KR101141305B1 - 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물 - Google Patents
인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR101141305B1 KR101141305B1 KR1020090027404A KR20090027404A KR101141305B1 KR 101141305 B1 KR101141305 B1 KR 101141305B1 KR 1020090027404 A KR1020090027404 A KR 1020090027404A KR 20090027404 A KR20090027404 A KR 20090027404A KR 101141305 B1 KR101141305 B1 KR 101141305B1
- Authority
- KR
- South Korea
- Prior art keywords
- phosphorus
- epoxy resin
- modified phenol
- phenol novolak
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920003986 novolac Polymers 0.000 title claims description 63
- 239000003822 epoxy resin Substances 0.000 title claims description 52
- 229920000647 polyepoxide Polymers 0.000 title claims description 52
- 239000000203 mixture Substances 0.000 title claims description 33
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract description 34
- 239000011574 phosphorus Substances 0.000 title abstract description 33
- 229910052698 phosphorus Inorganic materials 0.000 title abstract description 33
- 239000004848 polyfunctional curative Substances 0.000 title description 7
- 229920005989 resin Polymers 0.000 claims abstract description 55
- 239000011347 resin Substances 0.000 claims abstract description 55
- 150000002989 phenols Chemical class 0.000 claims abstract description 54
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 44
- 239000004593 Epoxy Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 20
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 16
- 230000009477 glass transition Effects 0.000 claims description 13
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 abstract description 5
- 150000002367 halogens Chemical class 0.000 abstract description 5
- 239000011342 resin composition Substances 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 29
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 16
- 239000003063 flame retardant Substances 0.000 description 15
- 239000002904 solvent Substances 0.000 description 13
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 12
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical compound C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 150000002118 epoxides Chemical class 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000000197 pyrolysis Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- -1 as in Example 4 Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- DENRZWYUOJLTMF-UHFFFAOYSA-N diethyl sulfate Chemical compound CCOS(=O)(=O)OCC DENRZWYUOJLTMF-UHFFFAOYSA-N 0.000 description 2
- 229940008406 diethyl sulfate Drugs 0.000 description 2
- 239000012039 electrophile Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012038 nucleophile Substances 0.000 description 2
- 238000005935 nucleophilic addition reaction Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
구분 | 용제 | 용해성 |
실시예 1 |
2-메톡시에탄올 | 좋음 |
1-메톡시-2-프로판올 | 좋음 | |
메틸 에틸 케톤 | 탁해짐 | |
DMF | 좋음 |
Entry | DOPO-PN / PN | 인 함량(중량%) |
F1 | 0 / 100 | 0 |
F2 | 25 / 75 | 2.2 |
F3 | 50 / 50 | 3.8 |
F4 | 75 / 25 | 5.0 |
F5 | 100 / 0 | 5.9 |
Entry | DOPO-PN / PN | Tg (℃) |
F1 | 0 / 100 | 155.83 |
F2 | 25 / 75 | 151.95 |
F3 | 50 / 50 | 138.40 |
F4 | 75 / 25 | 119.57 |
F5 | 100 / 0 | 113.29 |
Entry | DOPO-PN / PN | Td (℃) |
F1 | 0 / 100 | 357.25 |
F2 | 25 / 75 | 349.25 |
F3 | 50 / 50 | 338.10 |
F4 | 75 / 25 | 329.06 |
F5 | 100 / 0 | 328.11 |
Entry | DOPO-PN / PN | 인 함량 (중량%) |
Burning Time (sec) |
UL-94 Class |
F1 | 0 / 100 | 0 | 42 | V-1 |
F2 | 25 / 75 | 2.2 | 13 | V-1 |
F3 | 50 / 50 | 3.8 | 2 | V-0 |
F4 | 75 / 25 | 5.0 | 1 | V-0 |
F5 | 100 / 0 | 5.9 | 0 | V-0 |
실시예 5 | 실시예 6 | |
인 함량(중량%) | 4.98 | 5.0 |
Tg(℃) | 122.54 | 124.25 |
Td(℃) | 330.38 | 331.41 |
UL-94 class | V-0 | V-0 |
실시예 7 | |
인 함량(중량%) | 3.86 |
Tg(℃) | 144.2 |
Td(℃) | 339.20 |
UL-94 class | V-0 |
Claims (17)
- 제 1 항에 있어서, 연화점이 50 내지 200℃인 것인 인-변성 페놀 노볼락 수지.
- 삭제
- 제 1 항에 있어서, 2-메톡시에탄올, 1-메톡시-2-프로판올 및 디메틸포름아마이드에 가용인 인-변성 페놀 노볼락 수지.
- 제1항, 제2항 및 제4항 중 어느 한 항의 인-변성 페놀 노볼락 수지를 포함하는 에폭시 경화제.
