KR970053789A - 반도체 장치의 보호 소자 - Google Patents
반도체 장치의 보호 소자 Download PDFInfo
- Publication number
- KR970053789A KR970053789A KR1019950068225A KR19950068225A KR970053789A KR 970053789 A KR970053789 A KR 970053789A KR 1019950068225 A KR1019950068225 A KR 1019950068225A KR 19950068225 A KR19950068225 A KR 19950068225A KR 970053789 A KR970053789 A KR 970053789A
- Authority
- KR
- South Korea
- Prior art keywords
- region
- semiconductor device
- type
- substrate
- gate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/711—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
- H10D89/713—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements including a PNP transistor and a NPN transistor, wherein each of said transistors has its base region coupled to the collector region of the other transistor, e.g. silicon controlled rectifier [SCR] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (9)
- 제1도전형의 반도체 기판, 상기 기판 위에 형성되어 있는 절연 게이트, 상기 기판에 상기 게이트에 대하여 양 쪽으로 형성되어 있는 제2도전형의 제1영역, 그리고 상기 제1영역 안에 각각 형성되어 있는 제1도전형의 제2영역을 포함하는 반도체 장치의 보호 소자.
- 제1항에서, 상기 제1영역 중 하나와 그 안의 상기 제2영역은 상기 반도체 장치의 단자와 연결되어 있는 반도체 장치의 보호 소자.
- 제2항에서, 상기 반도체 장치의 단자와 연결되어 있지 않은 상기 제1영역과 그 안의 상기 제2영역은 상기 반도체 장치의 전원과 연결되어 있는 반도체 장치의 보호 소자.
- 제3항에서, 상기 게이트는 접지되어 있는 반도체 장치의 보호 소자.
- 제1항에서, 상기 제1영역 안에 상기 제1영역보다 고농도로 각각 형성되어 있는 제2도전형의 제3영역을 더 포함하는 반도체 장치의 보호 소자.
- 제5항에서, 상기 기판과 상기 제1영역의 경계면에 각각 형성되어 있으며 상기 제1영역보다 고농도인 제2도전형의 제4영역을 더 포함하는 반도체 장치의 보호 소자.
- 제6항에서, 상기 제1도전형은 p형이고, 상기 제2도전형은 n형인 반도체 장치의 보호 소자.
- 제6항에서, 상기 제1도전형은 n형이고, 상기 제2도전형은 p형인 반도체 장치의 보호 소자.
- 제1항에서, 상기 제1영역 및 제2영역은 상기 게이트에 대하여 대칭인 반도체 장치의 보호 소자.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068225A KR100200352B1 (ko) | 1995-12-30 | 1995-12-30 | 반도체 장치의 보호 소자 |
DE19654163A DE19654163B4 (de) | 1995-12-30 | 1996-12-23 | Schutzvorrichtung für eine Halbleiterschaltung |
JP35082996A JP3590706B2 (ja) | 1995-12-30 | 1996-12-27 | 半導体装置の保護素子 |
US08/774,618 US5844280A (en) | 1995-12-30 | 1996-12-30 | Device for protecting a semiconductor circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950068225A KR100200352B1 (ko) | 1995-12-30 | 1995-12-30 | 반도체 장치의 보호 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970053789A true KR970053789A (ko) | 1997-07-31 |
KR100200352B1 KR100200352B1 (ko) | 1999-06-15 |
Family
ID=19447983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950068225A KR100200352B1 (ko) | 1995-12-30 | 1995-12-30 | 반도체 장치의 보호 소자 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5844280A (ko) |
JP (1) | JP3590706B2 (ko) |
KR (1) | KR100200352B1 (ko) |
DE (1) | DE19654163B4 (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW399337B (en) * | 1998-06-09 | 2000-07-21 | Koninkl Philips Electronics Nv | Semiconductor device |
US6365924B1 (en) * | 1998-06-19 | 2002-04-02 | National Semiconductor Corporation | Dual direction over-voltage and over-current IC protection device and its cell structure |
US7327541B1 (en) * | 1998-06-19 | 2008-02-05 | National Semiconductor Corporation | Operation of dual-directional electrostatic discharge protection device |
US6236087B1 (en) * | 1998-11-02 | 2001-05-22 | Analog Devices, Inc. | SCR cell for electrical overstress protection of electronic circuits |
US6462380B1 (en) * | 2000-01-21 | 2002-10-08 | Texas Instruments Incorporated | ESD protection circuit for advanced technologies |
