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KR850006301A - 전자 회로장치용 냉각 시스템 - Google Patents

전자 회로장치용 냉각 시스템 Download PDF

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Publication number
KR850006301A
KR850006301A KR1019850000306A KR850000306A KR850006301A KR 850006301 A KR850006301 A KR 850006301A KR 1019850000306 A KR1019850000306 A KR 1019850000306A KR 850000306 A KR850000306 A KR 850000306A KR 850006301 A KR850006301 A KR 850006301A
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KR
South Korea
Prior art keywords
heat transfer
cooling system
transfer means
refrigerant
flexible contact
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KR1019850000306A
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KR900002213B1 (ko
Inventor
하루히꼬(외 4) 야마모도
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야마모도 다꾸마
후지쓰 가부시끼가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

내용 없음

Description

전자 회로장치용 냉각 시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 냉각시스템의 개략단면도.

Claims (33)

  1. 적어도 하나의 고체전자회로 부품을 갖는 인쇄회로 기판을 갖는 전자회로 장치용 냉각시스템에 있어서, 냉매가 흐르는 통로수단을 포함하는 냉각모듈과, 회로부품으로 부터 방출된 열을 냉매로 전달시키기 위해 냉매의 흐름에 노출되는 제1열전달 수단과, 제1열전달 수단과 회로부품 사이에 유연성 완전접촉을 시켜주기 위해 그들사이에 배치되는 유연성 접촉수단과, 그리고 유연성접촉 수단을 통해 회로부품에 대해 제1열전달 수단을 탄성적으로 눌러주기 위해 제1열전달 수단에 연결되는 탄성수단을 포함하는 것이 특징인 전자회로장치용 냉각시스템.
  2. 제1항에서, 상기 냉각모듈은 열을 회로부품으로부터 유연성 접촉수단과 제1열전달 수단을 통해 냉매로 전달시켜 주기위해 유연성 접촉수단이 제1 및 제2열전달 수단 사이에 위치되는 식으로 회로부품에 고정된 제2열전달 수단을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  3. 제1항에서, 상기 유연성 접촉수단은 제1열전달 수단상에 제공되는 것이 특징인 전자회로 장치용 냉각시스템.
  4. 제2항에서, 상기 유연성 접촉부재는 제2열전달 수단상에 제공되는 것이 특징인 전자회로 장치용 냉각시스템.
  5. 제1항에서, 상기 제1열전달 수단은 높은 열전달 특성을 갖는 제1열전달 판으로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  6. 제2항에서, 상기 제2열전달 수단은 높은 열전달 특성을 갖는 제2열전달 판으로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  7. 제6항에서, 상기 제2열전달판은 회로부품보다 더 큰 판표면을 갖는것이 특징인 전자회로 냉각시스템.
  8. 제1항에서, 상기 유연성 접촉수단은 가열될때 변형되는 열변형 가능재료로 제조된 박판과 같은 부재로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  9. 제1항에서, 상기 유연성 접촉수단은 압축가능 재료로 제조된 박판과 같은 부재로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  10. 제1항에서, 상기 유연성 접촉수단은 가열될때 열압축 가능재료로 제조된 박판과 같은 부재로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  11. 제1항에서, 상기 냉각시스템은 인쇄회로 기판상에 회로부품을 지지하기 위한 수단을 더 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  12. 제1항에서, 상기 유연성 접촉수단은 전기 절연재로 제조된 박판과 같은 부재로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  13. 제1항에서, 상기 냉각시스템은 유연성 접촉수단상에 전기절연층을 더 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  14. 제1항에서, 상기 탄성수단은 제1열전달 수단을 통로수단에 연결시키는 바람통들을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  15. 제13항에서, 상기 냉각모듈은 통로수단에 제공되며, 냉매를 제1열전달 수단을 향해 바람통으로 분출시키도록 바람통들내에 위치된 하나의 노즐구멍을 갖고있는 하나의 노즐을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  16. 제15항에서, 상기 노즐구멍은 그의 내경의 2 내지 4배 이내의 거리로 제1열전달 수단으로 부터 격리되어 있는것이 특징인 전자회로 장치용 냉각시스템.
  17. 제15항에서, 상기 제1열전달 수단은 노즐내경의 3 내지 6배이내인 효율적인 열전달 직경을 갖는 평면열 전달면을 갖는 제1열전달 판으로 구성되는 것이 특징인 전자회로 장치용 냉각시스템.
  18. 제1항에서, 상기 탄성수단은 제1열전달 수단과 통로수단을 전기적으로 연결시키는 격막을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  19. 제1항에서 상기 냉각 모듈은 제1열전달 수단상에 제공되어 냉매의 흐름속에 위치되는 열전달못을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  20. 제19항에서, 상기 못은 그의 주변에 열냉각 날개들을 갖고있는 것이 특징인 전자회로 장치용 냉각시스템.
  21. 제6항에서, 상기 제2열전달판은 상기 회로부품을 갖고 있는 밀봉패케이지의 일부분을 형성하는 것이 특징인 전자회로 장치용 냉각시스템.
  22. 제1항에서, 상기 회로부품은 인쇄회로 기판에 직접 접착된 노출된 칩인것이 특징인 전자회로 장치용 냉각시스템.
  23. 제14항에서, 상기 탄성수단은 바람통들과 함께 제1열전달 수단에 압력을 제공해 주기위해 바람통들내에 스프링을 더 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  24. 제5항에서, 상기 제1열전달판은 냉매에 노출되며 또한 열전달 표면의 표면적을 증가시키기 위한 볼록-오목 윤곽을 갖고있는 열전달 표면을 갖는것이 특징인 전자회로 장치용 냉각시스템.
  25. 제1항에서, 상기 유연성 접촉부재는 높은 열전도성을 갖는 탄성박판으로 제조되는 것이 특징인 전자회로 장치용 냉각시스템.
  26. 제14항에서, 상기 탄성수단은 바람통들과 함께 제1열전달 수단에 압력을 인가시키기 위한 수압수단을 더 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  27. 제18항에서, 상기 탄성수단은 제1열전달 수단에 압력을 인가하기 위한 수압수단을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  28. 제2항에서, 상기 제1열전달 수단과 제2열전달 수단은 탄성수단에 의해 유연성 접촉수단을 통해 상호 연속적으로 접촉되는 것이 특징인 전자회로 장치용 냉각시스템.
  29. 제1항에서, 상기 냉매는 액체인 것이 특징인 전자회로 장치용 냉각시스템.
  30. 제1항에서, 상기 냉매는 가스인 것이 특징인 전자회로 장치용 냉각시스템.
  31. 전자회로 부품들을 갖고있는 인쇄호로 기판을 갖는 전자회로 장치용 냉각시스템에 있어서, 대응하는 회로부품들과 냉매가 흐르는 공통통로 수단에 대한 일력의 냉각모듈들로서 각 냉각모듈이 대응회로 부품으로부터 방출된 열을 냉매로 전달시키기 위해 냉매의 흐름에 노출된 제1열전달 수단을 포함하는 일련의 냉각모듈과, 제1열전달 수단과 대응회로 부품간에 유연한 완전접촉이 되도록 그들 사이에 제공되는 유연성 접촉수단과,그리고 제1열전달 수단을 유연성 접촉수단을 통해 대응회로 부품에 단성적으로 압축시켜 주기위해 제1열전달 수단에연결되는 탄성수단을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  32. 제31항에서, 상기 각 냉각모듈은 열을 회로부품으로 부터 유연성 접촉수단과 제1열전달 수단을 통하여 냉매로 전달하기 위해 유연성 접촉부재가 제1 및 제2열전단 수단사이에 위치되도록 대응회로 부품에 고정된 제2열전달 수단을 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
  33. 제29항에서, 상기 냉각시스템은 냉각모듈들 주위에 열전달 가스를 봉함하기 위한 수단을 더 포함하는 것이 특징인 전자회로 장치용 냉각시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850000306A 1984-01-26 1985-01-19 전자회로장치용 냉각시스템 Expired KR900002213B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-013004 1984-01-26
JP59013004A JPS60160149A (ja) 1984-01-26 1984-01-26 集積回路装置の冷却方式

