KR101967965B1 - 열가소성 수지 조성물 및 이로부터 제조된 성형품 - Google Patents
열가소성 수지 조성물 및 이로부터 제조된 성형품 Download PDFInfo
- Publication number
- KR101967965B1 KR101967965B1 KR1020160184170A KR20160184170A KR101967965B1 KR 101967965 B1 KR101967965 B1 KR 101967965B1 KR 1020160184170 A KR1020160184170 A KR 1020160184170A KR 20160184170 A KR20160184170 A KR 20160184170A KR 101967965 B1 KR101967965 B1 KR 101967965B1
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- KR
- South Korea
- Prior art keywords
- thermoplastic resin
- resin composition
- weight
- light stabilizer
- aromatic vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 85
- 239000011342 resin composition Substances 0.000 title claims abstract description 68
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 45
- 239000004611 light stabiliser Substances 0.000 claims abstract description 44
- 239000011787 zinc oxide Substances 0.000 claims abstract description 28
- 239000012964 benzotriazole Substances 0.000 claims abstract description 25
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 24
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 22
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 21
- 230000000844 anti-bacterial effect Effects 0.000 claims abstract description 18
- 239000002245 particle Substances 0.000 claims abstract description 13
- 150000001412 amines Chemical class 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims description 50
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- -1 2H-benzotriazol-2-yl Chemical group 0.000 claims description 12
- 230000000845 anti-microbial effect Effects 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- 241000588724 Escherichia coli Species 0.000 claims description 6
- 241000191967 Staphylococcus aureus Species 0.000 claims description 6
- 238000002441 X-ray diffraction Methods 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical group C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920006164 aromatic vinyl copolymer Polymers 0.000 claims description 4
- 238000011156 evaluation Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- OTCWVYFQGYOYJO-UHFFFAOYSA-N 1-o-methyl 10-o-(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound COC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 OTCWVYFQGYOYJO-UHFFFAOYSA-N 0.000 claims description 3
- 238000005424 photoluminescence Methods 0.000 claims description 3
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 claims description 2
- 229940116351 sebacate Drugs 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- GAHIGLYNXRPURS-UHFFFAOYSA-N 5-oxo-2,3,4-tris(2,2,6,6-tetramethylpiperidin-4-yl)-5-tridecan-4-yloxypentane-1,2,3-tricarboxylic acid Chemical compound C1C(C)(C)NC(C)(C)CC1C(C(CC(O)=O)(C1CC(C)(C)NC(C)(C)C1)C(O)=O)(C(O)=O)C(C(=O)OC(CCC)CCCCCCCCC)C1CC(C)(C)NC(C)(C)C1 GAHIGLYNXRPURS-UHFFFAOYSA-N 0.000 claims 1
- REHOYNZBGWGWEU-UHFFFAOYSA-N CC(C)(CC1)N(C)C(C)(C)C1C(C(C(C(C1C(C)(C)N(C)C(C)(C)CC1)(C1C(C)(C)N(C)C(C)(C)CC1)C(O)=O)C(O)=O)C(O)=O)(C1C(C)(C)N(C)C(C)(C)CC1)C(O)=O Chemical compound CC(C)(CC1)N(C)C(C)(C)C1C(C(C(C(C1C(C)(C)N(C)C(C)(C)CC1)(C1C(C)(C)N(C)C(C)(C)CC1)C(O)=O)C(O)=O)C(O)=O)(C1C(C)(C)N(C)C(C)(C)CC1)C(O)=O REHOYNZBGWGWEU-UHFFFAOYSA-N 0.000 claims 1