US6404038B1 (en) * | 2000-03-02 | 2002-06-11 | The United States Of America As Represented By The Secretary Of The Navy | Complementary vertical bipolar junction transistors fabricated of silicon-on-sapphire utilizing wide base PNP transistors |
US6538266B2 (en) * | 2000-08-11 | 2003-03-25 | Samsung Electronics Co., Ltd. | Protection device with a silicon-controlled rectifier |
US7067852B1 (en) * | 2000-09-12 | 2006-06-27 | National Semiconductor Corporation | Electrostatic discharge (ESD) protection structure |
TW530405B (en) * | 2000-10-16 | 2003-05-01 | Koninkl Philips Electronics Nv | Integrated circuit provided with overvoltage protection and method for manufacture thereof |
US6730967B2 (en) * | 2001-05-24 | 2004-05-04 | Winbond Electronics Corp. | Electrostatic discharge protection devices and methods for the formation thereof |
US6784029B1 (en) * | 2002-04-12 | 2004-08-31 | National Semiconductor Corporation | Bi-directional ESD protection structure for BiCMOS technology |
US6861711B2 (en) * | 2003-01-03 | 2005-03-01 | Micrel, Incorporated | Thick gate oxide transistor and electrostatic discharge protection utilizing thick gate oxide transistors |
US6864537B1 (en) | 2003-01-03 | 2005-03-08 | Micrel, Incorporated | Thick gate oxide transistor and electrostatic discharge protection utilizing thick gate oxide transistors |
US6888710B2 (en) * | 2003-01-03 | 2005-05-03 | Micrel, Incorporated | Insulated gate bipolar transistor and electrostatic discharge cell protection utilizing insulated gate bipolar transistors |
JP4176564B2 (ja) * | 2003-06-23 | 2008-11-05 | 株式会社東芝 | ウェハ移載装置及びこれを用いた半導体装置の製造方法 |
US6989572B2 (en) | 2003-07-09 | 2006-01-24 | Semiconductor Components Industries, L.L.C. | Symmetrical high frequency SCR structure |
JP4197660B2 (ja) * | 2004-04-30 | 2008-12-17 | ローム株式会社 | Mosトランジスタおよびこれを備えた半導体集積回路装置 |
JP4495512B2 (ja) * | 2004-05-11 | 2010-07-07 | パナソニック株式会社 | 固体撮像装置 |
WO2006105452A2 (en) * | 2005-03-30 | 2006-10-05 | Sarnoff Europe Bvba | Semiconductor device based on a scr |
US7456441B2 (en) * | 2006-09-15 | 2008-11-25 | Semiconductor Components Industries, Llc | Single well excess current dissipation circuit |
US7514751B2 (en) * | 2007-08-02 | 2009-04-07 | National Semiconductor Corporation | SiGe DIAC ESD protection structure |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3375659B2 (ja) * | 1991-03-28 | 2003-02-10 | テキサス インスツルメンツ インコーポレイテツド | 静電放電保護回路の形成方法 |
EP0629001B1 (en) * | 1993-06-10 | 1998-07-29 | Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Integrated monolithic structure of a vertical bipolar transistor and a vertical MOSFET transistor |
-
1995
- 1995-12-30 KR KR1019950068225A patent/KR100200352B1/ko not_active IP Right Cessation
-
1996
- 1996-12-23 DE DE19654163A patent/DE19654163B4/de not_active Expired - Fee Related
- 1996-12-27 JP JP35082996A patent/JP3590706B2/ja not_active Expired - Fee Related
- 1996-12-30 US US08/774,618 patent/US5844280A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE19654163A1 (de) | 1997-07-03 |
US5844280A (en) | 1998-12-01 |
JPH09199674A (ja) | 1997-07-31 |
DE19654163B4 (de) | 2005-10-06 |
KR100200352B1 (ko) | 1999-06-15 |
JP3590706B2 (ja) | 2004-11-17 |
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