KR101798651B1 - 감방사선성 수지 조성물 - Google Patents
감방사선성 수지 조성물 Download PDFInfo
- Publication number
- KR101798651B1 KR101798651B1 KR1020090085654A KR20090085654A KR101798651B1 KR 101798651 B1 KR101798651 B1 KR 101798651B1 KR 1020090085654 A KR1020090085654 A KR 1020090085654A KR 20090085654 A KR20090085654 A KR 20090085654A KR 101798651 B1 KR101798651 B1 KR 101798651B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- acid
- radiation
- copolymer
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
Claims (8)
- 산해리성기 함유 수지, 감방사선성 산발생제 및 용제를 함유하며,상기 산해리성기 함유 수지는 산해리성기를 갖는 하기 화학식 1의 반복 단위를 포함하는 공중합체를 함유하고,상기 산해리성기를 갖는 하기 화학식 1의 반복 단위는 상기 공중합체를 구성하는 전체 반복 단위에 대하여 55 몰% 초과 내지 58.6 몰% 이하로 함유되고,상기 공중합체는 상기 산해리성기 함유 수지 전체에 대하여 90 질량% 이상 함유되는 것을 특징으로 하는 감방사선성 수지 조성물.<화학식 1>(화학식 1에서, R1은 서로 독립적으로 수소 원자, 메틸기 또는 트리플루오로메틸기를 나타내고, R2는 서로 독립적으로 수소 원자 또는 탄소수 1 내지 4의 치환기를 가질 수도 있는 알킬기를 나타냄)
- 삭제
- 제1항에 있어서, 상기 감방사선성 산발생제가 하기 화학식 6 또는 7로 표시되는 감방사선성 산발생제를 포함하는 것을 특징으로 하는 감방사선성 수지 조성물.<화학식 6><화학식 7>(화학식 6에서, 각 R14는 서로 독립적으로 수소 원자, 불소 원자, 히드록실기, 탄소수 1 내지 10의 알킬기, 알콕실기 또는 탄소수 2 내지 11의 알콕시카르보닐기를 나타내고, 화학식 7에서, 각 R15는 서로 독립적으로 수소 원자 또는 탄소수 1 내지 4의 직쇄상 알킬기 또는 탄소수 3 또는 4의 분지상의 알킬기를 나타내고, n은 0 또는 1이고, R16 및 R17은 서로 독립적으로 수소 원자 또는 탄소수 1 내지 4의 직쇄상 알킬기 또는 탄소수 3 또는 4의 분지상의 알킬기를 나타내거나, 또는 R16과 R17이 서로 결합하여 화학식 중의 황 원자와 함께 3 내지 6원의 환상 구조를 형성하고 있고, 화학식 6 및 7에서, Y-는 황 원자 함유 음이온을 나타냄)
- 제3항에 있어서, 상기 감방사선성 산발생제가 상이한 3종 이상의 감방사선성 산발생제를 포함하는 것을 특징으로 하는 감방사선성 수지 조성물.
- 제1항에 있어서, 상기 산해리성기 함유 수지가 추가로 락톤 골격을 갖는 반복 단위를 포함하는 것을 특징으로 하는 감방사선성 수지 조성물.
- 제1항에 있어서, 추가로 산 확산 제어제를 함유하는 것을 특징으로 하는 감방사선성 수지 조성물.
- 제7항에 있어서, 산 확산 제어제로서 질소 함유 화합물을 함유하는 것을 특징으로 하는 감방사선성 수지 조성물.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008234271A JP5287065B2 (ja) | 2008-09-12 | 2008-09-12 | 感放射線性樹脂組成物 |
JPJP-P-2008-234271 | 2008-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100031477A KR20100031477A (ko) | 2010-03-22 |
KR101798651B1 true KR101798651B1 (ko) | 2017-11-16 |
Family
ID=42007536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090085654A Active KR101798651B1 (ko) | 2008-09-12 | 2009-09-11 | 감방사선성 수지 조성물 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8084188B2 (ko) |
JP (1) | JP5287065B2 (ko) |
KR (1) | KR101798651B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5544130B2 (ja) * | 2009-09-01 | 2014-07-09 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
US20120076996A1 (en) | 2010-09-28 | 2012-03-29 | Fujifilm Corporation | Resist composition, resist film therefrom and method of forming pattern therewith |
JP6461919B2 (ja) * | 2014-04-14 | 2019-01-30 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、該組成物を用いた感活性光線性又は感放射線性膜及びパターン形成方法、並びに電子デバイスの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007163834A (ja) | 2005-12-14 | 2007-06-28 | Jsr Corp | 感放射線性樹脂組成物 |
JP2007316553A (ja) * | 2006-05-29 | 2007-12-06 | Jsr Corp | 感放射線性樹脂組成物及びレジストパターン形成方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI277830B (en) * | 1999-01-28 | 2007-04-01 | Sumitomo Chemical Co | Resist composition |
JP4768152B2 (ja) | 2000-09-01 | 2011-09-07 | ダイセル化学工業株式会社 | フォトレジスト用高分子化合物及びフォトレジスト用樹脂組成物 |
JP2002201232A (ja) | 2000-10-27 | 2002-07-19 | Daicel Chem Ind Ltd | フォトレジスト用高分子化合物及びフォトレジスト用樹脂組成物 |
JP4727092B2 (ja) | 2001-09-10 | 2011-07-20 | 東京応化工業株式会社 | 化学増幅型レジスト組成物 |
JP2005031233A (ja) * | 2003-07-09 | 2005-02-03 | Tokyo Ohka Kogyo Co Ltd | レジスト組成物、積層体、及びレジストパターン形成方法 |
JP2005068418A (ja) | 2003-08-05 | 2005-03-17 | Jsr Corp | アクリル系重合体および感放射線性樹脂組成物 |
KR101109798B1 (ko) * | 2003-08-05 | 2012-03-13 | 제이에스알 가부시끼가이샤 | 아크릴계 중합체 및 감방사선성 수지 조성물 |
JP4188265B2 (ja) * | 2003-10-23 | 2008-11-26 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
