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KR930002816B1 - 리드프레임의 가공방법 - Google Patents

리드프레임의 가공방법 Download PDF

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Publication number
KR930002816B1
KR930002816B1 KR1019890017849A KR890017849A KR930002816B1 KR 930002816 B1 KR930002816 B1 KR 930002816B1 KR 1019890017849 A KR1019890017849 A KR 1019890017849A KR 890017849 A KR890017849 A KR 890017849A KR 930002816 B1 KR930002816 B1 KR 930002816B1
Authority
KR
South Korea
Prior art keywords
plating
lead
circuit pattern
lead frame
dam bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019890017849A
Other languages
English (en)
Korean (ko)
Other versions
KR900010984A (ko
Inventor
미쓰하루 시미즈
미쓰히로 비야자와
Original Assignee
신고오 덴기 고오교오 가부시끼가이샤
이노우에 사다오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신고오 덴기 고오교오 가부시끼가이샤, 이노우에 사다오 filed Critical 신고오 덴기 고오교오 가부시끼가이샤
Publication of KR900010984A publication Critical patent/KR900010984A/ko
Application granted granted Critical
Publication of KR930002816B1 publication Critical patent/KR930002816B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1019890017849A 1988-12-06 1989-12-04 리드프레임의 가공방법 Expired - Fee Related KR930002816B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63308361A JP2648353B2 (ja) 1988-12-06 1988-12-06 リードフレームの製造方法
JP63-308361 1988-12-06

Publications (2)

Publication Number Publication Date
KR900010984A KR900010984A (ko) 1990-07-11
KR930002816B1 true KR930002816B1 (ko) 1993-04-10

Family

ID=17980140

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890017849A Expired - Fee Related KR930002816B1 (ko) 1988-12-06 1989-12-04 리드프레임의 가공방법

Country Status (2)

Country Link
JP (1) JP2648353B2 (ja)
KR (1) KR930002816B1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100641512B1 (ko) 2002-12-30 2006-10-31 동부일렉트로닉스 주식회사 반도체 패키지 공정에서의 리드 프레임 구조
KR100789419B1 (ko) * 2006-11-27 2007-12-28 (주)원일사 리드프레임 모재 가공방법
JP6518547B2 (ja) * 2015-08-07 2019-05-22 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55151357A (en) * 1979-05-16 1980-11-25 Nec Corp Lead frame for semiconductor device

Also Published As

Publication number Publication date
KR900010984A (ko) 1990-07-11
JP2648353B2 (ja) 1997-08-27
JPH02154454A (ja) 1990-06-13

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