JPS6335119B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a board circuit device, in which a terminal is fixed to a wiring board that is once punched out from a board base material and then press-fitted to the base material again. It is an object of the present invention to provide a method for manufacturing a board circuit device in which a circuit component can be inserted into a wiring board while the bonding strength between the board base material and the wiring board is high.

As a conventional method for manufacturing a circuit board device, for example, as shown in FIG. 1, a wiring board 2 is punched out from a board base material 1, and after inserting a circuit component 4, the wiring board 2 is punched out as shown in FIG. There was a method of press-fitting it again into the substrate base material 1 and performing solder dip in that state. However, in this method, the circuit components must be inserted into the wiring board 2 that is separated from the board base material 1, and at that time, a separate method for holding the wiring board 2 is required, and therefore, it is particularly difficult to use automation. However, the disadvantage was that the process could not be simplified. In addition, in this case, a method may be considered in which the wiring board 2 that has been punched out from the base material 1 is again press-fitted into the base material 1 and then the circuit member 4 is inserted. It is difficult to maintain sufficient bonding strength, and during mass production, the wiring board 2 sometimes falls off from the base material 1, especially when the circuit components 4 are inserted into the wiring board 2.

The present invention eliminates the above drawbacks, and embodiments of the method for manufacturing a substrate circuit device according to the present invention will be described below with reference to the drawings.

FIG. 3 is a perspective view showing a method of manufacturing a substrate circuit device according to the present invention. In the figure, the wiring board 2 provided with the terminal holes 6 is first assembled into a multi-piece wiring board base material 1.
This wiring board 2 is press-fitted into the base material 1 again, and the terminals 5 are fixed to the edge of the wiring board 2. As shown in the perspective view, the mating protrusions 51 for the terminals 5 are fitted into the terminal holes 6a near the edge of the wiring board 2 and fixed therein. At that time, the terminal 5 is connected from the substrate 2 to the base material 1.
The convex portion 52 of the terminal 5 engages with the hole 7 of the base material 1 to position the terminal 5.
This fixing of the terminals 5 prevents the wiring board 2 from falling off the base material 1 and strengthens the bond between the base material 1 and the wiring board 2. After that, the circuit component 4 is inserted into the wiring board 2, and the circuit component 4 and the terminal 5 are soldered and fixed by dipping it in solder. 2 will not fall off. Here, the outer shell 2a of the wiring board 2 has many irregularities. This is base material 1 and wiring board 2
This is to further increase the bonding strength by enlarging the contact area. Finally, the wiring board 2 is removed upward from the base material 1 to obtain a board circuit device.

Another embodiment of the method for manufacturing a board circuit device according to the present invention shown in FIG. 5 is similar to the previous embodiment, in which terminals 5 are punched out from a wiring board base material 1 and then press-fitted again to a wiring board 2. After the circuit components 4 are fixed, the legs 20a of the case 20 are fitted into the leg holes 21 formed between the wiring board 2 and the base material 1, and the case 20 is assembled to the board circuit device. In this method, the circuit components 4, the terminals 5, and the legs 20a of the case 20 are fixed by soldering, and the wiring board 2 is removed from the base material 1 to obtain a board circuit device with a case.

In the above embodiment, the same effect can be obtained even if the step of fixing the terminals to the substrate is performed after the substrate is punched out and before the terminals are press-fitted again.

As described above, according to the method for manufacturing a board circuit device according to the present invention, since the edge of the wiring board is supported by the base material and the circuit components are inserted, the circuit components are inserted up to the vicinity of the edge of the wiring board. can be inserted, making effective use of the wiring board, and since the base material from which the wiring board is punched out is reused to support the wiring board, parts can be used rationally, and even complex-shaped wiring boards can be supported. Since many wiring boards can be supported on one base material and processes such as component insertion and soldering can be performed, the process is simplified during automation, and terminals can be connected while extending from the board to the base material. Since the circuit components are fixed to the board and inserted into the board, the circuit components can be inserted while the bond between the board and the base material is high, and the board will not fall off the base material. have

[Brief explanation of the drawing]

1 and 2 are diagrams showing a conventional method for manufacturing a board circuit device, FIGS. 3 and 4 are diagrams showing an embodiment of a method for manufacturing a board circuit device according to the present invention, and FIG. It is a figure which shows the other Example of the manufacturing method of the board|substrate circuit device based on invention. DESCRIPTION OF SYMBOLS 1... Wiring board base material, 2... Wiring board, 4... Circuit component, 5... Terminal, 51... Protrusion for eyes, 6, 6a... Terminal hole.

Claims (1)

[Claims] 1. A process of punching out a wiring board from a wiring board base material with a plurality of external fitting portions provided therein, a process of press-fitting this wiring board to the base material again, and a process of providing terminals on the wiring board base material. a step of fixing the circuit component to the wiring board in a state extending parallel to the wiring board by positioning the circuit component in the hole and fixing it in the terminal hole of the wiring board; a step of inserting the circuit component into the wiring board; and a step of inserting the circuit component into the wiring board. and a step of soldering and fixing the terminals.