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JPS53100765A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS53100765A
JPS53100765A JP1465577A JP1465577A JPS53100765A JP S53100765 A JPS53100765 A JP S53100765A JP 1465577 A JP1465577 A JP 1465577A JP 1465577 A JP1465577 A JP 1465577A JP S53100765 A JPS53100765 A JP S53100765A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
sheet
miss
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1465577A
Other languages
Japanese (ja)
Other versions
JPS5724927B2 (en
Inventor
Teruo Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1465577A priority Critical patent/JPS53100765A/en
Publication of JPS53100765A publication Critical patent/JPS53100765A/en
Publication of JPS5724927B2 publication Critical patent/JPS5724927B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To improve working efficiency and reduce damaging and conveying miss of elements by bonding a pad surface to a sheet, cutting a wafer, and directly mounting the element from the sheet surface to element member.
COPYRIGHT: (C)1978,JPO&Japio
JP1465577A 1977-02-15 1977-02-15 Production of semiconductor device Granted JPS53100765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1465577A JPS53100765A (en) 1977-02-15 1977-02-15 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1465577A JPS53100765A (en) 1977-02-15 1977-02-15 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53100765A true JPS53100765A (en) 1978-09-02
JPS5724927B2 JPS5724927B2 (en) 1982-05-26

Family

ID=11867220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1465577A Granted JPS53100765A (en) 1977-02-15 1977-02-15 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53100765A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543853A (en) * 1978-09-25 1980-03-27 Hitachi Ltd Dicing
JPS5632904U (en) * 1979-08-22 1981-03-31
JPS5989538U (en) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 pellet pick up device
JPH04367250A (en) * 1991-06-14 1992-12-18 Sharp Corp Manufacture of semiconductor chip
KR100425946B1 (en) * 2002-02-20 2004-04-01 주식회사 칩팩코리아 METHOD FOR FORMING Au STUD BUMP OF FLIP CHIP PACKAGE
JP2014517500A (en) * 2011-04-15 2014-07-17 ミュールバウアー アクチェンゲゼルシャフト Device and method for transferring electronic components from a first carrier to a second carrier
JP2014517539A (en) * 2011-06-15 2014-07-17 ミュールバウアー アクチェンゲゼルシャフト Apparatus and method for positioning an electronic component and / or carrier relative to a discharge device
WO2020043612A1 (en) 2018-08-27 2020-03-05 Muehlbauer GmbH & Co. KG Inspection when transferring electronic components from a first substrate to a second substrate
WO2020043613A1 (en) 2018-08-27 2020-03-05 Muehlbauer GmbH & Co. KG Transferring of electronic components from a first to a second carrier
DE102020001439B3 (en) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Apparatus and method for transferring electronic components from a first to a second carrier
WO2022048950A1 (en) 2020-09-07 2022-03-10 Muehlbauer GmbH & Co. KG Devices and methods for operating at least two tools

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040943A (en) * 1972-08-30 1975-04-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040943A (en) * 1972-08-30 1975-04-15

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543853A (en) * 1978-09-25 1980-03-27 Hitachi Ltd Dicing
JPS5632904U (en) * 1979-08-22 1981-03-31
JPS5989538U (en) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 pellet pick up device
JPH04367250A (en) * 1991-06-14 1992-12-18 Sharp Corp Manufacture of semiconductor chip
KR100425946B1 (en) * 2002-02-20 2004-04-01 주식회사 칩팩코리아 METHOD FOR FORMING Au STUD BUMP OF FLIP CHIP PACKAGE
JP2014517500A (en) * 2011-04-15 2014-07-17 ミュールバウアー アクチェンゲゼルシャフト Device and method for transferring electronic components from a first carrier to a second carrier
DE102011017218B4 (en) 2011-04-15 2018-10-31 Mühlbauer Gmbh & Co. Kg Apparatus and method for transferring electronic components from a first carrier to a second carrier
JP2014517539A (en) * 2011-06-15 2014-07-17 ミュールバウアー アクチェンゲゼルシャフト Apparatus and method for positioning an electronic component and / or carrier relative to a discharge device
WO2020043612A1 (en) 2018-08-27 2020-03-05 Muehlbauer GmbH & Co. KG Inspection when transferring electronic components from a first substrate to a second substrate
WO2020043613A1 (en) 2018-08-27 2020-03-05 Muehlbauer GmbH & Co. KG Transferring of electronic components from a first to a second carrier
DE102018006771B4 (en) 2018-08-27 2022-09-08 Mühlbauer Gmbh & Co. Kg Device and method for transferring electronic components from a first to a second carrier
US11545374B2 (en) 2018-08-27 2023-01-03 Muehlbauer GmbH & Co. KG Transferring of electronic components from a first to a second carrier
US12046491B2 (en) 2018-08-27 2024-07-23 Muehlbauer GmbH & Co. KG Inspection unit of a transfer device for transferring components between substrates
DE102020001439B3 (en) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Apparatus and method for transferring electronic components from a first to a second carrier
WO2021165450A1 (en) 2020-02-21 2021-08-26 Muehlbauer GmbH & Co. KG Apparatus and method for transferring electronic components from a first to a second carrier
US12094736B2 (en) 2020-02-21 2024-09-17 Muehlbauer GmbH & Co. KG Apparatus and method for transferring electronic components from a first carrier to a second carrier
WO2022048950A1 (en) 2020-09-07 2022-03-10 Muehlbauer GmbH & Co. KG Devices and methods for operating at least two tools
DE102020005484A1 (en) 2020-09-07 2022-03-10 Mühlbauer Gmbh & Co. Kg Devices and methods for operating at least two tools

Also Published As

Publication number Publication date
JPS5724927B2 (en) 1982-05-26

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