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JPS6453122A - Method for measuring soldering temperature - Google Patents

Method for measuring soldering temperature

Info

Publication number
JPS6453122A
JPS6453122A JP62209592A JP20959287A JPS6453122A JP S6453122 A JPS6453122 A JP S6453122A JP 62209592 A JP62209592 A JP 62209592A JP 20959287 A JP20959287 A JP 20959287A JP S6453122 A JPS6453122 A JP S6453122A
Authority
JP
Japan
Prior art keywords
infrared
ray
temperature
filter
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62209592A
Other languages
Japanese (ja)
Inventor
Shigeru Morimoto
Yasuhiro Nagata
Yasuto Yanagida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP62209592A priority Critical patent/JPS6453122A/en
Publication of JPS6453122A publication Critical patent/JPS6453122A/en
Pending legal-status Critical Current

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  • Radiation Pyrometers (AREA)

Abstract

PURPOSE:To exclude the peak art of an infrared-ray spectrum emitted by a body to be measured and to accurately measure the soldering temperature by measuring selectively only the infrared ray in a specific wavelength band of the infrared-ray spectrum. CONSTITUTION:An infrared ray which is incident from a heating body 1 or gas burner 2 is cut off intermittently by the rotating shield plate of a chopper 4 and converted into a rectangular incident signal, and only infrared-ray intensity in 0.8-1.3mum, 2.2-2.4mum, or 3.8-4.1mum wavelength band of the infrared-ray spectrum passes through a filter 5. The infrared ray passed through the filter 5 is measured by the measurement system consisting of a spectroscope 6 and a temperature sensor 8 in combination and the influence of the radiation of an infrared ray from the flame of the gas burner 2 is excluded to accurately measure the temperature of the heating body 1.
JP62209592A 1987-08-24 1987-08-24 Method for measuring soldering temperature Pending JPS6453122A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62209592A JPS6453122A (en) 1987-08-24 1987-08-24 Method for measuring soldering temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62209592A JPS6453122A (en) 1987-08-24 1987-08-24 Method for measuring soldering temperature

Publications (1)

Publication Number Publication Date
JPS6453122A true JPS6453122A (en) 1989-03-01

Family

ID=16575379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62209592A Pending JPS6453122A (en) 1987-08-24 1987-08-24 Method for measuring soldering temperature

Country Status (1)

Country Link
JP (1) JPS6453122A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4012615A1 (en) * 1990-04-20 1991-10-24 T Elektronik Gmbh As Combined contactless temp. measuring of wafer being processed - using quartz glass or material to absorb optical radiation components between radiation source and semiconductor wafer
JP2008232468A (en) * 2007-03-16 2008-10-02 Osaka Gas Co Ltd Temperature detection device for cooking device
JP2008232469A (en) * 2007-03-16 2008-10-02 Osaka Gas Co Ltd Temperature detection device for cooking device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4012615A1 (en) * 1990-04-20 1991-10-24 T Elektronik Gmbh As Combined contactless temp. measuring of wafer being processed - using quartz glass or material to absorb optical radiation components between radiation source and semiconductor wafer
DE4012615C2 (en) * 1990-04-20 1992-07-16 A.S.T. Elektronik Gmbh, 7900 Ulm, De
JP2008232468A (en) * 2007-03-16 2008-10-02 Osaka Gas Co Ltd Temperature detection device for cooking device
JP2008232469A (en) * 2007-03-16 2008-10-02 Osaka Gas Co Ltd Temperature detection device for cooking device

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