JPH06333655A - Socket for ic - Google Patents

Abstract

PURPOSE:To provide a socket which can be mounted easily on a double side mounting type printed board surface. CONSTITUTION:A socket has a frame 1 and contacts 2 which are arranged at the same pitch with a plurality of lead legs 3a of an IC3 and are derived from the frame 1 while having a surface mounting piece 2a situated on the same plane so as to be mounted on a surface of a conductive circuit pattern 4a arranged on a surface of a prined board 4. A fixing member having a fixing surface 5a to be fixed to the printed board 4 and an attracting surface 5b formed flatly on the opposite side of the fixing surface 5a is mounted on the frame 1 while situating the fixing surface 5a on almost the same plane with the same plane where the surface mounting piece 2a of the contacts 2 is situated. Thereby, since the attracting surface 5b can be carried automatically by attracting it in an attraction system and the fixing surface 5a is put in an almost contact condition with the printed board 4, when an adhesive is applied to the fixing surface 5a, it can be fixed temporarily even to an under surface of a double side mounting type printed board 4 so as not to drop until a reflow is carried out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounting type IC socket in which contacts are surface-mounted on a conductive circuit pattern provided on the surface of a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, there is an IC socket of this type having a structure shown in FIGS. This one is
A surface arranged on the same plane as the frame 1 made of an insulating material and a plurality of lead legs 3a of the IC3 arranged at the same pitch and surface-mounted on the conductive circuit pattern 4a provided on the printed circuit board surface 4. Frame 1 with mounting piece 2a
And a contact 2 derived from.

More specifically, the frame 1 has a square bar-shaped contact mounting in which holes 1b having the same pitch as the lead legs 3a are arranged so that a plurality of lead legs 3a led out from both sides of the body of the IC3 can be inserted. The pieces 1a, 1a are connected by end connecting pieces 1c, 1c and central connecting pieces 1d, 1d provided at symmetrical positions in the longitudinal direction and are arranged in two rows.

The contact 2 has a tooth receiving portion 2b formed in a tulip shape so that the lead leg 3a of the IC3 can be inserted / removed, and the tooth receiving portion 2b is mounted in each hole 1b provided in the contact mounting piece 1a of the frame 1, and the contact Hole in mounting piece 1a
The surface mounting piece 2a is formed by being led out to the outside from the surface opposite to 1b and then bent outward in an L shape to form the surface mounting pieces 2a on the same plane. It is supposed to be located.

In this case, if the contact 2 is left straight without bending so that the surface mounting piece 2a is not formed, a normal flow soldering type that is not a surface mounting type, that is, a terminal insertion hole is formed. It can also be used for a type that is soldered to a printed circuit board having a.

[0006]

In the conventional IC socket described above, the surface of the contact 2 is mounted on the printed circuit board 4 on the conductive circuit pattern 4a on which the cream solder is printed. The surface mounting piece 2a and the conductive circuit pattern are formed by heating the mounting piece 2a with infrared reflow or the like to melt the cream solder.
Solder connection with 4a, but its printed circuit board
If 4 is a double-sided mounting type, this IC socket may have to be mounted on the bottom surface of printed circuit board 4, and at that time it should be temporarily fixed to the bottom surface of printed circuit board 4 so that the IC socket does not drop until reflow. Need to be kept.

Usually, an adhesive is used for this temporary fixing, but this IC socket is surface-mounted by bending it into an L-shape while the flow soldering type straight contact 2 is led out from the frame 1. Since the piece 2a is formed,
The frame 1 and the surface of the printed circuit board 4 are separated from each other, and even if an adhesive is applied to the frame 1, the frame 1 cannot be temporarily fixed to the lower surface of the printed circuit board 4. Therefore, the IC socket is temporarily fixed with an adhesive tape having heat resistance so as to cover it from the IC mounting direction. Then, the space that can be mounted on the printed circuit board 4 is reduced as much as the adhesive tape occupies, and it is necessary to remove the adhesive tape after soldering, which is troublesome.

Furthermore, when the surface mounting piece 2a of the contact 2 is placed on the conductive circuit pattern 4a of the printed circuit board 4, it is difficult for the operator to secure the positional accuracy, which is also a labor-intensive work.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an IC socket which can be easily mounted on a double-sided mounting type printed circuit board surface.

