KR101067085B1 - 무촉매 그래핀 성장 방법 - Google Patents
무촉매 그래핀 성장 방법 Download PDFInfo
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- KR101067085B1 KR101067085B1 KR1020090039332A KR20090039332A KR101067085B1 KR 101067085 B1 KR101067085 B1 KR 101067085B1 KR 1020090039332 A KR1020090039332 A KR 1020090039332A KR 20090039332 A KR20090039332 A KR 20090039332A KR 101067085 B1 KR101067085 B1 KR 101067085B1
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- graphene
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- carbon
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 200
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 142
- 238000000034 method Methods 0.000 title claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 44
- 239000003054 catalyst Substances 0.000 claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 6
- 230000003197 catalytic effect Effects 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 230000006911 nucleation Effects 0.000 claims 1
- 238000010899 nucleation Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 230000008569 process Effects 0.000 description 14
- 229910002804 graphite Inorganic materials 0.000 description 13
- 239000010439 graphite Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- FRYDSOYOHWGSMD-UHFFFAOYSA-N [C].O Chemical compound [C].O FRYDSOYOHWGSMD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/184—Preparation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/02—Single layer graphene
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/04—Specific amount of layers or specific thickness
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
Claims (10)
- 탄소가 포함된 기체 속에 기판을 두는 단계;촉매를 사용하지 않은 상태에서 상기 기판을 가열하는 단계; 및상기 기판 위에 그래핀이 형성되는 단계를 포함하고,상기 기판 위에 그래핀이 형성되는 단계는, 상기 기판의 표면에서 상기 그래핀이 고속으로 성장하는 단계와 상기 기판 속에 용해된 탄소의 확산(diffusion)에 의해 상기 그래핀이 저속으로 성장하는 단계를 포함하는, 무촉매 그래핀 성장 방법.
- 제 1 항에 있어서,상기 탄소가 포함된 기체는,아세틸렌(C2H2), 에틸렌(C2H4), 및 메탄(CH4) 중 적어도 하나를 포함하는, 무촉매 그래핀 성장 방법.
- 제 1 항에 있어서,상기 기판은,실리콘 기판, 실리콘 산화물 기판, 및 쿼츠 기판 중 하나인, 무촉매 그래핀 성장 방법.
- 제 1 항에 있어서,상기 기판을 가열하는 단계는,0.1 내지 100 Torr의 압력 조건 및 700 내지 1100℃의 온도 조건 하에서 가열하는, 무촉매 그래핀 성장 방법.
- 제 1 항에 있어서,상기 탄소가 포함된 기체는,상기 기판의 주위에서 20 내지 30 SCCM(Standard Cubic Centimeter per Minute)의 비율로 유동하는, 무촉매 그래핀 성장 방법.
- 삭제
- 제 1 항에 있어서,상기 그래핀이 고속으로 성장하는 단계는,상기 기판의 표면 위에 상기 그래핀이 하나 이상의 층을 이루면서 성장하는 단계;산소나 수소 기체를 이용하여 상기 성장된 그래핀을 분리함으로써 상기 그래핀을 1차로 획득하는 단계를 포함하는, 무촉매 그래핀 성장 방법.
- 제 7 항에 있어서,상기 그래핀이 저속으로 성장하는 단계는,일정한 냉각 속도로 온도가 하강됨에 따라 상기 기판 속에 용해된 탄소가 핵형성(Nucleation)을 하는 단계;상기 핵형성된 탄소가 상기 기판의 표면과 표면 아래에서 확산되면서 상호 작용을 일으키는 단계;상기 확산과 상호 작용에 의해 상기 탄소가 응집되면서 그래핀이 성장하는 단계;상기 성장된 그래핀을 분리함으로써 상기 그래핀을 2차로 획득하는 단계를 포함하는, 무촉매 그래핀 성장 방법.
- 제 8 항에 있어서,상기 냉각 속도는,1분에 20℃ 내지 100℃의 비율로 하강하는 속도인, 무촉매 그래핀 성장 방법.