Publications (2)

Publication Number Publication Date
KR850006301A true KR850006301A (ko) 1985-10-02
KR900002213B1 KR900002213B1 (ko) 1990-04-04

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KR1019850000306A Expired KR900002213B1 (ko) 1984-01-26 1985-01-19 전자회로장치용 냉각시스템

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Country Link
US (1) US4729060A (ko)
EP (1) EP0151068B1 (ko)
JP (1) JPS60160149A (ko)
KR (1) KR900002213B1 (ko)
AU (1) AU550620B2 (ko)
BR (1) BR8500354A (ko)
CA (1) CA1228173A (ko)
DE (1) DE3572909D1 (ko)
ES (1) ES8606773A1 (ko)

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JPH0315341B2 (ko) 1991-02-28
JPS60160149A (ja) 1985-08-21
AU550620B2 (en) 1986-03-27
ES539841A0 (es) 1986-04-16
BR8500354A (pt) 1985-09-10
EP0151068B1 (en) 1989-09-06
KR900002213B1 (ko) 1990-04-04
EP0151068A2 (en) 1985-08-07
EP0151068A3 (en) 1985-09-18
DE3572909D1 (en) 1989-10-12
AU3794485A (en) 1985-08-01
CA1228173A (en) 1987-10-13
US4729060A (en) 1988-03-01
ES8606773A1 (es) 1986-04-16

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