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JPS6486573A - Light emitting device - Google Patents

Light emitting device

Info

Publication number
JPS6486573A
JPS6486573A JP62178316A JP17831687A JPS6486573A JP S6486573 A JPS6486573 A JP S6486573A JP 62178316 A JP62178316 A JP 62178316A JP 17831687 A JP17831687 A JP 17831687A JP S6486573 A JPS6486573 A JP S6486573A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lens
diode chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62178316A
Other languages
Japanese (ja)
Inventor
Mokichi Sudo
Hideyuki Masuda
Tomizo Yamada
Naomi Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Oshima Electric Works Co Ltd
Kohden Co Ltd
Original Assignee
Oshima Electric Works Co Ltd
Dowa Mining Co Ltd
Kohden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oshima Electric Works Co Ltd, Dowa Mining Co Ltd, Kohden Co Ltd filed Critical Oshima Electric Works Co Ltd
Priority to JP62178316A priority Critical patent/JPS6486573A/en
Publication of JPS6486573A publication Critical patent/JPS6486573A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To align light axes in a specified direction and remove luminance unevenness, by arranging a light emitting diode chip directly on a substrate and forming a condenser lens for each light emitting diode chip integrally to disposed it on the substrate. CONSTITUTION:A light emitting diode chip 17 is directly disposed on a substrate 11, condenser members 25 to which condenser lenses 26 are integrally formed are arranged on the substrates 11 via spacers 23 at intervals and opposed to each other. Therefore, the positional relation between a light emitting diode chip 17 and lens 26 and the optical axis direction of a lens 26 are uniquely defined and there is no possibility of variations in mounting. Thus, a device having each lens 26 aligned accurately in one direction can be made with high yield rate and accordingly it can be made efficiently without luminance variations.
JP62178316A 1987-07-17 1987-07-17 Light emitting device Pending JPS6486573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62178316A JPS6486573A (en) 1987-07-17 1987-07-17 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62178316A JPS6486573A (en) 1987-07-17 1987-07-17 Light emitting device

Publications (1)

Publication Number Publication Date
JPS6486573A true JPS6486573A (en) 1989-03-31

Family

ID=16046348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62178316A Pending JPS6486573A (en) 1987-07-17 1987-07-17 Light emitting device

Country Status (1)

Country Link
JP (1) JPS6486573A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (en) * 1989-06-05 1991-01-23
JPH03230586A (en) * 1990-02-05 1991-10-14 Mitsubishi Cable Ind Ltd LED module
JPH04111769U (en) * 1991-03-14 1992-09-29 株式会社小糸製作所 Modular type LED display device
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
WO2000070687A1 (en) * 1999-05-14 2000-11-23 Osram Opto Semiconductors Gmbh & Co. Ohg Led module for signaling devices
JP2001356294A (en) * 2000-04-05 2001-12-26 Mannesmann Vdo Ag Color head-up display
WO2003023857A3 (en) * 2001-09-13 2004-06-03 Lucea Ag Led-luminous panel and carrier plate
WO2004070839A3 (en) * 2003-02-05 2005-03-10 Acol Technologies S A Light emitting apparatus comprising semiconductor light emitting devices
EP0976589A4 (en) * 1997-03-18 2006-11-08 Acol Technologies S A Luminescent diode
JP2007311398A (en) * 2006-05-16 2007-11-29 Fujikura Ltd Light emitting device
US7439549B2 (en) 2000-10-16 2008-10-21 Osram Gmbh LED module
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
DE102009016683B4 (en) * 2008-12-24 2015-06-25 Industrial Technology Research Institute Multichip LED

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045079A (en) * 1983-08-23 1985-03-11 Honda Motor Co Ltd Flexible lamp using light emitting diode
JPS61181002A (en) * 1985-02-05 1986-08-13 株式会社小糸製作所 Lighting apparatus
JPS6255973A (en) * 1985-09-05 1987-03-11 Copal Co Ltd Led light source
JPS634010B2 (en) * 1980-06-03 1988-01-27 Nippon Denso Kk

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634010B2 (en) * 1980-06-03 1988-01-27 Nippon Denso Kk
JPS6045079A (en) * 1983-08-23 1985-03-11 Honda Motor Co Ltd Flexible lamp using light emitting diode
JPS61181002A (en) * 1985-02-05 1986-08-13 株式会社小糸製作所 Lighting apparatus
JPS6255973A (en) * 1985-09-05 1987-03-11 Copal Co Ltd Led light source

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (en) * 1989-06-05 1991-01-23
JPH03230586A (en) * 1990-02-05 1991-10-14 Mitsubishi Cable Ind Ltd LED module
JPH04111769U (en) * 1991-03-14 1992-09-29 株式会社小糸製作所 Modular type LED display device
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
EP0976589A4 (en) * 1997-03-18 2006-11-08 Acol Technologies S A Luminescent diode
WO2000070687A1 (en) * 1999-05-14 2000-11-23 Osram Opto Semiconductors Gmbh & Co. Ohg Led module for signaling devices
JP2001356294A (en) * 2000-04-05 2001-12-26 Mannesmann Vdo Ag Color head-up display
US7439549B2 (en) 2000-10-16 2008-10-21 Osram Gmbh LED module
US8113688B2 (en) 2000-10-16 2012-02-14 Osram Ag Configuration of multiple LED module
US7862211B2 (en) 2000-10-16 2011-01-04 Osram Gmbh Configuration of multiple LED modules
WO2003023857A3 (en) * 2001-09-13 2004-06-03 Lucea Ag Led-luminous panel and carrier plate
WO2004070839A3 (en) * 2003-02-05 2005-03-10 Acol Technologies S A Light emitting apparatus comprising semiconductor light emitting devices
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
JP2007311398A (en) * 2006-05-16 2007-11-29 Fujikura Ltd Light emitting device
DE102009016683B4 (en) * 2008-12-24 2015-06-25 Industrial Technology Research Institute Multichip LED

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