JP2019208007A - 基板収納容器管理システム、ロードポート、基板収納容器管理方法 - Google Patents
基板収納容器管理システム、ロードポート、基板収納容器管理方法 Download PDFInfo
- Publication number
- JP2019208007A JP2019208007A JP2019031789A JP2019031789A JP2019208007A JP 2019208007 A JP2019208007 A JP 2019208007A JP 2019031789 A JP2019031789 A JP 2019031789A JP 2019031789 A JP2019031789 A JP 2019031789A JP 2019208007 A JP2019208007 A JP 2019208007A
- Authority
- JP
- Japan
- Prior art keywords
- storage container
- substrate storage
- foup
- load port
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 207
- 238000003860 storage Methods 0.000 title claims abstract description 204
- 238000007726 management method Methods 0.000 title claims description 54
- 238000012545 processing Methods 0.000 claims description 118
- 238000001514 detection method Methods 0.000 claims description 26
- 238000004364 calculation method Methods 0.000 claims description 12
- 230000006866 deterioration Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 71
- 235000012431 wafers Nutrition 0.000 description 66
- 230000008569 process Effects 0.000 description 53
- 238000013507 mapping Methods 0.000 description 41
- 238000010926 purge Methods 0.000 description 34
- 239000007789 gas Substances 0.000 description 33
- 238000004891 communication Methods 0.000 description 30
- 238000012546 transfer Methods 0.000 description 30
- 238000007689 inspection Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 12
- 238000003032 molecular docking Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 9
- 230000006870 function Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000013528 artificial neural network Methods 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 3
- 238000007418 data mining Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010801 machine learning Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
2…ロードポート
23…載置台
2c…センサ
2x…ID読取手段
2y…ロードポート側通信手段
4…基板収納容器(FOUP)
41…搬出入口
4x…個体識別用ID
C…上位システム
Ca…動作調整部
Cd…データベース
Cx…上位システム側通信手段
Cy…紐付け手段
Cz…データ処理部
W…基板(ウェーハ)
Claims (11)
- 基板収納容器に対して基板を出し入れ処理可能であり、前記基板収納容器に付された個体識別用IDを読み取り可能なID読取手段と、前記基板収納容器の状態を直接または間接的に検出するセンサと、を有するロードポートと、
前記ID読取手段で読み取った前記個体識別用IDと前記センサで検出したセンサ値とを相互に紐付ける紐付け手段と、
前記紐付け手段で紐付けたデータを蓄積するデータベースと、
前記データベース内の前記データを解析して前記個体識別用ID毎の前記基板収納容器の状態を出力するデータ処理部と、
を備えることを特徴とする基板収納容器管理システム。 - 前記データ処理部は、
特定の前記センサで検出したセンサ値から統計データを算出する算出手段と、
特定の前記個体識別用IDに紐付けされたセンサ値と前記算出手段によって算出した算出結果とを比較する比較手段と、
前記比較手段によって比較した結果に基づいて前記基板収納容器の状態を出力する状態出力手段と、
を備える請求項1に記載の基板収納容器管理システム。 - 前記ロードポートは、複数種類の前記センサを備えており、
前記紐付け手段は、前記個体識別用IDと前記複数種類のセンサで検出した複数種類の前記センサ値とを相互に紐付け可能である請求項1又は2に記載の基板収納容器管理システム。 - 前記データ処理部が出力した前記個体識別用ID毎の前記基板収納容器の状態に基づいて、前記ロードポートにおける前記基板収納容器の処理に関わる制御値を調整する動作調整部をさらに備える請求項1〜3の何れか1項に記載の基板収納容器管理システム。
- 前記紐付け手段は、前記個体識別用IDと、前記基板収納容器の処理時に発生したエラーに関する情報及び前記基板収納容器に格納された前記基板になされた処理に関する情報のうち少なくとも何れか一方の情報とを相互に紐付け可能であり、