[0010]

In order to solve the above-mentioned problems, according to a first aspect of the present invention, a frame made of an insulating material and a plurality of lead legs of an IC are arranged at the same pitch, and a printed circuit board is provided. An IC socket provided with a contact led out from a frame and having a surface-mounting piece positioned on the same plane so as to be surface-mounted on a conductive circuit pattern provided on a surface, and fixed to a printed circuit board surface. A fixing member having a fixing surface that is opposite to the fixing surface and a suction surface that is formed on the opposite side of the fixing surface and that is positioned substantially on the same plane as the surface mounting piece of the contact. It is configured to be attached to the frame.

According to a second aspect of the present invention, the fixing member is fitted in the frame with a retaining portion that engages with the frame.

[0012]

According to the first aspect of the present invention, since the fixing member mounted on the frame has a flat suction surface, the suction surface can be sucked by a suction method. The surface mount piece of the contact can be easily and accurately mounted on the conductive circuit pattern of the board, and when it is mounted, the fixing surface is located on the same plane as the surface on which the surface mount piece of the contact is located. Since it is in contact with the printed circuit board,
By applying an adhesive to the fixed surface, even the lower surface of the double-sided mounting type printed circuit board can be temporarily fixed so as not to drop until the reflow process is performed.

According to the second aspect of the invention, since the fixing member is locked to the frame by the retaining portion when it is fitted in the frame, it can be securely fixed to the frame without coming off.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. Members having substantially the same functions as those of the conventional example are designated by the same reference numerals.

The frame 1 is made of an insulating material and has an IC3
The rectangular rod-shaped contact mounting pieces 1a, 1a with holes 1b arranged at the same pitch as the lead legs 3a so that multiple lead legs 3a derived from both sides of the main body can be inserted, are placed at symmetrical positions in the longitudinal direction. The end connecting pieces 1c and 1c and the central connecting pieces 1d and 1d are connected to each other and arranged in two rows.

The contact 2 has a tooth receiving portion 2b formed in a tulip shape so that the lead leg 3a of the IC 3 can be inserted / removed, and the tooth receiving portion 2b is mounted in each hole 1b provided in the contact mounting piece 1a of the frame 1, and the contact Hole in mounting piece 1a
The surface mounting piece 2a is formed by being led out to the outside from the surface opposite to 1b and then bent outward in an L shape to form the surface mounting pieces 2a. Are placed on the same plane so as to be surface-mounted on the conductive circuit pattern 4a provided on the.

In this case, if the contact 2 is left straight without bending so that the surface mounting piece 2a is not formed, it is a normal flow soldering type that is not the surface mounting type, that is, the terminal insertion hole. It can also be used for a type that is soldered to a printed circuit board having a.

The fixing member 5 is formed of an insulating material in the shape of a rectangular box having a bottom with a concave portion provided on one surface side so as to prevent uneven thickness in consideration of molding workability, and one flat surface thereof is fixed. The surface 5a and the other flat surface on the opposite side are adsorption surfaces 5b. Two protrusions 5c are provided on each of the outer side surfaces 5d and 5e in the lateral direction, and two protrusions 5c are provided along the height direction.
And the apex between the ridge 5c of the outer surface 5e and the apex of the outer surface 5e are slightly larger than the distance between the contact mounting pieces 1a, 1a of the frame 1, and the lateral dimension between the outer surfaces 5f, 5g in the longitudinal direction. Is smaller than the distance between the center connecting pieces 1d, 1d of the frame 1.

The fixing member 5 is mounted and fixed such that the apex of the ridge 5c is press-fitted to the inner side surfaces of the contact mounting pieces 1a, 1a. At this time, the fixing surface 5a is located on substantially the same plane as the same plane on which the plurality of surface mounting pieces 2a of the contact 2 are located.

The above-mentioned IC socket is mounted on the double-sided mounting type printed circuit board 4 as follows. First,
The fixing member 5 is obtained by applying a quick-drying adhesive 6 to the fixing surface 5a, and immediately after that, a flat suction surface 5b is sucked by a suction method to be automatically conveyed, and the conductive property of the printed circuit board 4 on which the cream solder is printed. The surface mounting piece 2a of the contact 2 is accurately positioned and placed on the circuit pattern 4a using pattern recognition or the like. Then, the fixing surface 5a coated with the adhesive 6 is positioned on substantially the same plane as the surface mounting pieces 2a of the contact 2 are positioned, so that the fixing surface 5a is substantially in contact with the surface of the printed circuit board 4. And the fixed surface 5a is adhesive 6
Is temporarily fixed to the surface of the printed circuit board 4. Then, even if the printed circuit board 4 is a double-sided mounting type and is upside down from that of FIG. 1, that is, the IC socket is on the lower surface side of the printed circuit board 4, the above-mentioned temporary fixing does not cause it to fall, Other electronic components can be mounted on the upper surface side of the. Then, in this state, by heating by infrared reflow or the like to melt the cream solder, the surface mounting piece 2a of the IC socket is soldered to the conductive circuit pattern 4a.