- 제 6 항에 있어서, 인-변성 페놀 노볼락 수지는 연화점이 50 내지 200℃인 것인 에폭시 수지 조성물.
- 삭제
- 제 6 항에 있어서, 인-변성 페놀 노볼락 수지는 2-메톡시에탄올, 1-메톡시-2-프로판올 및 디메틸포름아마이드에 가용인 에폭시 수지 조성물.
- 제 6 항에 있어서, 경화제는 상기 화학식 1로 표시되는 반복단위를 포함하며 중량평균분자량 400 내지 3,000인 인-변성 페놀 노볼락 수지와 인-변성되지 않은 페놀 노볼락 수지의 혼합물이며, 인-변성 페놀 노볼락 수지를 전체 경화제 중 20 중량% 이상으로 포함하는 것인 에폭시 수지 조성물.
- 제 6 항에 있어서, 에폭시 수지는 인-변성 에폭시 수지인 것인 에폭시 수지 조성물.
- 제6항, 제7항, 제9항 및 제10항 중 어느 한 항의 에폭시 수지 조성물의 경화물.
- 제 11 항의 에폭시 수지 조성물의 경화물.
- 삭제
- 삭제
- 제 12 항에 있어서, 유리전이온도가 120℃ 이상인 경화물.
- 제 13 항에 있어서, 유리전이온도가 120℃ 이상인 경화물.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090027404A KR101141305B1 (ko) | 2009-03-31 | 2009-03-31 | 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물 |
US13/259,070 US8648154B2 (en) | 2009-03-31 | 2010-03-30 | Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition |
JP2012503320A JP5577399B2 (ja) | 2009-03-31 | 2010-03-30 | 燐−変性フェノールノボラック樹脂、これを含む硬化剤及びエポキシ樹脂組成物 |
CN2010800144629A CN102369227B (zh) | 2009-03-31 | 2010-03-30 | 含磷线型酚醛树脂、包含该含磷线型酚醛树脂的固化剂和环氧树脂组合物 |
PCT/KR2010/001930 WO2010114279A2 (en) | 2009-03-31 | 2010-03-30 | Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition |
DE112010001422.1T DE112010001422B4 (de) | 2009-03-31 | 2010-03-30 | Phosphorhaltiges Phenolnovolakharz, selbiges umfassendes Härtungsmittel und Epoxyharzzusammensetzung |
TW099109860A TWI460213B (zh) | 2009-03-31 | 2010-03-31 | 含磷酚醛樹脂、含有該含磷酚醛樹脂之硬化劑及環氧樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090027404A KR101141305B1 (ko) | 2009-03-31 | 2009-03-31 | 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100109029A KR20100109029A (ko) | 2010-10-08 |
KR101141305B1 true KR101141305B1 (ko) | 2012-05-04 |
Family
ID=42828837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090027404A Active KR101141305B1 (ko) | 2009-03-31 | 2009-03-31 | 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8648154B2 (ko) |
JP (1) | JP5577399B2 (ko) |
KR (1) | KR101141305B1 (ko) |
CN (1) | CN102369227B (ko) |
DE (1) | DE112010001422B4 (ko) |
TW (1) | TWI460213B (ko) |
WO (1) | WO2010114279A2 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449749B (zh) * | 2010-04-23 | 2014-08-21 | Panasonic Corp | 環氧樹脂組成物、預浸體、金屬被覆疊層板及印刷電路板 |
TWI410446B (zh) * | 2011-01-05 | 2013-10-01 | Grand Tek Advance Material Science Co Ltd | 含磷酚醛樹脂與其形成方法及含磷配方 |
JP5720486B2 (ja) * | 2011-08-16 | 2015-05-20 | Dic株式会社 | 感光性樹脂組成物 |
AT512085A1 (de) | 2011-11-02 | 2013-05-15 | Krems Chemie Chemical Services Ag | Flammhemmend modifizierte novolake |
KR101597746B1 (ko) * | 2012-03-29 | 2016-02-25 | 디아이씨 가부시끼가이샤 | 경화성 수지 조성물, 그 경화물, 프린트 배선 기판용 수지 조성물, 및 프린트 배선 기판 |
CN102766242B (zh) * | 2012-08-02 | 2014-07-02 | 山东圣泉化工股份有限公司 | 一种改性酚醛树脂的制备方法 |
CN103172812B (zh) * | 2013-03-15 | 2015-07-01 | 山东圣泉化工股份有限公司 | 一种含磷的酚醛树脂的制备方法及制备得到的树脂 |
TWI466913B (zh) * | 2013-03-28 | 2015-01-01 | Nanya Plastics Corp | A kind of halogenated flame retardant and high glass transition temperature of phenolic resin hardener and its preparation method |
CN103382242B (zh) * | 2013-06-25 | 2015-06-24 | 江苏雅克科技股份有限公司 | 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物 |
CN103450262A (zh) * | 2013-07-27 | 2013-12-18 | 梁劲捷 | 磷改性酚醛树脂的制备方法 |
CN103865025B (zh) * | 2014-03-14 | 2016-07-13 | 厦门大学 | 一种本质阻燃硬质聚氨酯泡沫塑料 |
CN107033343B (zh) * | 2014-11-06 | 2019-01-08 | 江苏雅克科技股份有限公司 | 含磷官能化聚(亚芳基醚)及包含含磷官能化聚(亚芳基醚)的可固化组合物 |