前記データベースに蓄積された前記個体識別用ID毎の前記少なくとも何れか一方の情報に基づいて、前記ロードポートの前記基板収納容器の処理に関わる制御値を調整する動作調整部をさらに備える請求項1〜3の何れか1項に記載の基板収納容器管理システム。 - 前記ロードポートと通信可能な上位システムをさらに備え、
前記上位システムに、少なくとも前記紐付け手段、前記データベース及び前記データ処理部が設けられている請求項1〜5の何れか1項に記載の基板収納容器管理システム。 - 前記データ処理部は、前記ロードポートの前記センサのセンサ値から前記基板収納容器の状態を学習する学習手段を有する請求項1〜6に記載の基板収納容器管理システム。
- 請求項1〜7の何れか1項に記載の基板収納容器管理システムに含まれるロードポートであって、
前記基板収納容器に付された前記個体識別用IDを読み取り可能な前記ID読取手段と、
前記基板収納容器の状態を直接または間接的に検出する前記センサと、
を備えることを特徴とするロードポート。 - 基板収納容器に対して基板を出し入れ処理可能なロードポートによって、前記基板収納容器に付された個体識別用IDを読み取るID読取ステップと、
前記ロードポートに設けられたセンサによって前記基板収納容器の状態を直接または間接的に検出する検出ステップと、
前記ID読取ステップで読み取った前記個体識別用IDと前記検出ステップで検出したセンサ値とを相互に紐付ける紐付けステップと、
前記紐付けステップで紐付けたデータをデータベースに蓄積するデータベース化ステップと、
前記データベース内の前記データを解析して前記個体識別用ID毎の前記基板収納容器の状態を出力するデータ処理ステップと、
を備えることを特徴とする基板収納容器管理方法。 - 前記データ処理ステップで出力された前記個体識別用ID毎の前記基板収納容器の状態に基づいて、前記ロードポートにおける前記基板収納容器の処理に関わる制御値を調整する動作調整ステップをさらに備える請求項9に記載の基板収納容器管理方法。
- 前記紐付けステップにおいて、前記個体識別用IDと、前記基板収納容器の処理時に発生したエラーに関する情報及び前記基板収納容器に格納された前記基板になされた処理に関する情報のうち少なくとも何れか一方の情報とを相互に紐付けし、
前記データベースに蓄積された前記個体識別用ID毎の前記少なくとも何れか一方の情報に基づいて、前記ロードポートの前記基板収納容器の処理に関わる制御値を調整する動作調整ステップをさらに備える請求項9に記載の基板収納容器管理方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190060782A KR102730712B1 (ko) | 2018-05-24 | 2019-05-23 | 기판 수납 용기 관리 시스템, 로드 포트, 기판 수납 용기 관리 방법 |
TW108117924A TWI821293B (zh) | 2018-05-24 | 2019-05-23 | 基板收納容器管理系統、裝載埠、基板收納容器管理方法 |
CN201910434628.5A CN110534455A (zh) | 2018-05-24 | 2019-05-23 | 基板收纳容器管理系统、装载端口、基板收纳容器管理方法 |
US16/421,733 US10978325B2 (en) | 2018-05-24 | 2019-05-24 | Substrate storage container management system, load port, and substrate storage container management method |
US17/214,410 US11662373B2 (en) | 2018-05-24 | 2021-03-26 | Substrate storage container management system, load port, and substrate storage container management method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018099494 | 2018-05-24 | ||
JP2018099494 | 2018-05-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019208007A true JP2019208007A (ja) | 2019-12-05 |
JP7295384B2 JP7295384B2 (ja) | 2023-06-21 |
Family
ID=68767822
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018208981A Active JP7256358B2 (ja) | 2018-05-24 | 2018-11-06 | 基板収納容器管理システム、基板収納容器管理方法 |
JP2019031789A Active JP7295384B2 (ja) | 2018-05-24 | 2019-02-25 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018208981A Active JP7256358B2 (ja) | 2018-05-24 | 2018-11-06 | 基板収納容器管理システム、基板収納容器管理方法 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP7256358B2 (ja) |
KR (1) | KR102730712B1 (ja) |
TW (1) | TWI821293B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7256358B2 (ja) * | 2018-05-24 | 2023-04-12 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、基板収納容器管理方法 |
KR102389879B1 (ko) * | 2020-06-29 | 2022-04-22 | 송춘기 | 질소 누출 방지 기능을 구비한 이에프이엠 시스템 |
