KR20160103520A - 하중 측정 장치 및 하중 측정 방법 - Google Patents
하중 측정 장치 및 하중 측정 방법 Download PDFInfo
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- KR20160103520A KR20160103520A KR1020160019058A KR20160019058A KR20160103520A KR 20160103520 A KR20160103520 A KR 20160103520A KR 1020160019058 A KR1020160019058 A KR 1020160019058A KR 20160019058 A KR20160019058 A KR 20160019058A KR 20160103520 A KR20160103520 A KR 20160103520A
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- 238000004140 cleaning Methods 0.000 claims abstract description 72
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- 238000005259 measurement Methods 0.000 claims abstract description 23
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- 239000007788 liquid Substances 0.000 claims description 25
- 238000003825 pressing Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 74
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
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- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G5/00—Weighing apparatus wherein the balancing is effected by fluid action
- G01G5/003—Weighing apparatus wherein the balancing is effected by fluid action load-cell construction or mountings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
- G01G19/22—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them
- G01G19/24—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them using a single weighing apparatus
- G01G19/30—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them using a single weighing apparatus having electrical weight-sensitive devices
- G01G19/306—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them using a single weighing apparatus having electrical weight-sensitive devices involving comparison with a reference value
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
- G01G19/22—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them
- G01G19/34—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them with electrical control means
- G01G19/346—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups for apportioning materials by weighing prior to mixing them with electrical control means involving comparison with a reference value
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G19/00—Weighing apparatus or methods adapted for special purposes not provided for in the preceding groups
- G01G19/52—Weighing apparatus combined with other objects, e.g. furniture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
- G01L1/048—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of torsionally deformable elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0061—Force sensors associated with industrial machines or actuators
- G01L5/0076—Force sensors associated with manufacturing machines
- G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
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Abstract
하중 측정 장치는, 기판(W)의 직경과 동일한 길이의 하중 측정면(30a)을 갖는 방수형 로드셀(30)과, 방수형 로드셀(30)을 지지하는 베이스 플레이트(31)를 구비한다. 이러한 하중 측정 장치는, 기판(W)과 마찬가지로 기판 세정 장치에 셋팅되어, 기판 세정 장치가 롤 세정구(7)로부터 받는 하중을 방수형 로드셀(30)로 측정한다.
Description
도 2는 롤 스펀지의 하중을 측정하기 위한 하중 측정 장치를 도시하는 사시도이다.
도 3은 하중 측정 장치의 평면도이다.
도 4는 하중 측정 장치의 정면도이다.
도 5는 하중 측정 장치가 기판 세정 장치에 셋팅된 상태를 도시하는 평면도이다.
도 6은 기판 세정 장치에 셋팅된 하중 측정 장치가 롤 스펀지의 하중을 측정하고 있는 모습을 도시하는 정면도이다.
도 7은 도 6에 도시된 하중 측정 장치를 도시하는 측면도이다.
도 8은 종래의 하중 측정 지그에 사용되고 있는 로드셀에 롤 스펀지가 압박되고 있는 상태를 도시하는 측면도이다.
도 9는 종래의 하중 측정 지그를 도시하는 평면도이다.
도 10은 도 9에 도시된 하중 측정 지그의 정면도이다.
도 11은 종래 기술에서 세정 장치에 셋팅된 하중 측정 지그를 도시하는 평면도이다.
도 12는 종래 기술에서 세정 장치에 셋팅된 하중 측정 지그가 하중을 측정하고 있는 모습을 도시하는 정면도이다.
도 13은 도 12에 도시하는 하중 측정 지그를 도시하는 측면도이다.
도 14는 로드셀에 압박했을 때의 더미 롤의 높이와 웨이퍼에 압박했을 때의 롤 세정구의 높이의 차이를 도시한 도면이다.
5 : 기판 유지 기구
7, 8 : 롤 스펀지(롤 세정구)
11, 12 : 롤 회전 기구
15, 16 : 상측 순수 공급 노즐
20, 21 : 상측 세정액 공급 노즐
27 : 하중 발생 기구
30 : 로드셀
30a : 하중 측정면
31 : 베이스 플레이트
35 : 케이블
38 : 하중 표시기
40 : 박육부
41 : 절취부
50 : 롤 축
52 : 스프링
55 : 변위 센서
66 : 작동 컨트롤러
67 : 압력 조절기
Claims (7)
- 롤 세정구로부터 기판에 가해지는 하중을 측정하기 위한 하중 측정 장치에 있어서,
상기 기판의 직경과 동일한 길이의 하중 측정면을 갖는 방수형 로드셀과,
상기 방수형 로드셀을 지지하는 베이스 플레이트
를 구비하는 것을 특징으로 하는 하중 측정 장치. - 제1항에 있어서, 상기 하중 측정면은 평탄한 면인 것을 특징으로 하는 하중 측정 장치.
