KR20190004654A - 접촉 단자, 검사 지그, 및 검사 장치 - Google Patents
접촉 단자, 검사 지그, 및 검사 장치 Download PDFInfo
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- KR20190004654A KR20190004654A KR1020180075160A KR20180075160A KR20190004654A KR 20190004654 A KR20190004654 A KR 20190004654A KR 1020180075160 A KR1020180075160 A KR 1020180075160A KR 20180075160 A KR20180075160 A KR 20180075160A KR 20190004654 A KR20190004654 A KR 20190004654A
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- 238000007689 inspection Methods 0.000 title claims abstract description 99
- 239000004020 conductor Substances 0.000 claims abstract description 104
- 239000000463 material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 239000000523 sample Substances 0.000 description 59
- 239000000758 substrate Substances 0.000 description 40
- 238000003780 insertion Methods 0.000 description 14
- 230000037431 insertion Effects 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 7
- 230000004323 axial length Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
- G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
도 2는, 도 1에 도시한 검사 장치에 설치된 검사부의 다른 일례를 나타내는 사시도이다.
도 3은, 도 1, 도 2에 도시한 검사 지그의 구성의 일례를 나타내는 모식적인 단면도이다.
도 4는, 프로브의 구체적 구성을 나타내는 정면도이다.
도 5는, 프로브를 통형체와 접촉 단자로 분해한 구성을 나타내는 정면도이다.
도 6은, 도 5에 도시한 통형체의 단부에 설치된 포위 지지부의 구체적 구성을 나타내고, (a)는 통형체의 단부를 확대한 정면도, (b)는 통형체를 (a)의 하방에서 본 단면도, (c)는 포위 지지부를 전개한 상태를 나타내는 정면도이다.
도 7은, 지지 부재에 베이스 플레이트가 부착된 상태를 나타내는 도 3에 상당하는 도면이다.
도 8은, 검사 대상에 프로브가 압접된 검사 상태를 나타내는 도 3에 상당하는 도면이다.
도 9는, 본 발명에 따른 접촉 단자의 통전 상태를 나타내는 설명도이다.
도 10은, 본 발명의 비교예에 따른 접촉 단자의 통전 상태를 나타내는 설명도이다.
도 11은, 본 발명의 제2 실시 형태에 따른 프로브의 일례를 나타내는 도 4에 상당하는 도면이다.
3, 3U, 3D: 검사 지그
KG: 간극
Pa: 통형체
Pb: 제1 중심 도체
Pc: 제2 중심 도체
Pb1: 제1 막대형 본체
Pc1: 제2 막대형 본체
Pb2: 제1 피포위 지지부
Pc2: 제2 피포위 지지부
Pb3, Pc3: 플랜지부
Pb4, Pc4: 접속부
Pd1: 제1 포위 지지부
Pd2: 제2 포위 지지부
Pe1: 제1 스프링부
Pe2: 제2 스프링부
Pf: 연결부
Pg1: 제1 나선 홈
Pg2: 제2 나선 홈
Ph1: 제1 슬릿
Ph2: 제2 슬릿
Pr, Pr': 프로브
Claims (6)
- 도전성을 갖는 소재에 의해 통형으로 형성된 통형체와,
도전성을 갖는 소재에 의해 각각 막대형으로 형성된 제1 중심 도체 및 제2 중심 도체를 구비하고,
상기 제1 중심 도체는,
상기 통형체의 내경보다도 작은 외경을 갖고, 상기 통형체의 일단부측에 삽입 관통되는 제1 막대형 본체와,
당해 제1 막대형 본체의 기단부에 설치된 당해 제1 막대형 본체보다도 대직경의 제1 피포위 지지부와,
상기 제1 막대형 본체의 선단부에 설치된 당해 제1 막대형 본체보다도 대직경의 제1 팽출부를 갖고,
상기 제2 중심 도체는,
상기 통형체의 내경보다도 작은 외경을 갖고, 상기 통형체의 타단부측에 삽입 관통되는 제2 막대형 본체와,
당해 제2 막대형 본체의 기단부에 설치된 당해 제2 막대형 본체보다도 대직경의 제2 피포위 지지부와,
상기 제2 막대형 본체의 선단부에 설치된 당해 제2 막대형 본체보다도 대직경의 제2 팽출부를 갖고,
상기 통형체는,
상기 제1 피포위 지지부를 포위 지지하는 제1 포위 지지부와,
상기 제2 피포위 지지부를 포위 지지하는 제2 포위 지지부와,
상기 제1 포위 지지부에 연속 설치된 나선형체로 이루어지는 제1 스프링부와,
상기 제2 포위 지지부에 연속 설치된 나선형체로 이루어지는 제2 스프링부와,