- YJRDBBUNNGXHGJ-UHFFFAOYSA-N CCCCCCCCCCC(C(C(CC1CC(C)(C)N(C)C(C)(C)C1)C1CC(C)(C)N(C)C(C)(C)C1)C1CC(C)(C)N(C)C(C)(C)C1)C(O)=O Chemical compound CCCCCCCCCCC(C(C(CC1CC(C)(C)N(C)C(C)(C)C1)C1CC(C)(C)N(C)C(C)(C)C1)C1CC(C)(C)N(C)C(C)(C)C1)C(O)=O YJRDBBUNNGXHGJ-UHFFFAOYSA-N 0.000 claims 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 claims 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 claims 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 239000008188 pellet Substances 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- CYXPNPIFQAJTPE-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(3,4,4-trimethylpentan-2-yl)phenol Chemical group N=1N(N=C2C=1C=CC=C2)C1=C(C=CC(=C1)C(C(C(C)(C)C)C)C)O CYXPNPIFQAJTPE-UHFFFAOYSA-N 0.000 description 3
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 2
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 2
- TVONJMOVBKMLOM-UHFFFAOYSA-N 2-methylidenebutanenitrile Chemical compound CCC(=C)C#N TVONJMOVBKMLOM-UHFFFAOYSA-N 0.000 description 2
- RLFXJQPKMZNLMP-UHFFFAOYSA-N 2-phenylprop-2-enenitrile Chemical compound N#CC(=C)C1=CC=CC=C1 RLFXJQPKMZNLMP-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000012258 culturing Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 229920003244 diene elastomer Polymers 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000010557 suspension polymerization reaction Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- KYPOHTVBFVELTG-OWOJBTEDSA-N (e)-but-2-enedinitrile Chemical compound N#C\C=C\C#N KYPOHTVBFVELTG-OWOJBTEDSA-N 0.000 description 1
- WAEOXIOXMKNFLQ-UHFFFAOYSA-N 1-methyl-4-prop-2-enylbenzene Chemical group CC1=CC=C(CC=C)C=C1 WAEOXIOXMKNFLQ-UHFFFAOYSA-N 0.000 description 1
- XDDLRVYDQACVBC-UHFFFAOYSA-N 10-oxo-10-(1,2,2,6,6-pentamethylpiperidin-4-yl)oxydecanoic acid Chemical compound CN1C(C)(C)CC(OC(=O)CCCCCCCCC(O)=O)CC1(C)C XDDLRVYDQACVBC-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- KCORUHCHWYBXCB-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-[[3-(benzotriazol-2-yl)-2-hydroxy-4-(2,4,4-trimethylpentan-2-yl)phenyl]methyl]-3-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound OC1=C(C=CC(=C1N1N=C2C(=N1)C=CC=C2)C(C)(C)CC(C)(C)C)CC1=C(C(=C(C=C1)C(C)(C)CC(C)(C)C)N1N=C2C(=N1)C=CC=C2)O KCORUHCHWYBXCB-UHFFFAOYSA-N 0.000 description 1
- LHNRCWZAYWSNKN-UHFFFAOYSA-N 2-[3-[[3-(benzotriazol-2-yl)-5-(2,4,4-trimethylpentan-2-yl)phenyl]methyl]-5-(2,4,4-trimethylpentan-2-yl)phenyl]benzotriazole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C=C(C=C(C=2)N2N=C3C=CC=CC3=N2)C(C)(C)CC(C)(C)C)=C1 LHNRCWZAYWSNKN-UHFFFAOYSA-N 0.000 description 1
- RESMUGJMBRTXFZ-UHFFFAOYSA-N 4-[1,3-bis(2,2,6,6-tetramethylpiperidin-4-yl)heptadecan-2-yl]-2,2,6,6-tetramethylpiperidine Chemical compound CC1(NC(CC(C1)CC(C(CCCCCCCCCCCCCC)C1CC(NC(C1)(C)C)(C)C)C1CC(NC(C1)(C)C)(C)C)(C)C)C RESMUGJMBRTXFZ-UHFFFAOYSA-N 0.000 description 1
