KR101148330B1 - 열처리로 및 그 제조 방법 - Google Patents
열처리로 및 그 제조 방법 Download PDFInfo
- Publication number
- KR101148330B1 KR101148330B1 KR1020080050531A KR20080050531A KR101148330B1 KR 101148330 B1 KR101148330 B1 KR 101148330B1 KR 1020080050531 A KR1020080050531 A KR 1020080050531A KR 20080050531 A KR20080050531 A KR 20080050531A KR 101148330 B1 KR101148330 B1 KR 101148330B1
- Authority
- KR
- South Korea
- Prior art keywords
- heating element
- resistance heating
- insulating material
- heat insulating
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/0003—Linings or walls
- F27D1/0036—Linings or walls comprising means for supporting electric resistances in the furnace
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Furnace Details (AREA)
- Resistance Heating (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
Abstract
Description
Claims (10)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 피처리체를 수용하여 열처리하는 처리 용기와, 처리 용기를 둘러싸는 통 형상의 단열재와, 상기 단열재의 내주면을 따라서 배치된 나선 형상의 저항 발열체와, 단열재의 내주면에 축 방향으로 평행하게 설치되어 저항 발열체를, 축 방향을 따르는 소정 피치로 지지하는 지지체를 구비한 열처리로의 제조 방법이며,축 방향을 따라서 배치된 복수의 단자판을 갖는 나선 형상의 저항 발열체와, 상기 저항 발열체의 내측에 위치하는 기초부와, 이 기초부에 저항 발열체 사이를 통과하여 반경 방향 외측으로 연장되는 동시에 저항 발열체를 지지하는 복수의 지지편을 갖고, 상기 지지편의 상면부가 저항 발열체의 열팽창 수축 이동 시의 마찰 저항을 저감시키도록 곡면 형상으로 형성되어 있는 빗 형상의 지지체와, 상기 지지체를 저항 발열체의 주위 방향에서 소정 위치에 위치 결정하여 축 방향으로 정렬시키는 지그를 준비하는 공정과,상기 지그를 회전시키면서 지그 상에 상기 지지체를 개재하여 상기 저항 발열체를 장착하는 공정과,상기 저항 발열체의 외주에 상기 단자판 및 지지체의 지지편을 피해 여과재를 배치하고, 상기 여과재 상에 상기 저항 발열체의 축 방향을 따라서 가는 직경의 막대재를 주위 방향으로 간격을 두고 배치하는 공정과,상기 저항 발열체를 단열 재료를 이루는 무기질 섬유를 포함하는 현탁액 중에 침지시켜 저항 발열체의 내측으로부터의 흡인에 의해 상기 여과재 상에 상기 단열 재료를 퇴적시키는 공정과,상기 여과재에 퇴적된 단열 재료를 건조시켜 단열재를 형성하는 공정과,건조 후에 상기 단열재와 상기 여과재 사이로부터 상기 막대재를 빼내고, 또한 상기 단열재와 상기 저항 발열체 사이로부터 상기 여과재를 빼내는 공정과,상기 지그를 상기 지지체로부터 제거하는 공정을 포함하는 것을 특징으로 하는 열처리로의 제조 방법.
