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KR890015368A - 반도체장치 제조방법 - Google Patents

반도체장치 제조방법

Info

Publication number
KR890015368A
KR890015368A KR1019890003135A KR890003135A KR890015368A KR 890015368 A KR890015368 A KR 890015368A KR 1019890003135 A KR1019890003135 A KR 1019890003135A KR 890003135 A KR890003135 A KR 890003135A KR 890015368 A KR890015368 A KR 890015368A
Authority
KR
South Korea
Prior art keywords
semiconductor device
device manufacturing
manufacturing
semiconductor
Prior art date
Application number
KR1019890003135A
Other languages
English (en)
Other versions
KR930000612B1 (ko
Inventor
하루히사 모리
Original Assignee
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰 가부시끼가이샤 filed Critical 후지쓰 가부시끼가이샤
Publication of KR890015368A publication Critical patent/KR890015368A/ko
Application granted granted Critical
Publication of KR930000612B1 publication Critical patent/KR930000612B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H10B20/27—ROM only
    • H10B20/30—ROM only having the source region and the drain region on the same level, e.g. lateral transistors
    • H10B20/38—Doping programmed, e.g. mask ROM
    • H10B20/383—Channel doping programmed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks

Landscapes

  • Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
KR1019890003135A 1988-03-14 1989-03-14 반도체장치 제조방법 KR930000612B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP88-060127 1988-03-14
JP63060127A JP2706460B2 (ja) 1988-03-14 1988-03-14 イオン注入方法

Publications (2)

Publication Number Publication Date
KR890015368A true KR890015368A (ko) 1989-10-30
KR930000612B1 KR930000612B1 (ko) 1993-01-25

Family

ID=13133157

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890003135A KR930000612B1 (ko) 1988-03-14 1989-03-14 반도체장치 제조방법

Country Status (5)