- VPOQXYQZFBITQK-UHFFFAOYSA-N 5-oxo-2,3,4-tris(1,2,2,6,6-pentamethylpiperidin-4-yl)-5-tridecan-4-yloxypentane-1,2,3-tricarboxylic acid Chemical compound C1C(C)(C)N(C)C(C)(C)CC1C(C(CC(O)=O)(C1CC(C)(C)N(C)C(C)(C)C1)C(O)=O)(C(O)=O)C(C(=O)OC(CCC)CCCCCCCCC)C1CC(C)(C)N(C)C(C)(C)C1 VPOQXYQZFBITQK-UHFFFAOYSA-N 0.000 description 1
- CBXLKTJBDANMLE-UHFFFAOYSA-N 5-oxo-5-(2,2,6,6-tetramethylpiperidin-4-yl)oxypentane-1,2,3-tricarboxylic acid Chemical compound CC1(C)CC(OC(=O)CC(C(CC(O)=O)C(O)=O)C(O)=O)CC(C)(C)N1 CBXLKTJBDANMLE-UHFFFAOYSA-N 0.000 description 1
- QUEVEGKBMHADSO-UHFFFAOYSA-N 6-oxo-6-(1,2,2,6,6-pentamethylpiperidin-4-yl)oxy-3,4-bis[(1,2,2,6,6-pentamethylpiperidin-4-yl)oxycarbonyl]hexanoic acid Chemical compound CC(C)(C1)N(C)C(C)(C)CC1OC(CC(C(CC(O)=O)C(OC1CC(C)(C)N(C)C(C)(C)C1)=O)C(OC1CC(C)(C)N(C)C(C)(C)C1)=O)=O QUEVEGKBMHADSO-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- WUPCFMITFBVJMS-UHFFFAOYSA-N tetrakis(1,2,2,6,6-pentamethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 WUPCFMITFBVJMS-UHFFFAOYSA-N 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
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- C—CHEMISTRY; METALLURGY
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Abstract
Description
(C1) | (C2) | |
평균 입자 크기 (㎛) | 1.2 | 1.1 |
BET 표면적 (m2/g) | 4 | 15 |
순도 (%) | 99 | 97 |
PL 크기비(B/A) | 0.28 | 9.8 |
미소결정 크기 (Å) | 1,417 | 503 |
실시예 | ||||||
1 | 2 | 3 | 4 | 5 | ||
(A) (중량%) |
(A1) | 30 | 30 | 30 | 30 | 30 |
(A2) | 70 | 70 | 70 | 70 | 70 | |
(B) (중량부) |
(B1) | 0.2 | 3 | 0.1 | 0.2 | 0.2 |
(B2) | 0.3 | 3 | 0.1 | 0.3 | 0.3 | |
(B3) | - | - | - | - | - | |
(C) (중량부) |
(C1) | 2 | 2 | 2 | 0.5 | 10 |
(C2) | - | - | - | - | - | |
색상 변화 (ΔE) | 5.0 | 4.0 | 6.0 | 5.0 | 4.0 | |
노치 아이조드 충격강도 | 25 | 25 | 25 | 25 | 20 | |
아웃-가스 발생량 | 2,500 | 3,000 | 2,300 | 2,500 | 2,500 | |
항균 활성치 (대장균) | 4.0 | 4.0 | 4.0 | 3.0 | 4.0 | |
항균 활성치 (포도상구균) | 6.5 | 6.5 | 6.5 | 5.0 | 6.5 |
비교예 | ||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | ||
(A) (중량%) |
(A1) | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
(A-2) | 70 | 70 | 70 | 70 | 70 | 70 | 70 | |
(B) (중량부) |
(B1) | - | 0.5 | 0.2 | 0.2 | - | 0.2 | |
(B2) | 0.5 | - | 0.3 | - | 0.3 | - | 0.5 | |
(B3) | - | - | - | 0.3 | 0.2 | |||
(C) (중량부) |
(C1) | 2 | 2 | - | 2 | 2 | - | |
(C2) | - | - | 2 | - | - | - | ||
색상 변화 (ΔE) | 6.0 | 6.0 | 11.0 | 9.0 | 9.2 | 12.0 | 9.0 | |
노치 아이조드 충격강도 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | |
아웃-가스 발생량 | 4,000 | 5,000 | 9,000 | 8,000 | 8,000 | 10,000 | 9,000 | |
항균 활성치 (대장균) | 4.0 | 4.0 | 2.5 | 4.0 | 4.0 | 0 | 0 | |
항균 활성치 (포도상구균) | 6.5 | 6.5 | 4.0 | 6.5 | 6.5 | 0 | 0 |
Claims (15)
- 고무변성 비닐계 그라프트 공중합체 및 방향족 비닐계 공중합체 수지를 포함하는 열가소성 수지;
HALS(hindered amine light stabilizer)계 광안정제 및 벤조트리아졸계 자외선 안정제를 포함하는 광안정제; 및
평균 입자 크기가 0.5 내지 3 ㎛이고, 비표면적 BET가 1 내지 10 m2/g인 산화아연을 포함하며,
상기 산화아연은 X선 회절(X-ray diffraction, XRD) 분석 시, 피크 위치(peak position) 2θ 값이 35 내지 37° 범위이고, 하기 식 1에 의한 미소결정의 크기(crystallite size) 값이 1,000 내지 2,000 Å인 것을 특징으로 하는 열가소성 수지 조성물:
[식 1]
미소결정 크기(D) =
상기 식 1에서, K는 형상 계수(shape factor)이고, λ는 X선 파장(X-ray wavelength)이고, β는 X선 회절 피크(peak)의 FWHM 값(degree)이며, θ는 피크 위치 값(peak position degree)이다.