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-00146733 | 2007-06-01 | ||
JP2007146733A JP4445519B2 (ja) | 2007-06-01 | 2007-06-01 | 熱処理炉及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080106073A KR20080106073A (ko) | 2008-12-04 |
KR101148330B1 true KR101148330B1 (ko) | 2012-05-21 |
Family
ID=40086953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080050531A Active KR101148330B1 (ko) | 2007-06-01 | 2008-05-30 | 열처리로 및 그 제조 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8134100B2 (ko) |
JP (1) | JP4445519B2 (ko) |
KR (1) | KR101148330B1 (ko) |
CN (1) | CN101315878B (ko) |
TW (1) | TWI451497B (ko) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8023806B2 (en) * | 2007-03-20 | 2011-09-20 | Tokyo Electron Limited | Heat processing furnace and vertical-type heat processing apparatus |
JP5096182B2 (ja) * | 2008-01-31 | 2012-12-12 | 東京エレクトロン株式会社 | 熱処理炉 |
JP5544121B2 (ja) * | 2009-07-21 | 2014-07-09 | 株式会社日立国際電気 | 加熱装置、基板処理装置、及び半導体装置の製造方法 |
KR101096602B1 (ko) * | 2009-07-21 | 2011-12-20 | 가부시키가이샤 히다치 고쿠사이 덴키 | 가열 장치, 기판 처리 장치 및 반도체 장치의 제조 방법 |
KR101844602B1 (ko) * | 2010-06-25 | 2018-04-02 | 샌드빅 써멀 프로세스. 인크. | 발열체 코일용 지지구조물과 스페이서 및 발열체 코일의 위치를 제어하는 방법 |
JP5721219B2 (ja) * | 2010-07-09 | 2015-05-20 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び加熱装置 |
JP5565188B2 (ja) * | 2010-08-10 | 2014-08-06 | 東京エレクトロン株式会社 | ヒータ装置 |
AT12463U1 (de) | 2010-09-27 | 2012-05-15 | Plansee Se | Heizleiteranordnung |
TWM413957U (en) * | 2010-10-27 | 2011-10-11 | Tangteck Equipment Inc | Diffusion furnace apparatus |
JP2013002728A (ja) * | 2011-06-16 | 2013-01-07 | Ihi Corp | 熱処理炉とそのヒータ交換方法 |
JP5868619B2 (ja) * | 2011-06-21 | 2016-02-24 | ニチアス株式会社 | 熱処理炉及び熱処理装置 |
US9171746B2 (en) | 2011-09-06 | 2015-10-27 | Arsalan Emami | Heater elements with enhanced cooling |
JP2014082014A (ja) * | 2012-10-12 | 2014-05-08 | Tokyo Electron Ltd | ヒータ装置及び熱処理装置 |
JP5993272B2 (ja) | 2012-10-18 | 2016-09-14 | 東京エレクトロン株式会社 | 断熱壁体の製造方法 |
US20140166640A1 (en) * | 2012-12-13 | 2014-06-19 | Sandvik Thermal Process Inc | Support for resisting radial creep of a heating element coil |
US9638466B2 (en) * | 2012-12-28 | 2017-05-02 | Jonathan Y. MELLEN | Furnace system with active cooling system and method |
JP2014186833A (ja) | 2013-03-22 | 2014-10-02 | Tokyo Electron Ltd | ヒータ装置及び熱処理装置 |
JP6170847B2 (ja) * | 2013-03-25 | 2017-07-26 | 株式会社日立国際電気 | 断熱構造体、加熱装置、基板処理装置および半導体装置の製造方法 |
CN104253064A (zh) * | 2013-06-28 | 2014-12-31 | 上海华虹宏力半导体制造有限公司 | 一种半导体熔炉加热器固定装置 |
TWI505864B (zh) * | 2013-12-05 | 2015-11-01 | Metal Ind Res & Dev Ct | 熱處理設備之收料裝置 |
CN103779258B (zh) * | 2014-02-20 | 2016-06-15 | 北京七星华创电子股份有限公司 | 一种半导体热处理设备的加热装置、维修件及维修方法 |
KR101712512B1 (ko) * | 2014-12-11 | 2017-03-22 | 김종섭 | 열처리용 전기로 |
US10798781B2 (en) * | 2015-05-13 | 2020-10-06 | Arsalan Emami | Horizontal modular heater |
KR102466140B1 (ko) * | 2016-01-29 | 2022-11-11 | 삼성전자주식회사 | 가열 장치 및 이를 갖는 기판 처리 시스템 |
WO2017156503A1 (en) | 2016-03-10 | 2017-09-14 | Arsalan Emami | Improved industrial heater |
US10889894B2 (en) * | 2018-08-06 | 2021-01-12 | Applied Materials, Inc. | Faceplate with embedded heater |
JP7016306B2 (ja) | 2018-08-23 | 2022-02-04 | Dowaサーモテック株式会社 | 熱処理装置 |
RU204240U1 (ru) * | 2020-08-03 | 2021-05-17 | Федеральное государственное бюджетное учреждение науки Институт проблем химической физики Российской Академии наук (ФГБУН ИПХФ РАН) | Устройство для синтеза полупроводниковых пленок |
CN116007390A (zh) * | 2022-12-15 | 2023-04-25 | 湖南优热科技有限责任公司 | 一种带有快速主动冷却系统的石墨化炉 |
CN119289657B (zh) * | 2024-12-10 | 2025-02-25 | 宝鸡禾盛金属有限公司 | 一种真空炉加热带吊挂装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0864546A (ja) * | 1993-11-10 | 1996-03-08 | Tokyo Electron Ltd | 熱処理炉及びその製造方法 |
KR100483457B1 (ko) * | 1997-02-18 | 2005-08-29 | 동경 엘렉트론 주식회사 | 열처리장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07253276A (ja) * | 1994-03-16 | 1995-10-03 | Tokyo Electron Ltd | 熱処理炉及びその製造方法 |
JP2006080058A (ja) * | 2004-08-09 | 2006-03-23 | Teitokusha Kk | 電気ヒーター |
TWI315080B (en) | 2005-08-24 | 2009-09-21 | Hitachi Int Electric Inc | Baseplate processing equipment, heating device used on the baseplate processing equipment and method for manufacturing semiconductors with those apparatus, and heating element supporting structure |
JP4907937B2 (ja) * | 2005-09-26 | 2012-04-04 | 株式会社日立国際電気 | 断熱壁体、発熱体の保持構造体、加熱装置および基板処理装置 |