CN116848629A (zh) * | 2021-02-17 | 2023-10-03 | 应用材料公司 | 用于支持多个半导体处理模块或腔室的模块化主机布局 |
US12131454B2 (en) * | 2021-09-15 | 2024-10-29 | Onto Innovation, Inc. | Substrate mapping using deep neural-networks |
CN114548708B (zh) * | 2022-01-30 | 2022-08-26 | 弥费实业(上海)有限公司 | 空晶圆盒管理方法、装置、计算机设备和存储介质 |
CN116525508B (zh) * | 2023-05-23 | 2024-03-26 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
CN117672928B (zh) * | 2023-10-19 | 2024-06-25 | 重庆鹰谷光电股份有限公司 | 一种开盒方法 |
CN119314916B (zh) * | 2024-12-13 | 2025-04-08 | 北京锐洁机器人科技有限公司 | 一种提供氮气保护环境的晶圆盒装载装置及其使用方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004517463A (ja) * | 2000-08-15 | 2004-06-10 | アシスト テクノロジーズ インコーポレイテッド | キャリアモニター及び工場レベルでのキャリア管理システムと統合されたスマート装填ポート |
JP2005182635A (ja) * | 2003-12-22 | 2005-07-07 | Fujitsu Ltd | 品質改善システム |
JP2012190821A (ja) * | 2011-03-08 | 2012-10-04 | Hitachi Kokusai Electric Inc | 基板処理装置および群管理装置 |
JP2014116464A (ja) * | 2012-12-10 | 2014-06-26 | Tokyo Electron Ltd | 基板処理装置、基板処理システム及び搬送容器の異常検出方法 |
JP2019208001A (ja) * | 2018-05-24 | 2019-12-05 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6901971B2 (en) * | 2001-01-10 | 2005-06-07 | Entegris, Inc. | Transportable container including an internal environment monitor |
JP2002313867A (ja) * | 2001-02-09 | 2002-10-25 | Toshiba Corp | 半導体装置の製造方法 |
US6595075B1 (en) * | 2002-05-06 | 2003-07-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for testing cassette pod door |
JP2009503899A (ja) * | 2005-08-03 | 2009-01-29 | インテグリス・インコーポレーテッド | 移送容器 |
TW200725442A (en) * | 2005-12-16 | 2007-07-01 | Powerchip Semiconductor Corp | Method for storage management of wafer in process |
JP6403431B2 (ja) * | 2013-06-28 | 2018-10-10 | 株式会社Kokusai Electric | 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム |
JP6539199B2 (ja) * | 2015-12-18 | 2019-07-03 | 株式会社荏原製作所 | 基板搬送用移載機及び基板移載方法 |
JP6689672B2 (ja) | 2016-05-25 | 2020-04-28 | 信越ポリマー株式会社 | 基板収納容器及びその管理システム並びに基板収納容器の管理方法 |
JP6882656B2 (ja) * | 2016-07-08 | 2021-06-02 | シンフォニアテクノロジー株式会社 | ロードポート及びロードポートを備える基板搬送システム |
-
2018
- 2018-11-06 JP JP2018208981A patent/JP7256358B2/ja active Active
-
2019
- 2019-02-25 JP JP2019031789A patent/JP7295384B2/ja active Active
- 2019-05-23 KR KR1020190060782A patent/KR102730712B1/ko active Active
- 2019-05-23 TW TW108117924A patent/TWI821293B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004517463A (ja) * | 2000-08-15 | 2004-06-10 | アシスト テクノロジーズ インコーポレイテッド | キャリアモニター及び工場レベルでのキャリア管理システムと統合されたスマート装填ポート |
JP2005182635A (ja) * | 2003-12-22 | 2005-07-07 | Fujitsu Ltd | 品質改善システム |
JP2012190821A (ja) * | 2011-03-08 | 2012-10-04 | Hitachi Kokusai Electric Inc | 基板処理装置および群管理装置 |
JP2014116464A (ja) * | 2012-12-10 | 2014-06-26 | Tokyo Electron Ltd | 基板処理装置、基板処理システム及び搬送容器の異常検出方法 |