당해 제1 스프링부 및 제2 스프링부를 서로 연결하는 통형의 연결부를 갖고,
상기 제1 중심 도체 및 상기 제2 중심 도체는, 상기 제1 팽출부 및 상기 제2 팽출부의 선단부가 각각 상기 연결부 내에 도입됨과 함께, 상기 제1 팽출부의 선단면과 상기 제2 팽출부의 선단면의 사이에 간극을 두고 서로 대향한 상태로 유지되도록 설치되어 있는, 접촉 단자. - 제1항에 있어서,
상기 제1 포위 지지부 및 상기 제2 포위 지지부는, 그 내면이 상기 제1 피포위 지지부 및 상기 제2 피포위 지지부의 둘레면에 각각 압착되어 있는, 접촉 단자. - 제1항 또는 제2항에 있어서,
상기 제1 포위 지지부 및 제2 포위 지지부의 적어도 한쪽에는, 상기 통형체의 일부를 둘레 방향으로 분단하는 슬릿이 형성되어 있는, 접촉 단자. - 제3항에 있어서,
상기 슬릿은, 상기 나선형체를 구성하는 나선 홈의 단부로부터 상기 통형체의 축방향으로 연장되도록 형성되어 있는, 접촉 단자. - 제1항 내지 제4항 중 어느 한 항에 기재된 접촉 단자와,
상기 접촉 단자를 지지하는 지지 부재를 구비하는, 검사 지그. - 제5항에 기재된 검사 지그와,
상기 접촉 단자를 검사 대상에 마련된 피검사점에 접촉시킴으로써 얻어지는 전기 신호에 기초하여, 상기 검사 대상의 검사를 행하는 검사 처리부를 구비하는, 검사 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-131402 | 2017-07-04 | ||
JP2017131402A JP7098886B2 (ja) | 2017-07-04 | 2017-07-04 | 接触端子、検査治具、及び検査装置 |
Publications (2)
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KR20190004654A true KR20190004654A (ko) | 2019-01-14 |
KR102615228B1 KR102615228B1 (ko) | 2023-12-19 |
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KR1020180075160A Active KR102615228B1 (ko) | 2017-07-04 | 2018-06-29 | 접촉 단자, 검사 지그, 및 검사 장치 |
Country Status (6)
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US (1) | US10649004B2 (ko) |
EP (1) | EP3425745B1 (ko) |
JP (1) | JP7098886B2 (ko) |
KR (1) | KR102615228B1 (ko) |
CN (1) | CN109212274A (ko) |
TW (1) | TWI775890B (ko) |
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KR20200144061A (ko) * | 2019-06-17 | 2020-12-28 | 니혼덴산리드가부시키가이샤 | 검사 장치 |
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MY177005A (en) * | 2016-11-30 | 2020-09-01 | Nidec Read Corp | Contact terminal, inspection jig, and inspection device |
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TWI857011B (zh) | 2019-02-22 | 2024-10-01 | 日商日本電產理德股份有限公司 | 檢查治具 |
WO2020203155A1 (ja) * | 2019-03-29 | 2020-10-08 | 日本電産リード株式会社 | 接触端子、検査治具、および検査装置 |
KR20210146911A (ko) | 2019-03-29 | 2021-12-06 | 니혼덴산리드가부시키가이샤 | 접촉 단자, 검사 지그 및 검사 장치 |
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KR20220127814A (ko) | 2020-01-10 | 2022-09-20 | 니혼덴산리드가부시키가이샤 | 접촉자, 검사 지그, 검사 장치, 및 접촉자의 제조 방법 |
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TW201907165A (zh) | 2019-02-16 |
JP7098886B2 (ja) | 2022-07-12 |
EP3425745B1 (en) | 2020-03-04 |
CN109212274A (zh) | 2019-01-15 |
TWI775890B (zh) | 2022-09-01 |
EP3425745A1 (en) | 2019-01-09 |
JP2019015542A (ja) | 2019-01-31 |
US20190011479A1 (en) | 2019-01-10 |
KR102615228B1 (ko) | 2023-12-19 |
US10649004B2 (en) | 2020-05-12 |
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