JPH04163864A - Clip terminal of hybrid integrated circuit - Google Patents
Clip terminal of hybrid integrated circuitInfo
- Publication number
- JPH04163864A JPH04163864A JP2291596A JP29159690A JPH04163864A JP H04163864 A JPH04163864 A JP H04163864A JP 2291596 A JP2291596 A JP 2291596A JP 29159690 A JP29159690 A JP 29159690A JP H04163864 A JPH04163864 A JP H04163864A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- cut
- pieces
- arise
- clip terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 2
- 230000004927 fusion Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は混成集積回路のクリップ端子に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to clip terminals for hybrid integrated circuits.
混成集積回路の形態は、厚膜印刷基板や薄−基板等の上
に、能動素子、受動素子を搭載し、その混成集積回路に
必要な入出力端子および電源端子を必要数設ける構造が
一般的である。このような混成集積回路に使用されるク
リップ端子７は、第２図のように、鉄あるいはりン青銅
の材料により、基板６の端面部分を側面からはさみ込む
ように、基板６を差し込み、端子７と基板６の端子材は
ランドを半田で固定接続している。端子７は、鉄あるい
はリン青銅のバネ性を利用して、基板挿入後の端子の保
持をしている。Hybrid integrated circuits generally have a structure in which active and passive elements are mounted on a thick film printed circuit board or thin substrate, and the required number of input/output terminals and power supply terminals are provided for the hybrid integrated circuit. It is. The clip terminals 7 used in such hybrid integrated circuits are made of iron or phosphor bronze, and the terminals are made by inserting the board 6 so as to sandwich the end surface of the board 6 from the sides, as shown in FIG. 7 and the terminal material of the board 6 are fixedly connected to the lands with solder. The terminal 7 utilizes the springiness of iron or phosphor bronze to hold the terminal after insertion into the board.
このような従来のクリップ端子７では、基板６への保持
を材質のバネ性を利用しているだけであり、若干の機械
的ストレスを加えるとはずれる問題があった。また、ク
リップ端子７は半田浸漬法で接続するため、半田溶融温
度以上の工程ストレスがかかると、端子７がはずれると
いう問題もあった。特に、表面実装タイプの混成集積回
路をマザーボードに実装する工程として、半田リフロー
法が前記の理由で使用できないため、局所加熱法である
半田コテ付け、レーザー半田溶融法など実装方法が限定
され、コストアップ、組立工数の増大などの問題があっ
た。Such conventional clip terminals 7 simply utilize the springiness of the material to hold them on the board 6, and there was a problem that they would come off if a slight mechanical stress was applied. Furthermore, since the clip terminals 7 are connected by a solder dipping method, there is a problem that the terminals 7 may come off if a process stress exceeding the solder melting temperature is applied. In particular, as the solder reflow method cannot be used as a process for mounting surface-mount type hybrid integrated circuits on motherboards for the reasons mentioned above, mounting methods such as local heating methods such as soldering irons and laser solder melting methods are limited and cost-effective. There were problems such as an increase in the number of assembly steps and an increase in assembly man-hours.
本発明の目的は、前記問題点を解決し、基板から脱落す
る事故が生じないようにした混成集積回路のクリップ端
子を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a clip terminal for a hybrid integrated circuit which solves the above problems and prevents the clip terminal from falling off the board.
本発明の混成集積回路のクリップ端子の構成は、中央部
を残し、両端部にそれぞれカッティングを入れて上分割
片、上分割片をそれぞれ設け、前記上下分割片は互いに
逆方向に折り曲げられており、前記両端部の上分割片は
互いに逆方向に折り曲げられていることを特徴とする。The configuration of the clip terminal of the hybrid integrated circuit of the present invention is such that the center portion is left open and both ends are cut to provide an upper divided piece and an upper divided piece, respectively, and the upper and lower divided pieces are bent in opposite directions. , the upper divided pieces at both ends are bent in opposite directions.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の混成集積回路のクリップ端
子を示す斜視図である。FIG. 1 is a perspective view showing a clip terminal of a hybrid integrated circuit according to an embodiment of the present invention.
第１図において、本実施例では、クリップ端子１の中央
部５に基板の厚さに相当する長さのくびれ２，２′を設
け、そのくびれ２，２′の上下に、それぞれ割れ目を１
ｕ入れ、それぞれ分割した片々３，４を中央部５を中心
に各々反対側に折り曲げ、各々０．２５ｍｍ側方に飛び
だすように加工する。In FIG. 1, in this embodiment, constrictions 2 and 2' with a length corresponding to the thickness of the board are provided in the central part 5 of the clip terminal 1, and one crack is formed above and below each of the constrictions 2 and 2'.
Insert the u and bend the divided pieces 3 and 4 to opposite sides centering on the center part 5, and process them so that they each protrude 0.25 mm laterally.
即ち、クリップ端子１の分割中央部５を残して、両端部
分にカッティングを入れて、上の分割片３と下の分割片
４とを互いに反対方向に折り曲げて、いわゆるくびれ２
を形成する。−万端の分割片３と他方端の分割片３′と
も互いに反対方向に折り曲げられる。他方の分割片３’
、４’も折り曲げられ、くびれ２′を形成する。That is, leaving the split central part 5 of the clip terminal 1 and making cuts at both ends, bending the upper split piece 3 and the lower split piece 4 in opposite directions to form the so-called constriction 2.
form. - Both the divided piece 3 at one end and the divided piece 3' at the other end are bent in opposite directions. The other divided piece 3'
, 4' are also bent to form a constriction 2'.
