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KR970003772A - 필름 캐리어, 필름 캐리어를 사용한 반도체 장치 및 반도체 소자를 장착하는 방법 - Google Patents

필름 캐리어, 필름 캐리어를 사용한 반도체 장치 및 반도체 소자를 장착하는 방법 Download PDF

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Publication number
KR970003772A
KR970003772A KR1019960024903A KR19960024903A KR970003772A KR 970003772 A KR970003772 A KR 970003772A KR 1019960024903 A KR1019960024903 A KR 1019960024903A KR 19960024903 A KR19960024903 A KR 19960024903A KR 970003772 A KR970003772 A KR 970003772A
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South Korea
Prior art keywords
energy
semiconductor element
film carrier
conductive
insulating layer
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KR1019960024903A
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English (en)
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KR100391022B1 (ko
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가즈오 오우치
쇼지 모리타
아츠시 히노
마사카즈 스기모토
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가마이 고로
니토 덴코 가부시키가이샤
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Publication of KR970003772A publication Critical patent/KR970003772A/ko
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Publication of KR100391022B1 publication Critical patent/KR100391022B1/ko

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Abstract

절연층 및 전도층의 적층에서 외부 기판에 접속되는 전도부와 반도체 소자를 접속시키는 에너지를 공급하기 위한 에너지 도입부를 포함하는 필름 캐리어, 반도체 장치 및 반도체 소자 장착 방법. 본 발명은 반도체 소자의 정교하게 피치되거나 또는 매우 밀집한 배선을 공급할 수 있다. 접속용 에너지가 반도체 소자에 필름 캐리어를 접속하기 위해 에너지 도입부로부터 공급되는 본 발명의 구성은 절연층에 기인한 접속용 에너지의 감쇠가 적어진다는 잇점이 있으며, 접속용 에너지가 전도 회로에 직접 도입되므로, 에너지의 충분한 이용이 가능하고, 쉽고 완전한 반도체 소자 장착이 가능하다.

Description

필름 캐리어, 필름 캐리어를 사용한 반도체 장치 및 반도체 소자를 장착하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 필름 캐리어에 관한 일실시예의 횡단면도, 제2도는 본 발명의 필름 캐리어에 관한 다른 실시예의 횡단면도.

Claims (14)

  1. 절연층과 전도 회로의 적층위에, 외부 기판에 접속되는 전도부와, 반도체 소자를 접속시키는 에너지를 공급하는 에너지 도입부를 포함하는 것을 특징으로 하는 필름 캐리어.
  2. 제1항에 있어서, 반도체 소자가 전도 회로에 직접 접속되는 것을 특징으로 하는 필름 캐리어.
  3. 제1항에 있어서, 외부 기판에 접속되는 전도부, 에너지 도입부, 또는 전도부와 에너지 도입부의 조합은 층의 두께 방향으로 절연층을 관통하는 전도 경로를 갖는것을 특징으로 하는 필름 캐리어.
  4. 제1항에 있어서, 에너지 도입부는 층의 두께 방향으로 절연층을 관통하는 홀의 바닥이 노출되는 전도 회로인 것을 특징으로 하는 필름 캐리어.
  5. 제1항에 있어서, 제2절연층은 전도 회로에 추가로 적층되고, 반도체 소자에 접속하는 전도부는 추가로 형성되고, 에너지 도입부는 에너지가 공급되는 위치가 노출된 전도 회로인 것을 특징으로 하는 필름 캐리어.
  6. 제5항에 있어서, 반도체 소자에 접속하는 전도부는 층의 두께 방향으로 제2절연층을 관통하는 전도 경로를 갖는 것을 특징으로 하는 필름 캐리어.
  7. 제6항에 있어서, 전도 회로는 반도체 소자에 접속하는 전도부의 영역의 50~200%에 대응하는 영역이 노출되는 것을 특징으로 하는 것을 특징으로 하는 필름 캐리어.
  8. 제1항에 있어서, 외부기판에 접속하는 전도부는 반도체 소자가 장착되는 절연층과 전도회로의 적층 영역안에 형성되는 것을 특징으로 하는 필름 캐리어.
  9. 제1항에 있어서, 반도체에 접속하기 위한 에너지는 열, 압력, 초음파 및 이들의 조합으로 구성되는 그룹에서 선택되는 것을 특징으로 하는 필름 캐리어.
  10. 제1항의 필름 캐리어에 장착된 반도체 소자를 포함하는 반도체 장치.
  11. 제1항의 필름 캐리어에 반도체 소자를 장착하는 방법에 있어서, 필름 캐리어의 전도 회로를 반도체 소자의 전극에 접촉하는 단계와, 에너지 도입부에서 반도체 소자에 접속하는 접촉부에 에너지를 인가하는 단계를 포함하고, 그것에 의해 반도체 소자의 전극에 전도 회로를 접속하게 되는 것을 특징으로 하는 반도체 소자 장착 방법.
  12. 제11항에 있어서, 에너지는 열, 압력, 초음파 및 이들의 조합으로 구성되는 그룹에서 선택되는 것을 특징으로 하는 반도체 소자 장착 방법.
  13. 제5항의 필름 캐리어에 반도체 소자를 장착하는 방법에 있어서, 필름 캐리어의 반도체 소자에 접속되는 전도부를 반도체 소자의 전극에 접촉하는 단계와, 반도체 소자에 접촉하는 접촉부에 에너지 도입부로부터의 에너지를 인가하는 단계를 포함하고, 그것에 의해 반도체 소자의 전극에 반도체 소자에 접속된 전도부를 접속하게 되는 것을 특징으로 하는 반도체 소자 장착 방법.
  14. 제13항에 있어서, 에너지가 열, 압력, 초음파 및 이들의 조합으로 구성되는 그룹에서 선택되는 것을 특징으로 하는 반도체 소자 장착 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960024903A 1995-06-30 1996-06-28 필름캐리어,필름캐리어를사용한반도체장치및반도체소자를장착하는방법 KR100391022B1 (ko)

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JP7165792A JP3015712B2 (ja) 1995-06-30 1995-06-30 フィルムキャリアおよびそれを用いてなる半導体装置

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