US9844136B2 (en) | 2014-12-01 | 2017-12-12 | General Electric Company | Printed circuit boards having profiled conductive layer and methods of manufacturing same |
CN105175995B (zh) * | 2015-08-03 | 2018-05-04 | 广东生益科技股份有限公司 | 一种覆铜板用环氧树脂组合物及其应用 |
TWI721024B (zh) * | 2015-11-13 | 2021-03-11 | 美商Icl Ip美國股份有限公司 | 用於熱固性樹脂之活性酯類固化劑化合物、包含彼之阻燃劑組成物、及由其所製成之物件 |
TWI547498B (zh) * | 2015-12-29 | 2016-09-01 | 國立清華大學 | 含磷化合物及其應用與製法 |
TWI671355B (zh) | 2018-01-03 | 2019-09-11 | Taiwan Union Technology Corporation | 樹脂組合物,以及使用該組合物所製得之預浸漬片、金屬箔積層板、與印刷電路板 |
EP3819319A1 (en) | 2019-11-06 | 2021-05-12 | Metadynea Austria GmbH | A polymeric compound comprising dopo |
CN119060279A (zh) * | 2024-11-06 | 2024-12-03 | 成都科宜高分子科技有限公司 | 含磷酚醛树脂及其制备方法、覆铜板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002241470A (ja) | 2001-02-15 | 2002-08-28 | Hitachi Chem Co Ltd | 樹脂組成物およびその用途ならびにそれらの製造方法 |
JP2003073448A (ja) | 2001-08-31 | 2003-03-12 | Choshun Jinzo Jushisho Kofun Yugenkoshi | 窒素を含む難燃性エポキシ樹脂とその組成物 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61166822A (ja) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | 封止用樹脂組成物 |
US6486242B1 (en) * | 1999-04-20 | 2002-11-26 | Sumitomo Bakelite Company Limited | Flame-retardant resin composition and prepreg and laminate using the same |
US6432539B1 (en) * | 1999-11-01 | 2002-08-13 | Chang Chun Plastics Co. Ltd. | Phosphorus-containing polymer having phenolic units and uses thereof |
JP2001354685A (ja) * | 2000-06-16 | 2001-12-25 | Dainippon Ink & Chem Inc | 燐原子含有フェノール化合物とその製造方法 |
TW498084B (en) * | 2000-07-19 | 2002-08-11 | Chang Chun Plastics Co Ltd | Flame-retardant resin and flame retardant composition containing the same |
JP5328064B2 (ja) * | 2000-08-10 | 2013-10-30 | 日本化薬株式会社 | 多価フェノール化合物、熱硬化性樹脂組成物及びその硬化物 |
JP4124949B2 (ja) * | 2000-09-12 | 2008-07-23 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
TW575633B (en) * | 2002-10-21 | 2004-02-11 | Chang Chun Plastics Co Ltd | Flame retardant epoxy resin composition and phosphorus containing compound |
TWI296001B (ko) * | 2002-10-22 | 2008-04-21 | Chang Chun Plastics Co Ltd | |
WO2004061008A1 (ja) * | 2002-12-27 | 2004-07-22 | Polyplastics Co., Ltd. | 難燃性樹脂組成物 |
DE102006015084A1 (de) * | 2006-03-31 | 2007-10-04 | Schill + Seilacher "Struktol" Ag | Halogenfreie flammgeschützte Epoxidharz-Formulierungen |
JP5023877B2 (ja) * | 2006-12-05 | 2012-09-12 | 日立化成工業株式会社 | 難燃性樹脂化合物、これを用いた熱硬化性樹脂組成物並びにプリプレグ及び積層板 |
-
2009
- 2009-03-31 KR KR1020090027404A patent/KR101141305B1/ko active Active
-
2010
- 2010-03-30 WO PCT/KR2010/001930 patent/WO2010114279A2/en active Application Filing
- 2010-03-30 JP JP2012503320A patent/JP5577399B2/ja active Active
- 2010-03-30 US US13/259,070 patent/US8648154B2/en active Active
- 2010-03-30 DE DE112010001422.1T patent/DE112010001422B4/de active Active
- 2010-03-30 CN CN2010800144629A patent/CN102369227B/zh active Active
- 2010-03-31 TW TW099109860A patent/TWI460213B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002241470A (ja) | 2001-02-15 | 2002-08-28 | Hitachi Chem Co Ltd | 樹脂組成物およびその用途ならびにそれらの製造方法 |
JP2003073448A (ja) | 2001-08-31 | 2003-03-12 | Choshun Jinzo Jushisho Kofun Yugenkoshi | 窒素を含む難燃性エポキシ樹脂とその組成物 |
Also Published As
Publication number | Publication date |
---|---|
DE112010001422T5 (de) | 2012-11-15 |