-
2007
- 2007-06-01 JP JP2007146733A patent/JP4445519B2/ja active Active
-
2008
- 2008-05-26 TW TW097119395A patent/TWI451497B/zh active
- 2008-05-29 US US12/155,095 patent/US8134100B2/en active Active
- 2008-05-30 KR KR1020080050531A patent/KR101148330B1/ko active Active
- 2008-06-02 CN CN200810109373.7A patent/CN101315878B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0864546A (ja) * | 1993-11-10 | 1996-03-08 | Tokyo Electron Ltd | 熱処理炉及びその製造方法 |
KR100483457B1 (ko) * | 1997-02-18 | 2005-08-29 | 동경 엘렉트론 주식회사 | 열처리장치 |
Also Published As
Publication number | Publication date |
---|---|
JP4445519B2 (ja) | 2010-04-07 |
KR20080106073A (ko) | 2008-12-04 |
CN101315878A (zh) | 2008-12-03 |
CN101315878B (zh) | 2011-04-06 |
TW200903650A (en) | 2009-01-16 |
TWI451497B (zh) | 2014-09-01 |
US8134100B2 (en) | 2012-03-13 |
JP2008300722A (ja) | 2008-12-11 |
US20080296282A1 (en) | 2008-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101148330B1 (ko) | 열처리로 및 그 제조 방법 | |
KR101332094B1 (ko) | 열처리로 및 그 제조 방법 | |
KR101142686B1 (ko) | 열처리로 | |
KR101360069B1 (ko) | 종형 열처리 장치 및 그의 냉각 방법 | |
KR101148728B1 (ko) | 열처리로 및 종형 열처리 장치 | |
JP2840558B2 (ja) | 熱処理炉及びその製造方法 | |
KR101117016B1 (ko) | 열처리로 및 종형 열처리 장치 | |
KR101368206B1 (ko) | 종형 열처리 장치 및, 압력 검지 시스템과 온도 센서의 조합체 | |
JP5868619B2 (ja) | 熱処理炉及び熱処理装置 | |
KR100483457B1 (ko) | 열처리장치 | |
JP5134595B2 (ja) | 熱処理炉 | |
JP5770042B2 (ja) | 熱処理装置 | |
KR101521464B1 (ko) | 열처리 장치 | |
JP4401543B2 (ja) | 縦型熱処理装置およびその板状断熱材の製造方法 | |
JP2001255069A (ja) | 熱処理装置およびその抵抗発熱体の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20080530 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20100310 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20080530 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110530 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20120118 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20110530 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
AMND | Amendment | ||
J201 | Request for trial against refusal decision | ||
PJ0201 | Trial against decision of rejection |
Patent event date: 20120217 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20120118 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20120409 Appeal identifier: 2012101001671 Request date: 20120217 |
|
PB0901 | Examination by re-examination before a trial |
Comment text: Amendment to Specification, etc. Patent event date: 20120217 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20120217 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20110722 Patent event code: PB09011R02I |
|
B701 | Decision to grant | ||
PB0701 | Decision of registration after re-examination before a trial |
Patent event date: 20120409 Comment text: Decision to Grant Registration Patent event code: PB07012S01D Patent event date: 20120320 Comment text: Transfer of Trial File for Re-examination before a Trial Patent event code: PB07011S01I |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20120514 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20120514 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20150416 Year of fee payment: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20150416 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20160418 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20160418 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20170421 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20170421 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20180502 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20180502 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20190429 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20190429 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20200506 Start annual number: 9 End annual number: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20210503 Start annual number: 10 End annual number: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20220418 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20230420 Start annual number: 12 End annual number: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20240424 Start annual number: 13 End annual number: 13 |
|
PR1001 | Payment of annual fee |
Payment date: 20250407 Start annual number: 14 End annual number: 14 |