KR100773985B1 - 전자 소자 내장형 인쇄회로기판의 제조방법 - Google Patents
전자 소자 내장형 인쇄회로기판의 제조방법 Download PDFInfo
- Publication number
- KR100773985B1 KR100773985B1 KR1020060055068A KR20060055068A KR100773985B1 KR 100773985 B1 KR100773985 B1 KR 100773985B1 KR 1020060055068 A KR1020060055068 A KR 1020060055068A KR 20060055068 A KR20060055068 A KR 20060055068A KR 100773985 B1 KR100773985 B1 KR 100773985B1
- Authority
- KR
- South Korea
- Prior art keywords
- electronic device
- photosensitive film
- core substrate
- hole
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (6)
- (a) 코어 기판에 관통홀을 천공하는 단계;(b) 상기 코어 기판의 일면에 감광성 필름을 적층하는 단계;(c) 상기 코어 기판의 타면에서 상기 관통홀 내부에 전자 소자를 삽입하고, 상기 감광성 필름의 두께가 얇아지도록 상기 전자 소자를 상기 감광성 필름에 가압하는 단계;(d) 상기 코어 기판의 타면에서 상기 전자 소자의 방향으로 광을 조사하여 상기 전자 소자와 상기 관통홀 사이에 존재하는 상기 감광성 필름의 일부를 노광하여 상기 전자 소자를 고정하는 단계;(e) 상기 코어 기판의 타면에 절연층을 적층하고, 상기 절연층을 상기 코어 기판 방향으로 가압하여, 상기 절연층 일부가 상기 관통홀에 충진되도록하는 단계; 및(f) 상기 감광성 필름을 박리액으로 제거하는 단계를 포함하는 전자 소자 내장형 인쇄회로기판의 제조방법.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060055068A KR100773985B1 (ko) | 2006-06-19 | 2006-06-19 | 전자 소자 내장형 인쇄회로기판의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060055068A KR100773985B1 (ko) | 2006-06-19 | 2006-06-19 | 전자 소자 내장형 인쇄회로기판의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100773985B1 true KR100773985B1 (ko) | 2007-11-08 |
Family
ID=39061075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060055068A Expired - Fee Related KR100773985B1 (ko) | 2006-06-19 | 2006-06-19 | 전자 소자 내장형 인쇄회로기판의 제조방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100773985B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101208378B1 (ko) | 2010-03-31 | 2012-12-05 | 이비덴 가부시키가이샤 | 배선판 및 배선판의 제조 방법 |
US8466372B2 (en) | 2008-09-30 | 2013-06-18 | Ibiden Co., Ltd. | Wiring board with built-in electronic component and method for manufacturing the same |
CN115551225A (zh) * | 2021-06-30 | 2022-12-30 | 深南电路股份有限公司 | 埋入式元件电路板的制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151846A (ja) | 2000-02-09 | 2002-05-24 | Ngk Spark Plug Co Ltd | 配線基板およびその製造方法 |
JP2003037205A (ja) | 2001-07-23 | 2003-02-07 | Sony Corp | Icチップ内蔵多層基板及びその製造方法 |
JP2004335641A (ja) | 2003-05-06 | 2004-11-25 | Canon Inc | 半導体素子内蔵基板の製造方法 |
-
2006
- 2006-06-19 KR KR1020060055068A patent/KR100773985B1/ko not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151846A (ja) | 2000-02-09 | 2002-05-24 | Ngk Spark Plug Co Ltd | 配線基板およびその製造方法 |
JP2003037205A (ja) | 2001-07-23 | 2003-02-07 | Sony Corp | Icチップ内蔵多層基板及びその製造方法 |
JP2004335641A (ja) | 2003-05-06 | 2004-11-25 | Canon Inc | 半導体素子内蔵基板の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8466372B2 (en) | 2008-09-30 | 2013-06-18 | Ibiden Co., Ltd. | Wiring board with built-in electronic component and method for manufacturing the same |
KR101208378B1 (ko) | 2010-03-31 | 2012-12-05 | 이비덴 가부시키가이샤 | 배선판 및 배선판의 제조 방법 |
CN115551225A (zh) * | 2021-06-30 | 2022-12-30 | 深南电路股份有限公司 | 埋入式元件电路板的制作方法 |
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