JP2019208001A (ja) * | 2018-05-24 | 2019-12-05 | シンフォニアテクノロジー株式会社 | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7256358B2 (ja) | 2023-04-12 |
JP7295384B2 (ja) | 2023-06-21 |
TW202003353A (zh) | 2020-01-16 |
JP2019208001A (ja) | 2019-12-05 |
TWI821293B (zh) | 2023-11-11 |
KR102730712B1 (ko) | 2024-11-18 |
KR20190134523A (ko) | 2019-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10978325B2 (en) | Substrate storage container management system, load port, and substrate storage container management method | |
JP7295384B2 (ja) | 基板収納容器管理システム、ロードポート、基板収納容器管理方法 | |
US11348814B2 (en) | Transfer abnormality detection system and transfer abnormality detection method | |
US11929271B2 (en) | Apparatus and method for inspecting wafer carriers | |
US9960065B2 (en) | Substrate processing apparatus for managing transfer state of substrate gas storage container based on supply flow rate | |
US10720356B2 (en) | Substrate processing apparatus and method of transferring substrate | |
US11597607B2 (en) | Automated material handling system having carrier pollution management function | |
US20070010906A1 (en) | Apparatus and system for monitoring a substrate processing, program for monitoring the processing and storage medium storing same | |
US20090053017A1 (en) | Storage and purge system for semiconductor wafers | |
US11662373B2 (en) | Substrate storage container management system, load port, and substrate storage container management method | |
US11521879B2 (en) | Load port apparatus, semiconductor manufacturing apparatus, and method of controlling atmosphere in pod | |
US20210249292A1 (en) | Load port module | |
US6658917B2 (en) | Air-sampling carrier, apparatus and method for analyzing air in a semiconductor process tool | |
US8639367B2 (en) | Substrate processing system | |
KR102377504B1 (ko) | 반도체 웨이퍼 제조 시스템 및 제어 방법 | |
TWI884141B (zh) | 傳送異常檢測系統和傳送異常檢測方法 | |
CN110379753B (zh) | 基板传输系统、存储介质以及基板传输方法 | |
JP4712462B2 (ja) | 基板処理監視装置、基板処理監視システム、基板処理監視プログラム及び記録媒体 | |
WO2006016435A1 (ja) | 処理システムおよび処理方法、ならびにコンピュータ読取可能な記憶媒体およびコンピュータプログラム | |
US20250054795A1 (en) | Shelf status determination | |
US20240304477A1 (en) | Systems and methods for monitoring of a controlled environment in a substrate processing system | |
WO2006016436A1 (ja) | 制御システム、制御方法、および処理システム、ならびにコンピュータ読取可能な記憶媒体およびコンピュータプログラム | |
KR101958192B1 (ko) | 파티클 감지센서를 포함하는 웨이퍼 가공장치 | |
KR102305322B1 (ko) | 진공 흡착 장치의 오류 검출 방법 및 진공 흡착 장치의 오류 검출 시스템 | |
KR20250105750A (ko) | Ai 기반의 반도체 공정 관제시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211214 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230222 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230509 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230522 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7295384 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |