KR101172942B1 - 사파이어 기판 및 그것을 이용하는 질화물 반도체 발광 소자 및 질화물 반도체 발광 소자의 제조 방법 - Google Patents
사파이어 기판 및 그것을 이용하는 질화물 반도체 발광 소자 및 질화물 반도체 발광 소자의 제조 방법 Download PDFInfo
- Publication number
- KR101172942B1 KR101172942B1 KR1020097010064A KR20097010064A KR101172942B1 KR 101172942 B1 KR101172942 B1 KR 101172942B1 KR 1020097010064 A KR1020097010064 A KR 1020097010064A KR 20097010064 A KR20097010064 A KR 20097010064A KR 101172942 B1 KR101172942 B1 KR 101172942B1
- Authority
- KR
- South Korea
- Prior art keywords
- sapphire substrate
- growth
- plane
- nitride semiconductor
- crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 52
- 239000010980 sapphire Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 27
- 150000004767 nitrides Chemical class 0.000 title claims description 28
- 239000004065 semiconductor Substances 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000013078 crystal Substances 0.000 claims abstract description 50
- 238000005520 cutting process Methods 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 8
- 238000005121 nitriding Methods 0.000 claims description 4
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 239000012808 vapor phase Substances 0.000 abstract description 4
- 239000012071 phase Substances 0.000 abstract description 3
- 230000004927 fusion Effects 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000005428 wave function Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000004729 solvothermal method Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910010093 LiAlO Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
- H01L21/0243—Surface structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02609—Crystal orientation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (8)
- 청구항 1 또는 청구항 2에 기재된 사파이어 기판을 이용하는 것을 특징으로 하는 질화물 반도체 발광 소자.
- 결정 성장용으로 사파이어 기판을 이용하고, 그 사파이어 기판 상에 질화물 반도체 발광 소자를 결정 성장시키는 질화물 반도체 발광 소자의 제조 방법에 있어서,상기 결정 성장의 공정 전에, 성장면으로서 상기 사파이어 기판의 m면을 이용함에 있어서, 상기 m면으로부터 미리 정하는 각도만큼 경사진 면을 작성하는 절단 공정과,상기 절단 공정 후에, 상기 절단 데미지를 경감하는 어닐 공정과,상기 어닐에 의해 산화한 상기 성장면을 알루미늄 리치로 함으로써, 질화를 저지하는 공정을 포함하며,상기 경사의 각도는,방향에 대해서 0.2~10도인 것을 특징으로 하는 질화물 반도체 발광 소자의 제조 방법.
- 청구항 4에 있어서,상기 질화를 저지하는 공정이, 어닐 공정 후의 경사진 면에, 트리메틸알루미늄을 흐르게 하는 공정인 질화물 반도체 발광 소자의 제조 방법.
- 삭제
- 삭제
- 삭제
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006286096 | 2006-10-20 | ||
JPJP-P-2006-286096 | 2006-10-20 | ||
PCT/JP2007/070449 WO2008047907A1 (en) | 2006-10-20 | 2007-10-19 | Sapphire substrate, nitride semiconductor luminescent element using the sapphire substrate, and method for manufacturing the nitride semiconductor luminescent element |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090068374A KR20090068374A (ko) | 2009-06-26 |
KR101172942B1 true KR101172942B1 (ko) | 2012-08-14 |
Family
ID=39314117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097010064A Active KR101172942B1 (ko) | 2006-10-20 | 2007-10-19 | 사파이어 기판 및 그것을 이용하는 질화물 반도체 발광 소자 및 질화물 반도체 발광 소자의 제조 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8390023B2 (ko) |
EP (1) | EP2090680A4 (ko) |
JP (1) | JP4890558B2 (ko) |
KR (1) | KR101172942B1 (ko) |
CN (1) | CN101528991B (ko) |
WO (1) | WO2008047907A1 (ko) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008078613A (ja) * | 2006-08-24 | 2008-04-03 | Rohm Co Ltd | 窒化物半導体の製造方法及び窒化物半導体素子 |
JP5145120B2 (ja) * | 2008-05-26 | 2013-02-13 | パナソニック株式会社 | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体発光素子の製造方法 |
JP5295871B2 (ja) * | 2008-07-03 | 2013-09-18 | 古河機械金属株式会社 | Iii族窒化物半導体基板の製造方法 |
US8436335B2 (en) | 2008-10-29 | 2013-05-07 | Panasonic Corporation | Detecting element, detecting device, and oxygen concentration test device |
JP5453780B2 (ja) | 2008-11-20 | 2014-03-26 | 三菱化学株式会社 | 窒化物半導体 |
KR101173072B1 (ko) * | 2009-08-27 | 2012-08-13 | 한국산업기술대학교산학협력단 | 경사진 기판 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 |
WO2011083551A1 (ja) * | 2010-01-06 | 2011-07-14 | パナソニック株式会社 | 窒化物系半導体発光素子およびその製造方法 |
JP5814131B2 (ja) * | 2010-02-10 | 2015-11-17 | エー・イー・テック株式会社 | 構造体、及び半導体基板の製造方法 |
EP2541624A4 (en) | 2010-04-01 | 2013-05-15 | Panasonic Corp | NITRIDE SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR |
WO2011125301A1 (ja) * | 2010-04-02 | 2011-10-13 | パナソニック株式会社 | 窒化物系半導体素子およびその製造方法 |
JP5849215B2 (ja) | 2010-06-21 | 2016-01-27 | パナソニックIpマネジメント株式会社 | 紫外半導体発光素子 |
EP2701183A4 (en) * | 2011-08-09 | 2014-07-30 | Panasonic Corp | STRUCTURE FOR BREEDING A NITRID SEMICONDUCTOR LAYER, STACKING STRUCTURE, NITRID BASE SEMICONDUCTOR ELEMENT, LIGHTING SOURCE AND MANUFACTURING METHOD THEREFOR |
US8803326B2 (en) * | 2011-11-15 | 2014-08-12 | Xintec Inc. | Chip package |
US10052848B2 (en) | 2012-03-06 | 2018-08-21 | Apple Inc. | Sapphire laminates |
US9221289B2 (en) | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
JP5891390B2 (ja) | 2012-10-05 | 2016-03-23 | パナソニックIpマネジメント株式会社 | 窒化物半導体構造、積層構造、および窒化物半導体発光素子 |
US9232672B2 (en) | 2013-01-10 | 2016-01-05 | Apple Inc. | Ceramic insert control mechanism |
US9632537B2 (en) | 2013-09-23 | 2017-04-25 | Apple Inc. | Electronic component embedded in ceramic material |
US9678540B2 (en) | 2013-09-23 | 2017-06-13 | Apple Inc. | Electronic component embedded in ceramic material |
US9154678B2 (en) | 2013-12-11 | 2015-10-06 | Apple Inc. | Cover glass arrangement for an electronic device |
US9225056B2 (en) | 2014-02-12 | 2015-12-29 | Apple Inc. | Antenna on sapphire structure |
WO2016153070A1 (ja) * | 2015-03-26 | 2016-09-29 | 京セラ株式会社 | サファイア部材、およびサファイア部材の製造方法 |
US10406634B2 (en) | 2015-07-01 | 2019-09-10 | Apple Inc. | Enhancing strength in laser cutting of ceramic components |
JP6684815B2 (ja) * | 2015-09-30 | 2020-04-22 | 日本碍子株式会社 | エピタキシャル成長用配向アルミナ基板 |
CN107180743B (zh) * | 2016-03-11 | 2019-12-27 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种制备半极性AlN模板的方法 |
CN109891273B (zh) * | 2016-11-02 | 2022-04-08 | 京瓷株式会社 | 色轮的制造方法 |
CN106784181B (zh) * | 2016-12-14 | 2020-06-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | 提高绿光或更长波长InGaN量子阱发光效率的方法及结构 |
JP2018101701A (ja) * | 2016-12-20 | 2018-06-28 | 住友電工デバイス・イノベーション株式会社 | 半導体基板およびその製造方法 |
US10535518B1 (en) | 2017-03-26 | 2020-01-14 | Hrl Laboratories, Llc | In situ fabrication of horizontal nanowires and device using same |
CN108461594A (zh) * | 2018-01-23 | 2018-08-28 | 聚灿光电科技(宿迁)有限公司 | Led芯片及其制造方法 |
US10903074B2 (en) * | 2018-03-02 | 2021-01-26 | Sciocs Company Limited | GaN laminate and method of manufacturing the same |
CN108511323A (zh) * | 2018-04-04 | 2018-09-07 | 中国科学院苏州纳米技术与纳米仿生研究所 | 基于大斜切角蓝宝石衬底外延生长氮化镓的方法及其应用 |
US10868213B2 (en) * | 2018-06-26 | 2020-12-15 | Lumileds Llc | LED utilizing internal color conversion with light extraction enhancements |
CN110491774B (zh) * | 2019-08-19 | 2021-10-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种蓝宝石衬底的表面处理方法及其使用的坩埚 |
CN110993737B (zh) * | 2019-12-12 | 2021-04-13 | 中国科学院长春光学精密机械与物理研究所 | AlGaN基同质集成光电子芯片及其制备方法 |
CN112670383B (zh) * | 2020-12-25 | 2023-07-14 | 广东省科学院半导体研究所 | 一种紫外光电器件及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000216497A (ja) | 1999-01-22 | 2000-08-04 | Sanyo Electric Co Ltd | 半導体素子およびその製造方法 |
JP2002145700A (ja) | 2000-08-14 | 2002-05-22 | Nippon Telegr & Teleph Corp <Ntt> | サファイア基板および半導体素子ならびに電子部品および結晶成長方法 |
JP2004200578A (ja) | 2002-12-20 | 2004-07-15 | Ngk Insulators Ltd | エピタキシャル基板及びサファイア単結晶基材 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6083812A (en) * | 1993-02-02 | 2000-07-04 | Texas Instruments Incorporated | Heteroepitaxy by large surface steps |
US6586819B2 (en) | 2000-08-14 | 2003-07-01 | Nippon Telegraph And Telephone Corporation | Sapphire substrate, semiconductor device, electronic component, and crystal growing method |
TW546850B (en) | 2000-08-18 | 2003-08-11 | Showa Denko Kk | Manufacturing method for crystallization of group III nitride semiconductor, manufacturing method for gallium nitride compound semiconductor, gallium nitride compound semiconductor, gallium nitride compound semiconductor light emitting elements and light |
US6852161B2 (en) | 2000-08-18 | 2005-02-08 | Showa Denko K.K. | Method of fabricating group-iii nitride semiconductor crystal, method of fabricating gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor light-emitting device, and light source using the semiconductor light-emitting device |
JP2004288934A (ja) * | 2003-03-24 | 2004-10-14 | Kyocera Corp | サファイア基板とその製造方法、エピタキシャル基板および半導体装置とその製造方法 |
JP4581490B2 (ja) | 2004-05-31 | 2010-11-17 | 日立電線株式会社 | Iii−v族窒化物系半導体自立基板の製造方法、及びiii−v族窒化物系半導体の製造方法 |
JP5276769B2 (ja) | 2004-10-01 | 2013-08-28 | 東京電波株式会社 | 六方晶系ウルツ鉱型単結晶、その製造方法、および六方晶系ウルツ鉱型単結晶基板 |
JP5129740B2 (ja) | 2006-04-17 | 2013-01-30 | 株式会社 斉藤光学製作所 | 単結晶サファイア基板 |
-
2007
- 2007-10-19 JP JP2008539886A patent/JP4890558B2/ja active Active
- 2007-10-19 EP EP07830183A patent/EP2090680A4/en not_active Ceased
- 2007-10-19 US US12/446,081 patent/US8390023B2/en active Active
- 2007-10-19 CN CN2007800389535A patent/CN101528991B/zh active Active
- 2007-10-19 WO PCT/JP2007/070449 patent/WO2008047907A1/ja active Application Filing
- 2007-10-19 KR KR1020097010064A patent/KR101172942B1/ko active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000216497A (ja) | 1999-01-22 | 2000-08-04 | Sanyo Electric Co Ltd | 半導体素子およびその製造方法 |
JP2002145700A (ja) | 2000-08-14 | 2002-05-22 | Nippon Telegr & Teleph Corp <Ntt> | サファイア基板および半導体素子ならびに電子部品および結晶成長方法 |
JP2004200578A (ja) | 2002-12-20 | 2004-07-15 | Ngk Insulators Ltd | エピタキシャル基板及びサファイア単結晶基材 |
Also Published As
Publication number | Publication date |
---|---|
EP2090680A1 (en) | 2009-08-19 |
JP4890558B2 (ja) | 2012-03-07 |
JPWO2008047907A1 (ja) | 2010-02-25 |
CN101528991B (zh) | 2012-10-03 |
US20100207136A1 (en) | 2010-08-19 |
EP2090680A4 (en) | 2011-08-17 |
US8390023B2 (en) | 2013-03-05 |
CN101528991A (zh) | 2009-09-09 |
KR20090068374A (ko) | 2009-06-26 |
WO2008047907A1 (en) | 2008-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101172942B1 (ko) | 사파이어 기판 및 그것을 이용하는 질화물 반도체 발광 소자 및 질화물 반도체 발광 소자의 제조 방법 | |
TWI489668B (zh) | 利用金屬有機化學汽相沉積之高品質氮面GaN、InN及AlN及其合金之異質磊晶生長的方法 | |
JP5280004B2 (ja) | 発光素子及びその製造方法 | |
JP4371202B2 (ja) | 窒化物半導体の製造方法及び半導体ウエハ並びに半導体デバイス | |
JP5277270B2 (ja) | 結晶成長方法および半導体素子 | |
JP4189386B2 (ja) | 窒化物半導体結晶層の成長方法および窒化物半導体発光素子の製法 | |
JP4903189B2 (ja) | 半極性窒化物単結晶薄膜の成長方法及びこれを用いた窒化物半導体発光素子の製造方法 | |
JP2003282602A (ja) | 結晶成長用基板およびZnO系化合物半導体デバイス | |
JP2000323417A (ja) | Iii族窒化物半導体の製造方法及びiii族窒化物半導体発光素子 | |
JP4529846B2 (ja) | Iii−v族窒化物系半導体基板及びその製造方法 | |
JP6966063B2 (ja) | 結晶基板、紫外発光素子およびそれらの製造方法 | |
JP4860736B2 (ja) | 半導体構造物及びそれを製造する方法 | |
JP2016145144A (ja) | ダイヤモンド積層構造、ダイヤモンド半導体形成用基板、ダイヤモンド半導体装置およびダイヤモンド積層構造の製造方法 | |
JP2008108924A (ja) | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体発光素子の製造方法 | |
TW200939536A (en) | Nitride semiconductor and method for manufacturing same | |
WO2008056632A1 (en) | GaN SEMICONDUCTOR LIGHT EMITTING ELEMENT | |
JP2007103955A (ja) | 窒化物半導体素子および窒化物半導体結晶層の成長方法 | |
JP2006232639A (ja) | 窒化物系半導体の気相成長方法とそれを用いた窒化物系半導体エピタキシャル基板並びに自立基板、及び半導体装置 | |
JP2999435B2 (ja) | 半導体の製造方法及び半導体発光素子 | |
JP2017168783A (ja) | 半導体装置およびその製造方法 | |
JP2007073873A (ja) | 半導体素子 | |
JP4960621B2 (ja) | 窒化物半導体成長基板及びその製造方法 | |
JP2018022814A (ja) | 窒化物半導体素子及びその製造方法 | |
JP2008053640A (ja) | Iii−v族窒化物層およびその製造方法 | |
JP2004063635A (ja) | 窒化物半導体の製造方法および半導体ウェハならびに半導体デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0105 | International application |
Patent event date: 20090515 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110117 Patent event code: PE09021S01D |
|
N231 | Notification of change of applicant | ||
PN2301 | Change of applicant |
Patent event date: 20120127 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20120702 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20120803 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20120803 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20150716 Year of fee payment: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20150716 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20160701 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20160701 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20170720 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20170720 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20180719 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20180719 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20220620 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20230619 Start annual number: 12 End annual number: 12 |