Country Link
US (1) US4889820A (ko)
EP (1) EP0333583B1 (ko)
JP (1) JP2706460B2 (ko)
KR (1) KR930000612B1 (ko)
DE (1) DE68907507T2 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783122B2 (ja) * 1988-12-01 1995-09-06 富士電機株式会社 半導体装置の製造方法
US5270226A (en) * 1989-04-03 1993-12-14 Matsushita Electric Industrial Co., Ltd. Manufacturing method for LDDFETS using oblique ion implantion technique
KR940010930B1 (ko) * 1990-03-13 1994-11-19 가부시키가이샤 도시바 반도체장치의 제조방법
JPH0487370A (ja) * 1990-07-30 1992-03-19 Sharp Corp 半導体装置の製造方法
US5155369A (en) * 1990-09-28 1992-10-13 Applied Materials, Inc. Multiple angle implants for shallow implant
US5268317A (en) * 1991-11-12 1993-12-07 Siemens Aktiengesellschaft Method of forming shallow junctions in field effect transistors
US5648288A (en) * 1992-03-20 1997-07-15 Siliconix Incorporated Threshold adjustment in field effect semiconductor devices
JP3202784B2 (ja) * 1992-04-13 2001-08-27 三菱電機株式会社 マスクｒｏｍ半導体装置およびその製造方法
JPH06169089A (ja) * 1992-05-07 1994-06-14 Nec Corp 縦型ｍｏｓｆｅｔの製造方法
JP3181695B2 (ja) * 1992-07-08 2001-07-03 ローム株式会社 Ｓｏｉ基板を用いた半導体装置の製造方法
US5559044A (en) * 1992-09-21 1996-09-24 Siliconix Incorporated BiCDMOS process technology
US5736420A (en) * 1993-08-20 1998-04-07 National Semiconductor Corporation Process for fabricating read only memories, with programming step performed midway through the fabrication process
DE69429915D1 (de) 1994-07-04 2002-03-28 St Microelectronics Srl Verfahren zur Herstellung von Leistungsbauteilen hoher Dichte in MOS-Technologie
FR2730345B1 (fr) * 1995-02-03 1997-04-04 Matra Mhs Procede de fabrication d'une memoire morte en technologie mos, et memoire ainsi obtenue
KR0147627B1 (ko) * 1995-04-11 1998-11-02 김광호 낸드형 불휘발성 기억장치
JP3419606B2 (ja) * 1995-09-14 2003-06-23 富士通株式会社 半導体装置とその製造方法
US5851886A (en) * 1995-10-23 1998-12-22 Advanced Micro Devices, Inc. Method of large angle tilt implant of channel region
US6027978A (en) * 1997-01-28 2000-02-22 Advanced Micro Devices, Inc. Method of making an IGFET with a non-uniform lateral doping profile in the channel region
JP3185862B2 (ja) 1997-09-10 2001-07-11 日本電気株式会社 マスク型半導体装置の製造方法
DE19815873A1 (de) * 1998-04-08 1999-10-14 Siemens Ag Verfahren zur Herstellung einer Halbleiter-Speichervorrichtung
US6074920A (en) * 1998-08-26 2000-06-13 Texas Instruments Incorporated Self-aligned implant under transistor gate
US6632728B2 (en) 2001-07-16 2003-10-14 Agere Systems Inc. Increasing the electrical activation of ion-implanted dopants
US6764909B2 (en) * 2002-01-14 2004-07-20 Texas Instruments Incorporated Structure and method of MOS transistor having increased substrate resistance
US20120137971A1 (en) * 2010-12-03 2012-06-07 Vanrian Semiconductor Equipment Associates, Inc. Hydrophobic property alteration using ion implantation
CN112735949B (zh) * 2019-10-29 2023-06-06 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
CN112018038B (zh) * 2020-10-27 2021-02-19 晶芯成(北京)科技有限公司 一种半导体器件的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615875A (en) * 1968-09-30 1971-10-26 Hitachi Ltd Method for fabricating semiconductor devices by ion implantation
DE2802838A1 (de) * 1978-01-23 1979-08-16 Siemens Ag Mis-feldeffekttransistor mit kurzer kanallaenge
JPS5939906B2 (ja) * 1978-05-04 1984-09-27 超エル・エス・アイ技術研究組合 半導体装置の製造方法
GB2056168A (en) * 1979-08-01 1981-03-11 Gen Instrument Corp Method of fabricating P-N junction with high breakdown voltage
JPS56126970A (en) * 1980-03-11 1981-10-05 Nippon Telegr & Teleph Corp <Ntt> Mos field effect transistor and manufacture thereof
US4417385A (en) * 1982-08-09 1983-11-29 General Electric Company Processes for manufacturing insulated-gate semiconductor devices with integral shorts
JPS59100574A (ja) * 1982-11-30 1984-06-09 Sumitomo Electric Ind Ltd シヨツトキゲ−ト電界効果トランジスタとその製造方法
JPS61214457A (ja) * 1985-03-19 1986-09-24 Toshiba Corp 半導体装置およびその製造方法
JPS61292358A (ja) * 1985-06-19 1986-12-23 Fujitsu Ltd Ｍｉｓ型電界効果トランジスタの製造方法
JPS63278328A (ja) * 1987-05-11 1988-11-16 Matsushita Electronics Corp 半導体容量素子の製造方法
JPH0821555B2 (ja) * 1987-05-28 1996-03-04 富士通株式会社 イオン注入方法

Also Published As

Publication number Publication date
JP2706460B2 (ja) 1998-01-28
DE68907507D1 (de) 1993-08-19
EP0333583A3 (en) 1990-01-17
DE68907507T2 (de) 1993-10-21
KR930000612B1 (ko) 1993-01-25
EP0333583A2 (en) 1989-09-20
US4889820A (en) 1989-12-26
JPH01233759A (ja) 1989-09-19
EP0333583B1 (en) 1993-07-14

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