- 제 1 항 내지 제 5 항 및 제 7 항 내지 제 9 항중 어느 한 항에 따른 무촉매 그래핀 성장 방법에 의해 제조되는 탄소의 단일층 또는 10층 이하의 그래핀.
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130000964A (ko) * | 2011-06-24 | 2013-01-03 | 삼성전자주식회사 | 그래핀 제조방법 |
KR20140085113A (ko) * | 2012-12-27 | 2014-07-07 | 삼성전자주식회사 | 그래핀 전사 방법 및 이를 이용한 소자의 제조방법 |
KR101448078B1 (ko) * | 2012-02-02 | 2014-10-08 | 세종대학교산학협력단 | 그래핀 적층체의 제조 방법 및 그에 의한 그래핀 적층체 |
KR101466482B1 (ko) * | 2013-04-30 | 2014-12-02 | 경희대학교 산학협력단 | 산화 반응성 금속을 이용한 에칭 프리 그래핀 성장 방법 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101878733B1 (ko) * | 2011-05-04 | 2018-07-16 | 삼성전자주식회사 | 그래핀 직성장 방법 |
KR101301443B1 (ko) * | 2011-11-03 | 2013-08-28 | 경희대학교 산학협력단 | 가시광 발광특성을 갖는 그래핀 및 그 제조방법 |
KR101427818B1 (ko) | 2012-10-29 | 2014-08-08 | 한국과학기술연구원 | 열 증착을 이용한 유기나노필름 기반 탄소재료 및 그 제조방법 |
KR101425376B1 (ko) | 2013-02-12 | 2014-08-01 | 한국과학기술연구원 | 고분자 기반의 대면적 탄소 나노그물 및 그 제조방법 |
KR101437280B1 (ko) * | 2013-04-30 | 2014-09-02 | 경희대학교 산학협력단 | 전도성 금속 산화물을 이용한 에칭 프리 그래핀 성장 방법 |
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KR100819458B1 (ko) | 2007-05-15 | 2008-04-04 | 재단법인서울대학교산학협력재단 | 정전기력을 이용한 흑연 박막 제조방법 |
KR20080070769A (ko) * | 2005-11-21 | 2008-07-30 | 나노시스, 인크. | 탄소를 포함하는 나노배선 구조체 |
JP2009062241A (ja) | 2007-09-07 | 2009-03-26 | Hokkaido Univ | グラフェンシートの製造方法 |
US20090110627A1 (en) | 2007-10-29 | 2009-04-30 | Samsung Electronics Co., Ltd. | Graphene sheet and method of preparing the same |
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- 2009-05-06 KR KR1020090039332A patent/KR101067085B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20080070769A (ko) * | 2005-11-21 | 2008-07-30 | 나노시스, 인크. | 탄소를 포함하는 나노배선 구조체 |
KR100819458B1 (ko) | 2007-05-15 | 2008-04-04 | 재단법인서울대학교산학협력재단 | 정전기력을 이용한 흑연 박막 제조방법 |
JP2009062241A (ja) | 2007-09-07 | 2009-03-26 | Hokkaido Univ | グラフェンシートの製造方法 |
US20090110627A1 (en) | 2007-10-29 | 2009-04-30 | Samsung Electronics Co., Ltd. | Graphene sheet and method of preparing the same |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130000964A (ko) * | 2011-06-24 | 2013-01-03 | 삼성전자주식회사 | 그래핀 제조방법 |
KR101878736B1 (ko) * | 2011-06-24 | 2018-07-17 | 삼성전자주식회사 | 그래핀 제조방법 |
KR101448078B1 (ko) * | 2012-02-02 | 2014-10-08 | 세종대학교산학협력단 | 그래핀 적층체의 제조 방법 및 그에 의한 그래핀 적층체 |
KR20140085113A (ko) * | 2012-12-27 | 2014-07-07 | 삼성전자주식회사 | 그래핀 전사 방법 및 이를 이용한 소자의 제조방법 |
KR101466482B1 (ko) * | 2013-04-30 | 2014-12-02 | 경희대학교 산학협력단 | 산화 반응성 금속을 이용한 에칭 프리 그래핀 성장 방법 |
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