JPS6461027A - Device for mounting chip - Google Patents
Device for mounting chipInfo
- Publication number
- JPS6461027A JPS6461027A JP62218892A JP21889287A JPS6461027A JP S6461027 A JPS6461027 A JP S6461027A JP 62218892 A JP62218892 A JP 62218892A JP 21889287 A JP21889287 A JP 21889287A JP S6461027 A JPS6461027 A JP S6461027A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bump
- reversing
- attitude
- attracted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To eliminate manual labor in reversing a semiconductor chip and to largely improve working efficiency by reversing the chip upside down by a reversely feeding arm, disposing a bump in a downward attitude, and then placing it on a positioning unit. CONSTITUTION:A flip-chip 1 disposed on an expanding sheet 1 in an upward attitude of a bump 1a is first fed by a chip feeder 10, and placed on the movable end of a reversely feeding arm 5. The chip 1 attracted to and held at the movable end is placed on a positioning unit 9 by the reversing operation of the arm 5. In this case, the chip 1 is disposed in a downward attitude at its bump 1a. The chip 1 placed on the unit 9 to be positioned is attracted to and held at the feeder 10, fed to a predetermined position on a semiconductor substrate 5, and placed in the downward attitude of the bump 1a. Thus, its working efficiency can be largely improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62218892A JPS6461027A (en) | 1987-08-31 | 1987-08-31 | Device for mounting chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62218892A JPS6461027A (en) | 1987-08-31 | 1987-08-31 | Device for mounting chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6461027A true JPS6461027A (en) | 1989-03-08 |
Family
ID=16726939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62218892A Pending JPS6461027A (en) | 1987-08-31 | 1987-08-31 | Device for mounting chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6461027A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5188280A (en) * | 1989-04-28 | 1993-02-23 | Hitachi Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
| US5609292A (en) * | 1992-12-04 | 1997-03-11 | International Business Machines Corporation | Manufacturing circuit boards using a pick and place machine |
| US5765277A (en) * | 1995-09-30 | 1998-06-16 | Samsung Electronics Co., Ltd. | Die bonding apparatus with a revolving pick-up tool |
| EP0895450A2 (en) * | 1997-07-28 | 1999-02-03 | Matsushita Electric Industrial Co., Ltd. | Component feeder and mounter |
| JP2003092313A (en) * | 2001-09-19 | 2003-03-28 | Nec Machinery Corp | Chip inverting device and die-bonder |
| US7028392B1 (en) | 1999-03-05 | 2006-04-18 | Siemens Dematic Ag | Device for fitting a substrate with a flip chip |
| WO2007021029A2 (en) * | 2005-08-16 | 2007-02-22 | Matsushita Electric Industrial Co., Ltd. | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| US20120085812A1 (en) * | 2010-10-08 | 2012-04-12 | Orthodyne Electronics Corporation | Solar substrate ribbon bonding system |
| KR20170006962A (en) * | 2015-07-10 | 2017-01-18 | 한화테크윈 주식회사 | Chip mounter |
-
1987
- 1987-08-31 JP JP62218892A patent/JPS6461027A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5188280A (en) * | 1989-04-28 | 1993-02-23 | Hitachi Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
| US5609292A (en) * | 1992-12-04 | 1997-03-11 | International Business Machines Corporation | Manufacturing circuit boards using a pick and place machine |
| US5765277A (en) * | 1995-09-30 | 1998-06-16 | Samsung Electronics Co., Ltd. | Die bonding apparatus with a revolving pick-up tool |
| EP0895450A2 (en) * | 1997-07-28 | 1999-02-03 | Matsushita Electric Industrial Co., Ltd. | Component feeder and mounter |
| EP0895450A3 (en) * | 1997-07-28 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Component feeder and mounter |
| US6467158B1 (en) | 1997-07-28 | 2002-10-22 | Matsushita Electric Industrial Co., Ltd. | Component feeder with load position alignment recognition |
| US7028392B1 (en) | 1999-03-05 | 2006-04-18 | Siemens Dematic Ag | Device for fitting a substrate with a flip chip |
| JP2003092313A (en) * | 2001-09-19 | 2003-03-28 | Nec Machinery Corp | Chip inverting device and die-bonder |
| WO2007021029A2 (en) * | 2005-08-16 | 2007-02-22 | Matsushita Electric Industrial Co., Ltd. | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| JP2007053156A (en) * | 2005-08-16 | 2007-03-01 | Matsushita Electric Ind Co Ltd | Apparatus and method for turning over chip, and apparatus and method for mounting chip |
| WO2007021029A3 (en) * | 2005-08-16 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| US20120085812A1 (en) * | 2010-10-08 | 2012-04-12 | Orthodyne Electronics Corporation | Solar substrate ribbon bonding system |
| US8196798B2 (en) * | 2010-10-08 | 2012-06-12 | Kulicke And Soffa Industries, Inc. | Solar substrate ribbon bonding system |
| US8251274B1 (en) | 2010-10-08 | 2012-08-28 | Orthodyne Electronics Corporation | Solar substrate ribbon bonding system |
| KR20170006962A (en) * | 2015-07-10 | 2017-01-18 | 한화테크윈 주식회사 | Chip mounter |
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