JP4710762B2 (ja) * | 2006-08-30 | 2011-06-29 | Jsr株式会社 | 感放射線性樹脂組成物 |
JP2008107817A (ja) * | 2006-09-29 | 2008-05-08 | Fujifilm Corp | レジスト組成物およびこれを用いたパターン形成方法 |
JP2008139549A (ja) * | 2006-12-01 | 2008-06-19 | Fujifilm Corp | ポジ型感光性組成物、該ポジ型感光性組成物に使用される樹脂、該樹脂の製造に使用される重合性化合物及びポジ型感光性組成物を用いたパターン形成方法 |
JP4577354B2 (ja) * | 2007-12-18 | 2010-11-10 | Jsr株式会社 | ポジ型感放射線性樹脂組成物およびネガ型感放射線性樹脂組成物 |
-
2008
- 2008-09-12 JP JP2008234271A patent/JP5287065B2/ja active Active
-
2009
- 2009-09-11 US US12/557,529 patent/US8084188B2/en active Active
- 2009-09-11 KR KR1020090085654A patent/KR101798651B1/ko active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007163834A (ja) | 2005-12-14 | 2007-06-28 | Jsr Corp | 感放射線性樹脂組成物 |
JP2007316553A (ja) * | 2006-05-29 | 2007-12-06 | Jsr Corp | 感放射線性樹脂組成物及びレジストパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010066631A (ja) | 2010-03-25 |
JP5287065B2 (ja) | 2013-09-11 |
KR20100031477A (ko) | 2010-03-22 |
US8084188B2 (en) | 2011-12-27 |
US20100068647A1 (en) | 2010-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102150082B (zh) | 放射线敏感性树脂组合物 | |
KR20170107415A (ko) | 감방사선성 수지 조성물 | |
JPWO2008114644A1 (ja) | レジストパターン形成方法及びそれに用いるレジストパターン不溶化樹脂組成物 | |
JPWO2005108444A1 (ja) | ラクトン系共重合体および感放射線性樹脂組成物 | |
JP2007079552A (ja) | 感放射線性樹脂組成物 | |
JP3952946B2 (ja) | (メタ)アクリル系重合体および感放射線性樹脂組成物 | |
KR20100054848A (ko) | 감방사선성 조성물 | |
JP5003548B2 (ja) | 半導体レジスト用重合体及び感放射線性組成物 | |
WO2010123101A1 (ja) | 感放射線性樹脂組成物 | |
JP5163345B2 (ja) | アクリル系共重合体および感放射線性樹脂組成物 | |
KR101798651B1 (ko) | 감방사선성 수지 조성물 | |
JP5051232B2 (ja) | 感放射線性樹脂組成物及びパターン形成方法 | |
JP4076360B2 (ja) | 感放射線性樹脂組成物 | |
KR20100058601A (ko) | 감방사선성 조성물 | |
JP2006045387A (ja) | ピラゾール誘導体、連鎖移動剤、酸解離性基含有重合体および感放射線性樹脂組成物 | |
JP2007231202A (ja) | 共重合体および感放射線性樹脂組成物 | |
JP2004176049A (ja) | アクリル系共重合体および感放射線性樹脂組成物 | |
JP2007052182A (ja) | 感放射線性樹脂組成物 | |
JP4134685B2 (ja) | 感放射線性樹脂組成物 | |
JP2005002248A (ja) | アクリル系重合体および感放射線性樹脂組成物 | |
JP2007112898A (ja) | 共重合体及び感放射線性樹脂組成物 | |
JP2005068418A (ja) | アクリル系重合体および感放射線性樹脂組成物 | |
JP2005139250A (ja) | 酸解離性基含有重合体および感放射線性樹脂組成物 | |
JP2004203898A (ja) | アクリル系重合体および感放射線性樹脂組成物 | |
JP3968509B2 (ja) | 感放射線性樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20090911 |
|
PG1501 | Laying open of application | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20140904 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20090911 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160407 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20170118 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20160407 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
AMND | Amendment | ||
PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20170118 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20160705 Comment text: Amendment to Specification, etc. |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20170313 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
PX0701 | Decision of registration after re-examination |
Patent event date: 20170928 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20170512 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20170213 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20170118 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20160705 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
|
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20171110 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20171110 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20201030 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20211029 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20221028 Start annual number: 6 End annual number: 6 |