KR0119888B1 - 반도체 메모리장치의 결함구제방법 및 그 회로 - Google Patents
반도체 메모리장치의 결함구제방법 및 그 회로Info
- Publication number
- KR0119888B1 KR0119888B1 KR1019940007549A KR19940007549A KR0119888B1 KR 0119888 B1 KR0119888 B1 KR 0119888B1 KR 1019940007549 A KR1019940007549 A KR 1019940007549A KR 19940007549 A KR19940007549 A KR 19940007549A KR 0119888 B1 KR0119888 B1 KR 0119888B1
- Authority
- KR
- South Korea
- Prior art keywords
- address
- fuse
- signal
- memory device
- redundant
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 230000002950 deficient Effects 0.000 claims description 37
- 238000005520 cutting process Methods 0.000 claims description 26
- 230000007547 defect Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 11
- 230000007812 deficiency Effects 0.000 abstract 6
- 238000010586 diagram Methods 0.000 description 12
- 230000008439 repair process Effects 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/785—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes
- G11C29/787—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes using a fuse hierarchy
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/785—Masking faults in memories by using spares or by reconfiguring using programmable devices with redundancy programming schemes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/24—Accessing extra cells, e.g. dummy cells or redundant cells
Landscapes
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
Claims (3)
- 반도체 메모리장차의 결합어드레스 저장회로에 있어서 : 전기적으로 용단가능한 다수의 퓨즈들에 각기 접속되며 병렬로 연결된 충전노드와 ; 외부제어신호에 대응하여 결함어드레스 저장신호를 출력하는 회로와 ; 상기 력합어드레스 저장신호에 응답하여 상기 충전노드중의 선택된 노드에 전류를 공급하는 회로와 ; 상기 충전노드에 각기 연결되며, 노말 억세스동작동안 상기 충전노드가 미리 설정된 레벨일 때 결함어드레스를 대치하는 리던던트블록 구동신호를 출력하는 리던던트 센스앰프와 ; 상기 결함어드레스 저장신호에 의해 활성화되며, 메모리장치 외부에서 제공되는 어드레스신호를 디코딩하여 상기 다수의 퓨즈들중 선택된 퓨즈에 전류패스를 형성함으로써 상기 선택된 충전노드에 공급되는 전류에 의해 상기 선택된 퓨즈가 용단되도록 제어하는 회로를 구비함을 특징으로 하는 반도체 메모리장치의 결함어드레스 저장회로.
- 제1항에 있어서, 상기 어드레스신호들은 상기 메모리장치의 어드레스신호공급핀을 통하여 공급됨을 특징으로 하는 반도체 메모리장치의 결함어드레스 저장회로.
- 제1전압으로 충전가능한 다수개의 충전노드를 가지며, 결함셀을 지정하는 N 비트의 어드레스신호와 동수인 N개의 병렬접속된 퓨즈들을 통하여 제2전압에 접속되는 결함어드레스 저장부를 갖는 반도체 메모리장치의 결함어드레스 저장방법에 있어서, 메모리장치 외부에서 인가되는 제1위치정보들을 디코딩함으로써 어느하나의 충전노드에 상기 제1전압을 공급하는 제1과정과, 메모리장치 외부에서 인가되는 제2위치정보들을 디코딩하여 선택된 충전노드에 접속된 다수개의 퓨즈들중 어느하나의 양단에 상기 제1전압 및 제2전압이 공급되도록 하여 퓨즈가 절단되도록 하는 제2과정을 구비하며, 상기 제2위치정보들을 순차적으로 가변하여 N개의 퓨즈들에 순차적으로 상기 제2과정을 반복되도록 하여 결함어드레스의 저장이 이루어짐을 특징으로 하는 반도체 메모리장치의 결함어드레스 저장방법.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940007549A KR0119888B1 (ko) | 1994-04-11 | 1994-04-11 | 반도체 메모리장치의 결함구제방법 및 그 회로 |
ITMI950731A IT1273529B (it) | 1994-04-11 | 1995-04-07 | Procedimento e circuito per riparare difetto in dispositivo di memoria a semiconduttore |
JP7084341A JP2777083B2 (ja) | 1994-04-11 | 1995-04-10 | 半導体メモリ装置の冗長プログラム方法及び回路 |
FR9504239A FR2718560B1 (fr) | 1994-04-11 | 1995-04-10 | Procédé et circuit pour réparer un défaut dans un dispositif de mémoire à semi-conducteur. |
CN95103348A CN1037721C (zh) | 1994-04-11 | 1995-04-11 | 修复半导体存储器器件中缺陷的方法和电路 |
DE19513789A DE19513789C2 (de) | 1994-04-11 | 1995-04-11 | Redundanter Blockdekoder für eine Halbleiterspeichervorrichtung |
