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NL1024248C2 - Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten. - Google Patents

Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten. Download PDF

Info

Publication number
NL1024248C2
NL1024248C2 NL1024248A NL1024248A NL1024248C2 NL 1024248 C2 NL1024248 C2 NL 1024248C2 NL 1024248 A NL1024248 A NL 1024248A NL 1024248 A NL1024248 A NL 1024248A NL 1024248 C2 NL1024248 C2 NL 1024248C2
Authority
NL
Netherlands
Prior art keywords
carrier
encapsulating material
electronic component
electronic components
mold
Prior art date
Application number
NL1024248A
Other languages
English (en)
Dutch (nl)
Inventor
Franciscus Bernardus Ant Vries
Hendrikus Johannes Bern Peters
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1024248A priority Critical patent/NL1024248C2/nl
Priority to CN2004800298138A priority patent/CN1868048B/zh
Priority to KR1020067004824A priority patent/KR20060119943A/ko
Priority to JP2006526035A priority patent/JP2007505491A/ja
Priority to PCT/NL2004/000601 priority patent/WO2005043612A1/en
Priority to TW093126868A priority patent/TWI360187B/zh
Priority to MYPI20043635A priority patent/MY154814A/en
Application granted granted Critical
Publication of NL1024248C2 publication Critical patent/NL1024248C2/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
NL1024248A 2003-09-09 2003-09-09 Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten. NL1024248C2 (nl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL1024248A NL1024248C2 (nl) 2003-09-09 2003-09-09 Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten.
CN2004800298138A CN1868048B (zh) 2003-09-09 2004-08-30 使用柔性压力元件来密封电子部件的方法和装置
KR1020067004824A KR20060119943A (ko) 2003-09-09 2004-08-30 인캡슐런트를 이용한 부분 캡슐화 방법 및 장치
JP2006526035A JP2007505491A (ja) 2003-09-09 2004-08-30 可撓性圧力素子を用いて電子部品をカプセル封入する方法および装置
PCT/NL2004/000601 WO2005043612A1 (en) 2003-09-09 2004-08-30 Method and device for encapsulating electronic components using a flexible pressure element
TW093126868A TWI360187B (en) 2003-09-09 2004-09-06 Method and device for encapsulating electronic com
MYPI20043635A MY154814A (en) 2003-09-09 2004-09-08 Method and device for encapsulating electronic components using a flexible pressure element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1024248A NL1024248C2 (nl) 2003-09-09 2003-09-09 Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten.
NL1024248 2003-09-09

Publications (1)

Publication Number Publication Date
NL1024248C2 true NL1024248C2 (nl) 2005-03-10

Family

ID=34464875

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1024248A NL1024248C2 (nl) 2003-09-09 2003-09-09 Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten.

Country Status (7)

Country Link
JP (1) JP2007505491A (zh)
KR (1) KR20060119943A (zh)
CN (1) CN1868048B (zh)
MY (1) MY154814A (zh)
NL (1) NL1024248C2 (zh)
TW (1) TWI360187B (zh)
WO (1) WO2005043612A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102335853B1 (ko) * 2014-01-14 2021-12-07 아피쿠 야마다 가부시키가이샤 수지 몰드 금형 및 수지 몰드 방법
NL2015091B1 (en) * 2015-07-06 2017-01-30 Besi Netherlands Bv Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
DE102017131110B4 (de) * 2017-12-22 2025-01-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren und formwerkzeug zum einbetten von optoelektronischen bauelementen in eine schicht

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0726598A1 (en) * 1995-02-09 1996-08-14 Fico B.V. Moulding apparatus with compensation element
EP0753888A2 (en) * 1995-07-11 1997-01-15 " 3P" Licensing B.V. Method for encapsulating an electronic component and article obtained thereby
JPH1075040A (ja) * 1996-08-30 1998-03-17 Toshiba Chem Corp 樹脂被覆回路基板の製造方法
US5958466A (en) * 1997-06-04 1999-09-28 Ipac, Inc. Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
WO2003028086A1 (en) * 2001-09-26 2003-04-03 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip and/or other article

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
US6081997A (en) * 1997-08-14 2000-07-04 Lsi Logic Corporation System and method for packaging an integrated circuit using encapsulant injection
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
JP2002009096A (ja) * 2000-06-20 2002-01-11 Apic Yamada Corp 樹脂封止方法及び樹脂封止装置
KR100400496B1 (ko) * 2001-12-13 2003-10-08 서화일 멀티 플립칩의 언더필 인캡슐레이션 공정용 몰드
US6844606B2 (en) * 2002-02-04 2005-01-18 Delphi Technologies, Inc. Surface-mount package for an optical sensing device and method of manufacture

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0726598A1 (en) * 1995-02-09 1996-08-14 Fico B.V. Moulding apparatus with compensation element
EP0753888A2 (en) * 1995-07-11 1997-01-15 " 3P" Licensing B.V. Method for encapsulating an electronic component and article obtained thereby
JPH1075040A (ja) * 1996-08-30 1998-03-17 Toshiba Chem Corp 樹脂被覆回路基板の製造方法
US5958466A (en) * 1997-06-04 1999-09-28 Ipac, Inc. Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
WO2003028086A1 (en) * 2001-09-26 2003-04-03 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip and/or other article

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08 30 June 1998 (1998-06-30) *

Also Published As

Publication number Publication date
CN1868048B (zh) 2011-06-01
TW200514175A (en) 2005-04-16
MY154814A (en) 2015-07-31
JP2007505491A (ja) 2007-03-08
TWI360187B (en) 2012-03-11
CN1868048A (zh) 2006-11-22
KR20060119943A (ko) 2006-11-24
WO2005043612A1 (en) 2005-05-12

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Legal Events

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PD2B A search report has been drawn up
SD Assignments of patents

Effective date: 20131017

TD Modifications of names of proprietors of patents

Effective date: 20131017

MM Lapsed because of non-payment of the annual fee

Effective date: 20211001