KR950012710A - 반도체 집적회로장치 - Google Patents
반도체 집적회로장치 Download PDFInfo
- Publication number
- KR950012710A KR950012710A KR1019940027634A KR19940027634A KR950012710A KR 950012710 A KR950012710 A KR 950012710A KR 1019940027634 A KR1019940027634 A KR 1019940027634A KR 19940027634 A KR19940027634 A KR 19940027634A KR 950012710 A KR950012710 A KR 950012710A
- Authority
- KR
- South Korea
- Prior art keywords
- current path
- semiconductor layer
- region
- substrate
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract 8
- 230000006798 recombination Effects 0.000 claims abstract 6
- 238000000926 separation method Methods 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Abstract
Description
Claims (3)
- 반도체 기체(1)와, 이 기체(1)내에 형성되고 전류경로(A)를 상기 기체(1)의 깊은 영역에 설정한 제1소자(7), 상기 기체(1)내에 형성되고 전류경로(B)를 상기 기체 (1)의 얕은 영역에 설정한 제2소자(9)를 구비하고, 상기 깊은 영역에 생성 재결합 중심층(10)을 설치한 것을 특징으로 하는 반도체 집적회로장치.
- 제1항에 있어서, 상기 기체(1)는 제1도전형의 제1반도체층(2)과, 이 제1반도체층(2)상에 형성된 제2도전형의 제2반도체층(3), 이 제2반도체층(3)을 적어도 2개의 제1, 제2섬형상 영역(5,6)으로 분리하는 분리영역(4)을 포함하고, 상기 제1소자(7)의 전류경로(A)는 상기 제1섬형상 영역(5)내 및 상기 제1반도체층(2)내에 설정되며, 상기 제2소자(9)의 전류경로(B)는 상기 제2섬형상 영역(6)내에 설정되고,상기 생성 재결합 중심층(10)은 상기 제1반도체층(2)내에 설치되어 있는 것을 특징으로 하는 반도체 집적회로 장치.
- 제1항에 있어서, 상기 기체(1)는 제1도전형의 제1반도체층(2)과, 이 제1반도체층(2)상에 형성된 제2도전형의 제2반도체층(3), 이들 제1반도체층 및 제2반도체층(2,3)에 의해 구성되는 적층 반도체 구조부를 적어도 2개의 제1, 제2섬형상 영역(5,6)으로 분리하는 분리영역(4)을 포함하고, 상기 제1소자(7)의 전류경로(A)는 상기 제1섬형상 영역(5)내 및 상기 제1반도체층내에 설정되며, 상기 제2소자(9)의 전류경로(B)는 상기 제2섬형상 영역(7)내에 설정되고, 상기 생성 재결합 중심층(10)은 상기 제1반도체층(2)내에 설치되어 있는 것을 특징으로 하는 반도체 집적회로장치.※ 참고사항 : 최초출원 내용 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-272478 | 1993-10-29 | ||
JP05272478A JP3135762B2 (ja) | 1993-10-29 | 1993-10-29 | 半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950012710A true KR950012710A (ko) | 1995-05-16 |
KR0179680B1 KR0179680B1 (ko) | 1999-03-20 |
Family
ID=17514489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940027634A KR0179680B1 (ko) | 1993-10-29 | 1994-10-27 | 반도체 집적회로장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5512777A (ko) |
EP (1) | EP0651442B1 (ko) |
JP (1) | JP3135762B2 (ko) |
KR (1) | KR0179680B1 (ko) |
DE (1) | DE69430939T2 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3372171B2 (ja) * | 1995-08-29 | 2003-01-27 | 東芝マイクロエレクトロニクス株式会社 | 半導体装置 |
US5798538A (en) * | 1995-11-17 | 1998-08-25 | International Rectifier Corporation | IGBT with integrated control |
US5767561A (en) * | 1997-05-09 | 1998-06-16 | Lucent Technologies Inc. | Integrated circuit device with isolated circuit elements |
KR100319615B1 (ko) * | 1999-04-16 | 2002-01-09 | 김영환 | 반도체 장치에서의 소자격리방법 |
DE10014659C2 (de) * | 2000-03-24 | 2002-08-01 | Infineon Technologies Ag | Halbleiterschaltungsanordnung und entsprechende Herstellungsverfahren |
JP4750933B2 (ja) | 2000-09-28 | 2011-08-17 | 株式会社東芝 | 薄型パンチスルー型パワーデバイス |
US6975015B2 (en) * | 2003-12-03 | 2005-12-13 | International Business Machines Corporation | Modulated trigger device |
JP2006245489A (ja) | 2005-03-07 | 2006-09-14 | Toshiba Corp | 半導体装置 |
JP5463698B2 (ja) * | 2009-03-12 | 2014-04-09 | 富士電機株式会社 | 半導体素子、半導体装置および半導体素子の製造方法 |
JP5282822B2 (ja) * | 2009-09-07 | 2013-09-04 | トヨタ自動車株式会社 | ダイオード領域とigbt領域を有する半導体基板を備える半導体装置 |
US20110260245A1 (en) * | 2010-04-23 | 2011-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cost Effective Global Isolation and Power Dissipation For Power Integrated Circuit Device |
US9362349B2 (en) * | 2012-06-21 | 2016-06-07 | Infineon Technologies Ag | Semiconductor device with charge carrier lifetime reduction means |
US20130341673A1 (en) * | 2012-06-21 | 2013-12-26 | Infineon Technologies Ag | Reverse Conducting IGBT |
US9214521B2 (en) * | 2012-06-21 | 2015-12-15 | Infineon Technologies Ag | Reverse conducting IGBT |
CN113921395A (zh) * | 2021-10-13 | 2022-01-11 | 南瑞联研半导体有限责任公司 | 一种低损耗igbt芯片集电极结构及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2138275A1 (en) * | 1971-05-21 | 1973-01-05 | Comp Generale Electricite | Reducing the lifetime of carriers - in logic circuits attached to analogue circuits |
US4053925A (en) * | 1975-08-07 | 1977-10-11 | Ibm Corporation | Method and structure for controllng carrier lifetime in semiconductor devices |
JPS63254762A (ja) * | 1987-04-13 | 1988-10-21 | Nissan Motor Co Ltd | Cmos半導体装置 |
JPH0821678B2 (ja) * | 1987-05-29 | 1996-03-04 | 日産自動車株式会社 | 半導体装置 |
JPH0821679B2 (ja) * | 1987-07-03 | 1996-03-04 | 日産自動車株式会社 | 半導体装置 |
US4881115A (en) * | 1987-12-28 | 1989-11-14 | Motorola Inc. | Bipolar semiconductor device having a conductive recombination layer |
-
1993
- 1993-10-29 JP JP05272478A patent/JP3135762B2/ja not_active Expired - Fee Related
-
1994
- 1994-10-27 KR KR1019940027634A patent/KR0179680B1/ko not_active IP Right Cessation
- 1994-10-28 US US08/328,785 patent/US5512777A/en not_active Expired - Fee Related
- 1994-10-28 DE DE69430939T patent/DE69430939T2/de not_active Expired - Fee Related
- 1994-10-28 EP EP94117090A patent/EP0651442B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69430939D1 (de) | 2002-08-14 |
KR0179680B1 (ko) | 1999-03-20 |
US5512777A (en) | 1996-04-30 |
JPH07130865A (ja) | 1995-05-19 |
DE69430939T2 (de) | 2003-01-23 |
EP0651442B1 (en) | 2002-07-10 |
JP3135762B2 (ja) | 2001-02-19 |
EP0651442A1 (en) | 1995-05-03 |
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