-05-07 Goodrich Control Sys Ltd Fuse arrangement
PL360332A1 (en) * 2003-05-26 2004-11-29 Abb Sp.Z O.O. High voltage high breaking capacity thin-layer fusible cut-out
WO2005039256A1 (en) * 2003-10-17 2005-04-28 Koninklijke Philips Electronics N.V. Printed circuit board including a fuse
US7477130B2 (en) * 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
TW200929310A (en) * 2007-12-21 2009-07-01 Chun-Chang Yen Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
DE102010063832B4 (de) * 2010-12-22 2020-08-13 Tridonic Gmbh & Co Kg Leiterbahnsicherung, Leiterplatte und Betriebsschaltung für Leuchtmittel mit der Leiterbahnsicherung
US10064266B2 (en) * 2011-07-19 2018-08-28 Whirlpool Corporation Circuit board having arc tracking protection
EP2850633B1 (de) * 2012-05-16 2018-01-31 Littelfuse, Inc. Prägeverfahren für schwachstromsicherung
JP2017204525A (ja) * 2016-05-10 2017-11-16 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及び電子部品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2053881A5 (de) * 1969-07-22 1971-04-16 Avril Jean
IT1092128B (it) * 1977-01-27 1985-07-06 Bosch Gmbh Robert Dispositivo elettrico di sicurezza per tronchi di piste conduttrici in una disposizione di utilizzatore
US4140988A (en) * 1977-08-04 1979-02-20 Gould Inc. Electric fuse for small current intensities
US4296398A (en) * 1978-12-18 1981-10-20 Mcgalliard James D Printed circuit fuse assembly
US4394639A (en) * 1978-12-18 1983-07-19 Mcgalliard James D Printed circuit fuse assembly
US4376927A (en) * 1978-12-18 1983-03-15 Mcgalliard James D Printed circuit fuse assembly
JPS5649178U (de) * 1979-09-21 1981-05-01
US4356627A (en) * 1980-02-04 1982-11-02 Amp Incorporated Method of making circuit path conductors in plural planes
US5476970A (en) * 1984-02-16 1995-12-19 Velsicol Chemical Corporation Method for preparing aryl ketones
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
US5027101A (en) * 1987-01-22 1991-06-25 Morrill Jr Vaughan Sub-miniature fuse
US5254969A (en) * 1991-04-02 1993-10-19 Caddock Electronics, Inc. Resistor combination and method
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses

Also Published As

Publication number Publication date
EP0626714B1 (de) 1997-03-26
US5543774A (en) 1996-08-06
DE69402247T2 (de) 1997-07-10
SE505448C2 (sv) 1997-09-01
AU6335794A (en) 1994-12-01
DK0626714T3 (da) 1997-10-13
FI942492A7 (fi) 1994-11-29
FI942492L (fi) 1994-11-29
EP0626714A1 (de) 1994-11-30
FI942492A0 (fi) 1994-05-27
AU672296B2 (en) 1996-09-26
NO941963L (no) 1994-11-29
NO941963D0 (no) 1994-05-26
SE9301825D0 (sv) 1993-05-28
NO306036B1 (no) 1999-09-06
ES2102798T3 (es) 1997-08-01
SE9301825L (sv) 1994-11-29
DE69402247D1 (de) 1997-04-30

Similar Documents

Publication Publication Date Title
ATE150901T1 (de) Verfahren zur herstellung einer sicherung für eine leiterplatte und danach hergestellter sicherung
EP0649699A3 (de) Verfahren, Vorrichtung zum Löten von elektronischen Baugruppen auf Leiterplatten, Zusammensetzen von diesen Baugruppen und durch Löten enthaltene Leiterplatten.
DE59300832D1 (de) Verfahren zur Durchkontaktierung von zweilagigen Leiterplatten und Multilayern.
DE3060057D1 (en) Method of making a multi-layer glass-ceramic structure having copper-based internal conductors
DE69930686D1 (de) Verfahren zur Herstellung der mehrschichtigen Leiterplatte
DE19980206T1 (de) Wärmebeständige Isolationsschicht, Grundplatte für eine Leiterplatte unter Verwendung dieser und Verfahren zur Herstellung der Leiterplatte
WO2003015483A1 (en) Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil
EP0297236A3 (de) Leiterplatte
EP1035760A3 (de) Interlaminarer Isolierender Klebstoff für mehrschichtige gedruckte Leiterplatte
DE69620273D1 (de) Verfahren zur Herstellung von Abstandshaltern auf einer elektrischen Leiterplatte
DE3585729D1 (de) Verfahren zur herstellung einer keramischen mehrschichtleiterplatte mit kupfermetallisierung.
ATE117869T1 (de) Mischleiterplatten und verfahren zu ihrer herstellung.
DE3586422D1 (de) Elektrisch leitende kupferschichten und verfahren zur herstellung derselben.
DE69201823D1 (de) Verbesserte Gleichförmigkeit beim Kupferätzen bei der Herstellung von mehrschichtig gedruckten Schaltungsplatinen.
DE69730288D1 (de) Verfahren zur Herstellung gedruckter Leiterplatten mit plattierten Widerständen
EP1667502A3 (de) Leiterplatte und Verfahren zu ihrer Herstellung
EP0711105A3 (de) Verfahren zur Herstellung einer Lötstopmaske
EP3337301A1 (de) Verfahren zur herstellung eines led-moduls
JPS6489588A (en) Manufacture of pc board
ATE34783T1 (de) Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen; sowie durchkontaktierte leiterplatte.
DE3501372A1 (de) Substrat fuer leiterplatten
WO1999034657A3 (de) Hybridschaltung mit einem system zur wärmeableitung
JPH0563370A (ja) 多層プリント配線板
Huschkta New base materials for future printed circuit boards
Sutcliffe et al. Method for manufacture of printed circuit boards

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee