KR102466931B1 - 봉지용 필름 및 그 경화물, 및 전자 장치 - Google Patents

봉지용 필름 및 그 경화물, 및 전자 장치 Download PDF

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Publication number: KR102466931B1
Authority: KR; South Korea
Prior art keywords: component; mass; film; sealing; epoxy resin
Prior art date: 2016-11-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

KR1020197014014A

Other languages

English (en)

Korean (ko)

Other versions

KR20190080892A (ko

Inventor

도모요 가네코

다이스케 후지모토

유타카 노무라

히로쿠니 오기하라

유스케 와타세

Original Assignee

쇼와덴코머티리얼즈가부시끼가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-11-18

Filing date

2017-11-02

Publication date

2022-11-11

2017-11-02 Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤

2019-07-08 Publication of KR20190080892A publication Critical patent/KR20190080892A/ko

2022-11-11 Application granted granted Critical

2022-11-11 Publication of KR102466931B1 publication Critical patent/KR102466931B1/ko

Status Active legal-status Critical Current

2037-11-02 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Medicinal Chemistry (AREA)
Health & Medical Sciences (AREA)
Organic Chemistry (AREA)
Polymers & Plastics (AREA)
Chemical Kinetics & Catalysis (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Manufacturing & Machinery (AREA)
Power Engineering (AREA)
General Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Computer Hardware Design (AREA)
Materials Engineering (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Epoxy Resins (AREA)
Compositions Of Macromolecular Compounds (AREA)

KR1020197014014A 2016-11-18 2017-11-02 봉지용 필름 및 그 경화물, 및 전자 장치 Active KR102466931B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2016-225075		2016-11-18
JP2016225075		2016-11-18
PCT/JP2017/039793 WO2018092606A1 (ja)	2016-11-18	2017-11-02	封止用フィルム及びその硬化物、並びに、電子装置

Publications (2)

Publication Number	Publication Date
KR20190080892A KR20190080892A (ko)	2019-07-08
KR102466931B1 true KR102466931B1 (ko)	2022-11-11

Family

ID=62146293

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020197014014A Active KR102466931B1 (ko)	2016-11-18	2017-11-02	봉지용 필름 및 그 경화물, 및 전자 장치

Country Status (5)

Country	Link
JP (1)	JP7103225B2 (zh)
KR (1)	KR102466931B1 (zh)
CN (1)	CN109983052B (zh)
TW (1)	TWI738912B (zh)
WO (1)	WO2018092606A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN112771114B (zh) *	2018-09-27	2024-03-15	株式会社力森诺科	密封用树脂组合物、电子部件装置及电子部件装置的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2016072463A1 (ja) *	2014-11-07	2016-05-12	日立化成株式会社	封止フィルム用樹脂組成物、封止フィルム、支持体付き封止フィルム、及び電子装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH11106474A (ja) *	1997-10-03	1999-04-20	Hitachi Chem Co Ltd	半導体封止用液状エポキシ樹脂組成物
JP2000007891A (ja) *	1998-04-22	2000-01-11	Asahi Chiba Kk	新規液状エポキシ樹脂組成物、その硬化物並びに半導体封止装置
JP4568940B2 (ja)	1999-04-13	2010-10-27	日立化成工業株式会社	封止用エポキシ樹脂組成物及び電子部品装置
JP2003034747A (ja) *	2001-05-14	2003-02-07	Hitachi Chem Co Ltd	液状エポキシ樹脂組成物及び電子部品装置
JP2003002951A (ja) *	2001-06-25	2003-01-08	New Japan Chem Co Ltd	液状エポキシ樹脂組成物の薄膜硬化物
JP4433368B2 (ja) *	2003-04-08	2010-03-17	ジャパンエポキシレジン株式会社	エポキシ樹脂粒状化物及びその製造方法
JP2007182562A (ja)	2005-12-08	2007-07-19	Hitachi Chem Co Ltd	電子部品用液状樹脂組成物及び電子部品装置
KR101031151B1 (ko) *	2006-10-06	2011-04-27	히다치 가세고교 가부시끼가이샤	전자 부품 밀봉용 액상 수지 조성물 및 이것을 이용한 전자 부품 장치
WO2010047411A1 (ja) *	2008-10-21	2010-04-29	味の素株式会社	熱硬化性樹脂組成物
TWI621638B (zh)	2008-11-28	2018-04-21	味之素股份有限公司	Resin composition
JP2011190440A (ja) *	2010-02-18	2011-09-29	Hitachi Chem Co Ltd	電子部品用液状樹脂組成物及び電子部品装置
JP5308409B2 (ja)	2010-07-27	2013-10-09	パナソニック株式会社	電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品
JP6116852B2 (ja) *	2012-10-12	2017-04-19	株式会社日本触媒	液状硬化性樹脂組成物及びその用途
JP6226347B2 (ja) *	2013-06-19	2017-11-08	エルジー・ケム・リミテッド	封止材フィルムの信頼寿命を評価する方法及び上記フィルムの信頼度評価装置
WO2016117237A1 (ja) *	2015-01-21	2016-07-28	太陽インキ製造株式会社	熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6511840B2 (ja)	2015-02-03	2019-05-15	日立化成株式会社	エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物及び電子部品装置
JP6493287B2 (ja)	2015-05-20	2019-04-03	信越化学工業株式会社	液状樹脂組成物
JP2015180760A (ja) *	2015-07-22	2015-10-15	日立化成株式会社	液状エポキシ樹脂組成物及び電子部品装置

