KR102730712B1 - 기판 수납 용기 관리 시스템, 로드 포트, 기판 수납 용기 관리 방법 - Google Patents
기판 수납 용기 관리 시스템, 로드 포트, 기판 수납 용기 관리 방법 Download PDFInfo
- Publication number
- KR102730712B1 KR102730712B1 KR1020190060782A KR20190060782A KR102730712B1 KR 102730712 B1 KR102730712 B1 KR 102730712B1 KR 1020190060782 A KR1020190060782 A KR 1020190060782A KR 20190060782 A KR20190060782 A KR 20190060782A KR 102730712 B1 KR102730712 B1 KR 102730712B1
- Authority
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- South Korea
- Prior art keywords
- storage container
- substrate storage
- foup
- load port
- sensor
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018099494 | 2018-05-24 | ||
JPJP-P-2018-099494 | 2018-05-24 | ||
JP2019031789A JP7295384B2 (ja) | 2018-05-24 | 2019-02-25 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
JPJP-P-2019-031789 | 2019-02-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190134523A KR20190134523A (ko) | 2019-12-04 |
KR102730712B1 true KR102730712B1 (ko) | 2024-11-18 |
Family
ID=68767822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190060782A Active KR102730712B1 (ko) | 2018-05-24 | 2019-05-23 | 기판 수납 용기 관리 시스템, 로드 포트, 기판 수납 용기 관리 방법 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP7256358B2 (ja) |
KR (1) | KR102730712B1 (ja) |
TW (1) | TWI821293B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7256358B2 (ja) * | 2018-05-24 | 2023-04-12 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、基板収納容器管理方法 |
KR102389879B1 (ko) * | 2020-06-29 | 2022-04-22 | 송춘기 | 질소 누출 방지 기능을 구비한 이에프이엠 시스템 |
CN116848629A (zh) * | 2021-02-17 | 2023-10-03 | 应用材料公司 | 用于支持多个半导体处理模块或腔室的模块化主机布局 |
US12131454B2 (en) * | 2021-09-15 | 2024-10-29 | Onto Innovation, Inc. | Substrate mapping using deep neural-networks |
CN114548708B (zh) * | 2022-01-30 | 2022-08-26 | 弥费实业(上海)有限公司 | 空晶圆盒管理方法、装置、计算机设备和存储介质 |
CN116525508B (zh) * | 2023-05-23 | 2024-03-26 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
CN117672928B (zh) * | 2023-10-19 | 2024-06-25 | 重庆鹰谷光电股份有限公司 | 一种开盒方法 |
CN119314916B (zh) * | 2024-12-13 | 2025-04-08 | 北京锐洁机器人科技有限公司 | 一种提供氮气保护环境的晶圆盒装载装置及其使用方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004517463A (ja) | 2000-08-15 | 2004-06-10 | アシスト テクノロジーズ インコーポレイテッド | キャリアモニター及び工場レベルでのキャリア管理システムと統合されたスマート装填ポート |
KR101732290B1 (ko) | 2012-12-10 | 2017-05-02 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 기판 처리 시스템 및 반송 용기의 이상 검출 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6901971B2 (en) * | 2001-01-10 | 2005-06-07 | Entegris, Inc. | Transportable container including an internal environment monitor |
JP2002313867A (ja) * | 2001-02-09 | 2002-10-25 | Toshiba Corp | 半導体装置の製造方法 |
US6595075B1 (en) * | 2002-05-06 | 2003-07-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for testing cassette pod door |
JP4253252B2 (ja) | 2003-12-22 | 2009-04-08 | 富士通マイクロエレクトロニクス株式会社 | 品質改善システム |
JP2009503899A (ja) * | 2005-08-03 | 2009-01-29 | インテグリス・インコーポレーテッド | 移送容器 |
TW200725442A (en) * | 2005-12-16 | 2007-07-01 | Powerchip Semiconductor Corp | Method for storage management of wafer in process |
JP2012190821A (ja) * | 2011-03-08 | 2012-10-04 | Hitachi Kokusai Electric Inc | 基板処理装置および群管理装置 |
JP6403431B2 (ja) * | 2013-06-28 | 2018-10-10 | 株式会社Kokusai Electric | 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム |
JP6539199B2 (ja) * | 2015-12-18 | 2019-07-03 | 株式会社荏原製作所 | 基板搬送用移載機及び基板移載方法 |
JP6689672B2 (ja) | 2016-05-25 | 2020-04-28 | 信越ポリマー株式会社 | 基板収納容器及びその管理システム並びに基板収納容器の管理方法 |
JP6882656B2 (ja) * | 2016-07-08 | 2021-06-02 | シンフォニアテクノロジー株式会社 | ロードポート及びロードポートを備える基板搬送システム |
JP7256358B2 (ja) | 2018-05-24 | 2023-04-12 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、基板収納容器管理方法 |
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2018
- 2018-11-06 JP JP2018208981A patent/JP7256358B2/ja active Active
-
2019
- 2019-02-25 JP JP2019031789A patent/JP7295384B2/ja active Active
- 2019-05-23 KR KR1020190060782A patent/KR102730712B1/ko active Active
- 2019-05-23 TW TW108117924A patent/TWI821293B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004517463A (ja) | 2000-08-15 | 2004-06-10 | アシスト テクノロジーズ インコーポレイテッド | キャリアモニター及び工場レベルでのキャリア管理システムと統合されたスマート装填ポート |
KR101732290B1 (ko) | 2012-12-10 | 2017-05-02 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 기판 처리 시스템 및 반송 용기의 이상 검출 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP7256358B2 (ja) | 2023-04-12 |
JP2019208007A (ja) | 2019-12-05 |
JP7295384B2 (ja) | 2023-06-21 |
TW202003353A (zh) | 2020-01-16 |
JP2019208001A (ja) | 2019-12-05 |
TWI821293B (zh) | 2023-11-11 |
KR20190134523A (ko) | 2019-12-04 |
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