- 제1항에 있어서, 상기 열가소성 수지 조성물은 상기 고무변성 비닐계 그라프트 공중합체 15 내지 50 중량% 및 상기 방향족 비닐계 공중합체 수지 50 내지 85 중량%를 포함하는 열가소성 수지 100 중량부; 상기 HALS계 광안정제 0.05 내지 5 중량부; 상기 벤조트리아졸계 자외선 안정제 0.05 내지 5 중량부; 및 상기 산화아연 0.1 내지 15 중량부를 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 고무변성 비닐계 그라프트 공중합체는 아크릴레이트계 고무질 중합체를 제외한 고무질 중합체에 방향족 비닐계 단량체 및 시안화 비닐계 단량체를 포함하는 단량체 혼합물이 그라프트 중합된 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 방향족 비닐계 공중합체 수지는 방향족 비닐계 단량체 및 상기 방향족 비닐계 단량체와 공중합 가능한 단량체의 중합체인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 HALS계 광안정제는 비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트, 비스-(N-옥틸옥시-테트라메틸)피페리디닐세바케이트, 비스(1,2,2,6,6-펜타메틸-4-피페리딜)세바케이트, 메틸-1,2,2,6,6-펜타메틸-4-피페리딜세바케이트, 테트라키스(2,2,6,6-테트라메틸-4-피페리딜)-1,2,3,4-부탄 테트라카르복실레이트, 테트라키스(1,2,2,6,6-펜타메틸-4-피페리딜)-1,2,3,4-부탄 테트라카르복실레이트, 1,2,3-트리스(1,2,2,6,6-펜타메틸-4-피페리딜)-4-트리데실 부탄-1,2,3,4-테트라카르복실레이트, 1,2,3-트리스(2,2,6,6-테트라메틸-4-피페리딜)-4-트리데실 부탄-1,2,3,4-테트라카르복실레이트, 및 1,2,2,6,6-펜타메틸-4-피페리디놀과 β,β,β',β'-테트라메틸-3,9-(2,4,8,10-테트라옥사스피로[5.5]운데칸)디에탄올과의 축합물 중 1종 이상을 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 벤조트리아졸계 자외선 안정제는 2-(2H-벤조트리아졸-2-일)-4-(1,2,3,3-테트라메틸부틸)페놀, 2-(2'-히드록시-5'-메틸페닐벤조트리아졸), 2-(2'-히드록시-3,5'-2-(2'-히드록시-3,5'-벤조트리아졸), 2-(2'-히드록시-3'-tert-부틸-5'-메틸페닐)-5-클로로벤조트리아졸), 2-(2'-히드록시-3,5'-디-tert-부틸페닐)-5-클로로벤조트리아졸, 2-(2'-히드록시-3,5'-디-tert-아밀페닐)벤조트리아졸, 2-(2H-벤조트리아졸-2-일)-4-(1,1,3,3-테트라메틸부틸)페놀, 2-[2'-히드록시-3,5'-디(1,1-디메틸벤질)페닐]-2H-벤조트리아졸, 및 비스[2-히드록시-5-tert-옥틸-3-(벤조트리아졸-2-일)페닐]메탄 중 1종 이상을 포함하는 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 산화아연은 광 발광(Photo Luminescence) 측정 시, 370 내지 390 nm 영역의 피크 A와 450 내지 600 nm 영역의 피크 B의 크기비(B/A)가 0 내지 1인 것을 특징으로 하는 열가소성 수지 조성물.
- 삭제
- 제1항에 있어서, 상기 HALS계 광안정제 및 상기 벤조트리아졸계 자외선 안정제의 중량비(HALS계 광안정제:벤조트리아졸계 자외선 안정제)는 1 : 0.9 내지 1 : 2인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 광안정제 및 상기 산화아연의 중량비(광안정제:산화아연)는 1 : 0.3 내지 1 : 20인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 열가소성 수지 조성물은 50 mm × 90 mm × 3 mm 크기 사출 시편에 대해 ASTM D4459에 의거하여 초기 색상(L0 *, a0 *, b0 *)을 측정하고, 85℃, 상대습도 85%의 조건에서 300시간 노출 후 동일한 방법으로 항온 항습 시험 후 색상(L1 *, a1 *, b1 *)을 측정한 다음, 하기 식 2에 따라 산출한 색상 변화(ΔE)가 7 이하인 것을 특징으로 하는 열가소성 수지 조성물:
[식 2]
색상 변화(ΔE) =
상기 식 2에서, ΔL*는 항온 항습 시험 전후의 L* 값의 차이(L1 *-L0 *)이고, Δa*는 항온 항습 시험 전후의 a* 값의 차이(a1 *- a0 *) 이며, Δb*는 항온 항습 시험 전후의 b* 값의 차이(b1 *- b0 *)이다.
- 제1항에 있어서, 상기 열가소성 수지 조성물은 ASTM D256에 의거하여 두께 1/8" 시편으로 측정한 노치 아이조드 충격강도가 15 내지 40 kgf·cm/cm인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 열가소성 수지 조성물은 시료 3g을 250℃에서 2시간 동안 가열 시 발생하는 아웃-가스(out-gas)량이 3,000 ppm 이하인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항에 있어서, 상기 열가소성 수지 조성물은 JIS Z 2801 항균 평가법에 의거하여, 5 cm × 5 cm 크기 시편에 황색포도상구균 및 대장균을 접종하고, 35℃, RH 90% 조건에서 24시간 배양 후, 측정한 항균 활성치가 각각 독립적으로 2 내지 7인 것을 특징으로 하는 열가소성 수지 조성물.
- 제1항 내지 제7항, 제9항 내지 제14항 중 어느 한 항에 따른 열가소성 수지 조성물로부터 형성되는 것을 특징으로 하는 성형품.
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