- 제1항 또는 제2항에 있어서, 상기 베이스 플레이트의 가장자리에는, 복수의 원호형의 절취부가 형성되어 있고, 상기 베이스 플레이트의 중심점으로부터 상기 원호형의 절취부까지의 거리는 상기 기판의 반경과 같은 것을 특징으로 하는 하중 측정 장치.
- 롤 세정구로부터 기판에 가해지는 하중을 측정하는 하중 측정 방법으로서,
상기 기판의 직경과 동일한 길이의 하중 측정면을 갖는 방수형 로드셀을 갖춘 하중 측정 장치를 기판 유지 기구로 유지하는 공정과,
상기 롤 세정구를 그 축심 둘레로 회전시키면서, 상기 롤 세정구를 상기 방수형 로드셀에 압박하는 공정과,
회전하는 상기 롤 세정구에 세정액을 공급하면서, 상기 롤 세정구로부터 상기 방수형 로드셀에 가해지는 하중을 측정하는 공정
을 포함하는 것을 특징으로 하는 하중 측정 방법. - 제4항에 있어서,
회전하는 상기 롤 세정구가 상기 방수형 로드셀에 압박되고 있을 때의 상기 롤 세정구의 찌부러짐 양을 측정하는 공정
을 더 포함하는 것을 특징으로 하는 하중 측정 방법. - 제5항에 있어서,
상기 롤 세정구를 상기 방수형 로드셀에 압박하는 힘을 바꾸면서, 상기 하중의 측정과 상기 롤 세정구의 찌부러짐 양의 측정을 반복하여, 상기 하중의 복수의 측정치와 상기 찌부러짐 양의 복수의 측정치를 취득하고,
상기 하중의 복수의 측정치와 상기 찌부러짐 양의 복수의 측정치로부터, 상기 하중과 상기 롤 세정구의 찌부러짐 양의 관계를 도출하는 것을 특징으로 하는 하중 측정 방법. - 제5항에 있어서,
상기 롤 세정구의 회전 속도를 바꾸면서, 상기 하중의 측정을 반복하여, 상기 하중의 복수의 측정치를 취득하고,
상기 하중의 복수의 측정치와 상기 롤 세정구의 대응하는 회전 속도로부터, 상기 하중과 상기 롤 세정구의 회전 속도의 관계를 도출하는 것을 특징으로 하는 하중 측정 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-033910 | 2015-02-24 | ||
JP2015033910A JP6328577B2 (ja) | 2015-02-24 | 2015-02-24 | 荷重測定装置および荷重測定方法 |
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KR20160103520A true KR20160103520A (ko) | 2016-09-01 |
KR102238958B1 KR102238958B1 (ko) | 2021-04-13 |
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US (1) | US9719869B2 (ko) |
JP (1) | JP6328577B2 (ko) |
KR (1) | KR102238958B1 (ko) |
CN (1) | CN105914166B (ko) |
SG (1) | SG10201601246RA (ko) |
TW (1) | TWI666712B (ko) |
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KR20180131422A (ko) * | 2017-05-30 | 2018-12-10 | 가부시키가이샤 에바라 세이사꾸쇼 | 캘리브레이션 방법 및 캘리브레이션 프로그램을 기록한 비일시적인 컴퓨터 판독 가능한 기록 매체 |
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JP6767834B2 (ja) | 2016-09-29 | 2020-10-14 | 株式会社荏原製作所 | 基板洗浄装置及び基板処理装置 |
JP6792512B2 (ja) | 2017-05-16 | 2020-11-25 | 株式会社荏原製作所 | 基板洗浄装置および基板処理装置 |
JP7079164B2 (ja) | 2018-07-06 | 2022-06-01 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄方法 |
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JP7093390B2 (ja) * | 2020-10-15 | 2022-06-29 | 株式会社荏原製作所 | 基板洗浄装置 |
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2016
- 2016-02-17 US US15/045,643 patent/US9719869B2/en active Active
- 2016-02-18 KR KR1020160019058A patent/KR102238958B1/ko active Active
- 2016-02-19 SG SG10201601246RA patent/SG10201601246RA/en unknown
- 2016-02-19 CN CN201610092048.9A patent/CN105914166B/zh active Active
- 2016-02-22 TW TW105105095A patent/TWI666712B/zh active
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KR20180131422A (ko) * | 2017-05-30 | 2018-12-10 | 가부시키가이샤 에바라 세이사꾸쇼 | 캘리브레이션 방법 및 캘리브레이션 프로그램을 기록한 비일시적인 컴퓨터 판독 가능한 기록 매체 |
Also Published As
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JP2016157778A (ja) | 2016-09-01 |
JP6328577B2 (ja) | 2018-05-23 |
KR102238958B1 (ko) | 2021-04-13 |
US20160243592A1 (en) | 2016-08-25 |
US9719869B2 (en) | 2017-08-01 |
CN105914166B (zh) | 2019-03-01 |
CN105914166A (zh) | 2016-08-31 |
TWI666712B (zh) | 2019-07-21 |
SG10201601246RA (en) | 2016-09-29 |
TW201631680A (zh) | 2016-09-01 |
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