US08/420,835 US5548555A (en) | 1994-04-11 | 1995-04-11 | Method and circuit for repairing defect in a semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940007549A KR0119888B1 (ko) | 1994-04-11 | 1994-04-11 | 반도체 메모리장치의 결함구제방법 및 그 회로 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950030164A KR950030164A (ko) | 1995-11-24 |
KR0119888B1 true KR0119888B1 (ko) | 1997-10-30 |
Family
ID=19380789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940007549A KR0119888B1 (ko) | 1994-04-11 | 1994-04-11 | 반도체 메모리장치의 결함구제방법 및 그 회로 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5548555A (ko) |
JP (1) | JP2777083B2 (ko) |
KR (1) | KR0119888B1 (ko) |
CN (1) | CN1037721C (ko) |
DE (1) | DE19513789C2 (ko) |
FR (1) | FR2718560B1 (ko) |
IT (1) | IT1273529B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8472269B2 (en) | 2010-09-01 | 2013-06-25 | Samsung Electronics Co., Ltd. | Redundancy control circuit and memory device including the same |
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KR0157339B1 (ko) * | 1995-06-28 | 1998-12-01 | 김광호 | 반도체 메모리의 불량셀 구제회로 |
US5748031A (en) * | 1996-02-01 | 1998-05-05 | Cypress Semiconductor, Corporation | Electrical laser fuse hybrid cell |
US5828624A (en) * | 1996-12-23 | 1998-10-27 | Cypress Semiconductor Corporation | Decoder circuit and method for disabling a number of columns or rows in a memory |
US5889679A (en) * | 1997-07-15 | 1999-03-30 | Integrated Device Technology, Inc. | Fuse array control for smart function enable |
US6154851A (en) * | 1997-08-05 | 2000-11-28 | Micron Technology, Inc. | Memory repair |
US6011733A (en) * | 1998-02-26 | 2000-01-04 | Lucent Technologies Inc. | Adaptive addressable circuit redundancy method and apparatus |
US5970013A (en) * | 1998-02-26 | 1999-10-19 | Lucent Technologies Inc. | Adaptive addressable circuit redundancy method and apparatus with broadcast write |
JPH11339493A (ja) * | 1998-05-27 | 1999-12-10 | Mitsubishi Electric Corp | 同期型半導体記憶装置 |
JP4260247B2 (ja) * | 1998-09-02 | 2009-04-30 | 富士通マイクロエレクトロニクス株式会社 | 半導体記憶装置 |
JP3301398B2 (ja) * | 1998-11-26 | 2002-07-15 | 日本電気株式会社 | 半導体記憶装置 |
US6407944B1 (en) | 1998-12-29 | 2002-06-18 | Samsung Electronics Co., Ltd. | Method for protecting an over-erasure of redundant memory cells during test for high-density nonvolatile memory semiconductor devices |
US6438672B1 (en) | 1999-06-03 | 2002-08-20 | Agere Systems Guardian Corp. | Memory aliasing method and apparatus |
JP4950816B2 (ja) * | 1999-06-03 | 2012-06-13 | 株式会社東芝 | 半導体メモリ |
US6288436B1 (en) * | 1999-07-27 | 2001-09-11 | International Business Machines Corporation | Mixed fuse technologies |
JP2001210092A (ja) * | 2000-01-24 | 2001-08-03 | Nec Corp | 半導体記憶装置 |
KR100328447B1 (ko) * | 2000-02-21 | 2002-03-16 | 박종섭 | 안티퓨즈 리페어 회로 |
KR100385950B1 (ko) * | 2001-01-15 | 2003-06-02 | 삼성전자주식회사 | 자동 퓨징 회로 |
US7085971B2 (en) * | 2001-10-25 | 2006-08-01 | International Business Machines Corporation | ECC based system and method for repairing failed memory elements |
KR100462877B1 (ko) * | 2002-02-04 | 2004-12-17 | 삼성전자주식회사 | 반도체 메모리 장치, 및 이 장치의 불량 셀 어드레스프로그램 회로 및 방법 |
US7055069B2 (en) * | 2002-08-23 | 2006-05-30 | Infineon Technologies Ag | Spare input/output buffer |
JP4175852B2 (ja) * | 2002-09-13 | 2008-11-05 | スパンション エルエルシー | 冗長セルアレイへの置き換えを正常に行う半導体メモリ |