2017
- 2017-11-02 KR KR1020197014014A patent/KR102466931B1/ko active Active
- 2017-11-02 JP JP2018551572A patent/JP7103225B2/ja active Active
- 2017-11-02 WO PCT/JP2017/039793 patent/WO2018092606A1/ja active Application Filing
- 2017-11-02 CN CN201780071132.5A patent/CN109983052B/zh active Active
- 2017-11-07 TW TW106138398A patent/TWI738912B/zh active

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2016072463A1 (ja) *	2014-11-07	2016-05-12	日立化成株式会社	封止フィルム用樹脂組成物、封止フィルム、支持体付き封止フィルム、及び電子装置

Also Published As

Publication number	Publication date
TWI738912B (zh)	2021-09-11
KR20190080892A (ko)	2019-07-08
TW201825587A (zh)	2018-07-16
CN109983052A (zh)	2019-07-05
WO2018092606A1 (ja)	2018-05-24
CN109983052B (zh)	2021-07-23
JPWO2018092606A1 (ja)	2019-10-17
JP7103225B2 (ja)	2022-07-20

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JP2020200478A (ja)	2020-12-17	樹脂組成物、硬化物、封止用フィルム及び封止構造体
KR102505321B1 (ko)	2023-03-06	봉지용 필름, 봉지 구조체 및 봉지 구조체의 제조 방법
KR102466931B1 (ko)	2022-11-11	봉지용 필름 및 그 경화물, 및 전자 장치
JP6717005B2 (ja)	2020-07-01	樹脂組成物、硬化物、樹脂フィルム、封止材及び封止構造体
TWI733014B (zh)	2021-07-11	密封薄膜、電子零件裝置的製造方法及電子零件裝置
KR102441766B1 (ko)	2022-09-07	봉지용 필름 및 봉지 구조체, 및 이들의 제조 방법
JP2009013309A (ja)	2009-01-22	エポキシ樹脂組成物およびそれを用いて得られる電子部品
JP6390434B2 (ja)	2018-09-19	電子部品埋め込み用樹脂フィルムの製造方法、電子部品装置の製造方法
JP6544427B2 (ja)	2019-07-17	熱硬化性樹脂組成物、硬化物、樹脂シート、封止構造体及びその製造方法、並びに、電子部品装置及びその製造方法
JP2018064054A (ja)	2018-04-19	封止材、及び、封止構造体の製造方法
WO2024190566A1 (ja)	2024-09-19	封止フィルム及びその製造方法、並びに、電子部品装置及びその製造方法

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2019-05-15	PA0105	International application	Patent event date: 20190515 Patent event code: PA01051R01D Comment text: International Patent Application
2019-07-08	PG1501	Laying open of application
2020-06-10	A201	Request for examination
2020-06-10	PA0201	Request for examination	Patent event code: PA02012R01D Patent event date: 20200610 Comment text: Request for Examination of Application
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2021-10-12	PE0902	Notice of grounds for rejection	Comment text: Notification of reason for refusal Patent event date: 20211012 Patent event code: PE09021S01D
2022-04-19	E902	Notification of reason for refusal
2022-04-19	PE0902	Notice of grounds for rejection	Comment text: Notification of reason for refusal Patent event date: 20220419 Patent event code: PE09021S01D
2022-10-18	E701	Decision to grant or registration of patent right
2022-10-18	PE0701	Decision of registration	Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20221018
2022-11-09	GRNT	Written decision to grant
2022-11-09	PR0701	Registration of establishment	Comment text: Registration of Establishment Patent event date: 20221109 Patent event code: PR07011E01D
2022-11-09	PR1002	Payment of registration fee	Payment date: 20221109 End annual number: 3 Start annual number: 1
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