In such an IC socket, as described above, the surface-mounting piece 2a is formed by bending the flow soldering type straight contact 2 into an L-shape on the way out of the frame 1. Therefore, the frame 1 is separated from the surface of the printed circuit board 4, but the fixing member 5
Since 5a is mounted on the frame 1 with the plurality of surface mounting pieces 2a of the contact 2 positioned on substantially the same plane as the surface mounting pieces 2a, the fixing surface 5a is in contact with the printed circuit board 4 substantially. By applying adhesive 6 there, it is possible to temporarily fix even the lower surface of the double-sided mounting type printed circuit board 4 so that it will not drop until reflowing.
Since the suction surface 5b of 5 is formed flat,
Since 5b can be sucked by a suction method, the surface mounting piece 2a of the contact 2 can be easily mounted on the conductive circuit pattern 4a of the printed circuit board 4 with high positional accuracy by automatic conveyance.

Next, a second embodiment will be described below with reference to FIGS. 4 and 5. In this structure, the structure of the fixing member 5 is partially different from that of the first embodiment, and the members having substantially the same functions are designated by the same reference numerals.

The fixing member 5 has a rectangular box-like shape as in the first embodiment.
5f and 5g include a protrusion 5i and a frame for the protrusion 5i.
A retaining portion 5h having a triangular cross-section is formed at substantially the same interval as the height dimension of the central connecting pieces 1d, 1d provided in 1.
When the fixing member 5 is fitted between the central connecting pieces 1d, 1d of the frame 1, the retaining portions 5h are locked to the central connecting pieces 1d, 1d so as not to come off, and like the first embodiment. To
The ridges 5c provided on both lateral surfaces 5d, 5e in the lateral direction are press-fitted to the inner surfaces of both contact mounting pieces 1a, 1a of the frame 1 so that the fixing surfaces 5a are fixed. The plurality of surface mounting pieces 2a of the contact 2 are located on substantially the same plane as the same plane.

In such an IC socket, in addition to the function and effect of the first embodiment, as described above, the fixing member 5
Is press-fitted and fixed when fitted to the frame 1, and is locked to the frame 1 by the retaining portion 5h.
It can be fixed to Frame 1 more securely without coming off.

[0025]

According to the first aspect of the present invention, since the fixing member mounted on the frame has a flat suction surface, the suction surface can be sucked by a suction method, so that printing is performed by automatic conveyance. The surface mount piece of the contact can be easily and accurately mounted on the conductive circuit pattern of the board, and when it is mounted, the fixing surface is located on the same plane as the surface on which the surface mount piece of the contact is located. Since it is in contact with the printed circuit board,
By applying an adhesive to the fixed surface, even the lower surface of the double-sided mounting type printed circuit board can be temporarily fixed so as not to drop until the reflow process is performed.

According to the second aspect of the present invention, the fixing member can be securely fixed to the frame without coming off because the fixing member is locked to the frame by the retaining portion when fitted to the frame.

[Brief description of drawings]

FIG. 1 is a sectional front view showing a first embodiment of the present invention.

FIG. 2 is a sectional side view of the above.

FIG. 3 is a plan view of the above.

FIG. 4 is a sectional side view showing a second embodiment of the present invention.

FIG. 5 is a plan view of the above.

FIG. 6 is a sectional front view showing a conventional example.

FIG. 7 is a plan view of the above.

[Explanation of symbols]

 1 frame 2 contact 2a surface mounting piece 3 IC 3a lead leg 4 printed circuit board 4a conductive circuit pattern 5 fixing member 5a fixing surface 5b suction surface 5h retaining part

Claims (2)

[Claims] 1. A frame made of an insulating material and a plurality of lead legs of an IC are arranged at the same pitch and are arranged on the same plane so as to be surface-mounted on a conductive circuit pattern provided on the surface of a printed circuit board. In an IC socket including a contact that has a surface mounting piece and is led out from a frame, a fixing surface that is fixed to a printed circuit board surface, and a suction surface that is opposite to the fixing surface and is formed flat. An IC socket characterized in that a fixing member having a fixing surface is mounted on a frame with the fixing surface located on substantially the same plane as the surface mounting piece of the contact. 2. The IC socket according to claim 1, wherein the fixing member has a retaining portion that engages with the frame and is fitted into the frame.