第３図は第１図のクリップ端子１１を基板１６に挿入し
た状態を示す斜視図である。第３図において、ＤＩＰ構
造の混成集積回路の端子挿入状態を示している。基板１
６のクリップ端子挿入孔１２は、Ｑ、８ ＸＱ、２５ｗ
ｍの大きさを持っている。基板１６の下方から、クリッ
プ端子１１を挿入し、３分割した両端の分割片３が基板
１６の上に出るところまで挿入する。その後この部分を
半田浸漬法により半田接続し、端子のタイバーを切断す
る。FIG. 3 is a perspective view showing the clip terminal 11 shown in FIG. 1 inserted into the board 16. FIG. 3 shows a terminal insertion state of a hybrid integrated circuit having a DIP structure. Board 1
6 clip terminal insertion hole 12 is Q, 8 XQ, 25w
It has a size of m. The clip terminal 11 is inserted from below the board 16 until the divided pieces 3 at both ends protrude above the board 16. After that, this part is soldered and connected using the solder dipping method, and the tie bar of the terminal is cut.
第４図は第１図のクリップ端子２１を挿入した状態を示
す斜視図である。この混成集積回路は表面実装構造のも
のである。クリップ端子２１の根元部分を９０＠折り曲
げることにより、表面実装タイプのクリップ端子２１と
なる。次に導体パターン２７とクリップ端子とが、半田
付けされる。FIG. 4 is a perspective view showing a state in which the clip terminal 21 of FIG. 1 is inserted. This hybrid integrated circuit is of surface mount construction. By bending the base portion of the clip terminal 21 by 90@, it becomes a surface mount type clip terminal 21. Next, the conductor pattern 27 and the clip terminal are soldered.
以上説明したように、本発明の・クリップ１子は、端子
の形状を上下からおさえこむ構造を持たせたので、特に
半田溶融温度をかけても、基板から端子がはずれること
を防ぐ効果がある。As explained above, the single clip of the present invention has a structure that suppresses the shape of the terminal from above and below, so it has the effect of preventing the terminal from coming off from the board even when the solder melting temperature is applied. .
第１図は本発明の一実施例のクリップ端子を示す斜視図
、第２図は従来のクリップ端子を基板に挿入した状態を
示す斜視図、第３図は第１図のクリップ端子をＤＩＰ構
造の混成集積回路の基板に挿入した斜視図、第４図は第
１図のクリップ端子を表面実装構造の混成集積回路の基
板に挿入した斜視図である。
１．１１．２１・・・クリップ端子、２・・・端子のく
びれ、３，４・・・端子の分割片、５・・・端子の分割
後の中央部、６．１Ｂ、２６・・・基板、１２・・・基
板挿入孔、２７・・・端子接続用基板の導体パターン。Fig. 1 is a perspective view showing a clip terminal according to an embodiment of the present invention, Fig. 2 is a perspective view showing a state in which a conventional clip terminal is inserted into a board, and Fig. 3 is a perspective view showing a conventional clip terminal inserted into a board. FIG. 4 is a perspective view of the clip terminal shown in FIG. 1 inserted into a board of a surface-mounted hybrid integrated circuit. 1.11.21...Clip terminal, 2...Neck of terminal, 3,4...Divided piece of terminal, 5...Center portion of terminal after division, 6.1B, 26... Board, 12... board insertion hole, 27... conductor pattern of the board for terminal connection.
Claims (1)
上分割片、下分割片をそれぞれ設け、前記上下分割片は
互いに逆方向に折り曲げられており、前記両端部の上分
割片は互いに逆方向に折り曲げられていることを特徴と
する混成集積回路のクリップ端子。Leaving the center part and making cuts at both ends to provide an upper and lower divided piece, respectively, the upper and lower divided pieces are bent in opposite directions, and the upper divided pieces at both ends are bent in opposite directions. A clip terminal for a hybrid integrated circuit characterized by being bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2291596A JPH04163864A (en) | 1990-10-29 | 1990-10-29 | Clip terminal of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2291596A JPH04163864A (en) | 1990-10-29 | 1990-10-29 | Clip terminal of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04163864A true JPH04163864A (en) | 1992-06-09 |
Family
ID=17770990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2291596A Pending JPH04163864A (en) | 1990-10-29 | 1990-10-29 | Clip terminal of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04163864A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6793541B2 (en) | 2001-10-24 | 2004-09-21 | Molex Incorporated | Circuit board connector with improved terminal tails |
| JP2014154501A (en) * | 2013-02-13 | 2014-08-25 | Yazaki Corp | Peg press-fit structure of connector |
| JP2022043452A (en) * | 2020-09-04 | 2022-03-16 | 株式会社デンソー | Connection terminal and electronic device |
-
1990
- 1990-10-29 JP JP2291596A patent/JPH04163864A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6793541B2 (en) | 2001-10-24 | 2004-09-21 | Molex Incorporated | Circuit board connector with improved terminal tails |
| JP2014154501A (en) * | 2013-02-13 | 2014-08-25 | Yazaki Corp | Peg press-fit structure of connector |
| JP2022043452A (en) * | 2020-09-04 | 2022-03-16 | 株式会社デンソー | Connection terminal and electronic device |
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