US6819160B2 (en) * | 2002-11-13 | 2004-11-16 | International Business Machines Corporation | Self-timed and self-tested fuse blow |
US7405989B2 (en) * | 2005-03-07 | 2008-07-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electrical fuses with redundancy |
KR100739927B1 (ko) * | 2005-06-29 | 2007-07-16 | 주식회사 하이닉스반도체 | 반도체 메모리 장치의 리페어 입출력 퓨즈 회로 |
JP4946260B2 (ja) | 2006-08-16 | 2012-06-06 | 富士通セミコンダクター株式会社 | アンチヒューズ書込電圧発生回路を内蔵する半導体メモリ装置 |
KR101373183B1 (ko) * | 2008-01-15 | 2014-03-14 | 삼성전자주식회사 | 3차원 어레이 구조를 갖는 메모리 장치 및 그것의 리페어방법 |
KR101204665B1 (ko) * | 2010-03-31 | 2012-11-26 | 에스케이하이닉스 주식회사 | 퓨즈회로 |
JP5664204B2 (ja) * | 2010-12-15 | 2015-02-04 | 富士通株式会社 | 半導体メモリ |
US9202532B2 (en) | 2012-09-13 | 2015-12-01 | Winbond Electronics Corp. | Burst sequence control and multi-valued fuse scheme in memory device |
KR20150019442A (ko) * | 2013-08-14 | 2015-02-25 | 삼성전자주식회사 | 퓨즈 셀들의 프로그래밍 방법 및 메모리 복구 방법 |
US9117534B2 (en) * | 2014-01-23 | 2015-08-25 | Freescale Semiconductor, Inc. | Fuse circuit with test mode |
KR101803721B1 (ko) | 2016-09-05 | 2017-12-01 | 주식회사 에스앤에스티 | 개선된 전기적 퓨즈 구조 |
KR102416942B1 (ko) * | 2017-11-13 | 2022-07-07 | 에스케이하이닉스 주식회사 | 적층 반도체 장치 및 반도체 시스템 |
KR20200101651A (ko) * | 2019-02-20 | 2020-08-28 | 에스케이하이닉스 주식회사 | 메모리 및 메모리의 동작 방법 |
US11309057B2 (en) * | 2020-04-28 | 2022-04-19 | Micron Technology, Inc. | Apparatuses and methods for post-package repair protection |
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US4358833A (en) * | 1980-09-30 | 1982-11-09 | Intel Corporation | Memory redundancy apparatus for single chip memories |
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JP2778234B2 (ja) * | 1990-09-13 | 1998-07-23 | 日本電気株式会社 | 冗長デコーダ回路 |
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JP3020077B2 (ja) * | 1993-03-03 | 2000-03-15 | 株式会社日立製作所 | 半導体メモリ |
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-
1994
- 1994-04-11 KR KR1019940007549A patent/KR0119888B1/ko not_active IP Right Cessation
-
1995
- 1995-04-07 IT ITMI950731A patent/IT1273529B/it active IP Right Grant
- 1995-04-10 FR FR9504239A patent/FR2718560B1/fr not_active Expired - Lifetime
- 1995-04-10 JP JP7084341A patent/JP2777083B2/ja not_active Expired - Lifetime
- 1995-04-11 CN CN95103348A patent/CN1037721C/zh not_active Expired - Lifetime
- 1995-04-11 US US08/420,835 patent/US5548555A/en not_active Expired - Lifetime
- 1995-04-11 DE DE19513789A patent/DE19513789C2/de not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8472269B2 (en) | 2010-09-01 | 2013-06-25 | Samsung Electronics Co., Ltd. | Redundancy control circuit and memory device including the same |
US8755238B2 (en) | 2010-09-01 | 2014-06-17 | Samsung Electronics Co., Ltd. | Redundancy control circuit and memory device including the same |
Also Published As
Publication number | Publication date |
---|---|
CN1037721C (zh) | 1998-03-11 |
US5548555A (en) | 1996-08-20 |
ITMI950731A0 (it) | 1995-04-07 |
ITMI950731A1 (it) | 1996-10-07 |
IT1273529B (it) | 1997-07-08 |
JP2777083B2 (ja) | 1998-07-16 |
DE19513789A1 (de) | 1995-10-12 |
KR950030164A (ko) | 1995-11-24 |
DE19513789C2 (de) | 2000-11-16 |
JPH07287992A (ja) | 1995-10-31 |
CN1117193A (zh) | 1996-02-21 |
FR2718560A1 (fr) | 1995-10-13 |
FR2718560B1 (fr) | 1997-06-20 |
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