CN102369227A (zh) | 2012-03-07 |
DE112010001422B4 (de) | 2015-07-23 |
WO2010114279A2 (en) | 2010-10-07 |
TW201035178A (en) | 2010-10-01 |
KR20100109029A (ko) | 2010-10-08 |
JP5577399B2 (ja) | 2014-08-20 |
CN102369227B (zh) | 2013-05-08 |
JP2012522100A (ja) | 2012-09-20 |
US8648154B2 (en) | 2014-02-11 |
US20120095170A1 (en) | 2012-04-19 |
TWI460213B (zh) | 2014-11-11 |
WO2010114279A3 (en) | 2011-01-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101141305B1 (ko) | 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물 | |
EP1948735B1 (en) | Flame retardant prepregs and laminates for printed circuit boards | |
KR100228047B1 (ko) | 할로겐프리의 난연성 에폭시수지조성물 및 그를함유하는 프리프래그 및 적층판 | |
JP5264133B2 (ja) | エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板 | |
KR101938895B1 (ko) | 에폭시 수지 조성물, 이 에폭시 수지 조성물을 사용한 프리프레그, 지지체가 부착된 수지 필름, 금속박 피복 적층판 및 다층 프린트 배선판 | |
EP2985300B1 (en) | Phosphor-containing phenol formaldehyde resin compound and flame-retardant epoxy resin hardener made from thereof | |
CN100393802C (zh) | 树脂组合物及其用途以及它们的制造方法 | |
JP5772189B2 (ja) | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び配線板 | |
JP5323780B2 (ja) | 積層基板用低誘導電率樹脂ワニス組成物及びその製法 | |
KR101813527B1 (ko) | 인계 에폭시 화합물 및 이의 제조방법, 이를 포함하는 에폭시 조성물 | |
JP4442174B2 (ja) | 難燃性樹脂組成物、並びにこれを用いたプリプレグ、金属張積層板及びプリント配線板 | |
KR101492996B1 (ko) | 인 함유 공축합 수지 및 이를 이용한 난연성 조성물 | |
JP5866806B2 (ja) | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 | |
JP6304294B2 (ja) | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 | |
JP5793640B2 (ja) | プリント配線板用エポキシ樹脂組成物、そのプリント配線板用エポキシ樹脂組成物を用いたプリント配線板用プリプレグ及びプリント配線板用金属張積層板 | |
JP5919576B2 (ja) | プリント配線板用エポキシ樹脂組成物、そのプリント配線板用エポキシ樹脂組成物を用いたプリント配線板用プリプレグ及びプリント配線板用金属張積層板 | |
KR101465993B1 (ko) | 인 개질된 난연 경화제 | |
JP2011017026A (ja) | 樹脂組成物およびその用途ならびにそれらの製造方法 | |
KR20120107277A (ko) | 인쇄회로기판용 에폭시 조성물,이의 제조방법 및 이를 이용한 인쇄회로기판 | |
JP2002114832A (ja) | 高耐熱難燃性シアネート樹脂 | |
JP2002097260A (ja) | 高耐久性難燃硬化剤 | |
JP2002114838A (ja) | 高耐久性難燃シアネート樹脂 | |
JP2014227428A (ja) | リン含有フェノール樹脂、その製造方法及びその使用 | |
HK1179287A (en) | Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition | |
JPH01138241A (ja) | 難燃性紙フェノール樹脂積層板の製造法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20090331 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
N231 | Notification of change of applicant | ||
PN2301 | Change of applicant |
Patent event date: 20101025 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110315 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20120120 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20120423 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20120423 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20160314 Year of fee payment: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20160314 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20180313 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20180313 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20190401 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20190401 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20200401 Start annual number: 9 End annual number: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20210401 Start annual number: 10 End annual number: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20240326 Start annual number: 13 End annual number: 13 |