JPH07240576A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH07240576A JPH07240576A JP3227594A JP3227594A JPH07240576A JP H07240576 A JPH07240576 A JP H07240576A JP 3227594 A JP3227594 A JP 3227594A JP 3227594 A JP3227594 A JP 3227594A JP H07240576 A JPH07240576 A JP H07240576A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- wiring board
- printed wiring
- component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 238000007598 dipping method Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本案は、シールドケース等の部品
取着用端子を有する部品に対するプリント配線基板の形
状に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the shape of a printed wiring board for a component having a component mounting terminal such as a shield case.
【０００２】[0002]
【従来の技術】従来のシールドケースの取りつけ状態に
ついて、図３乃至図５を参照しながら説明する。図にお
いて、シールドケース１には、複数個の半田付け用の端
子２（図３では１ケ所のみ示した。）が一体に形成され
ている。該端子２には、折曲部２ａが形成されていて、
プリント配線基板３の部品取着用端子穴３ａに挿入半田
付けされる（図４参照）。図番４は半田である。図５
は、端子２に切り起こし片５を設け、プリント配線基板
３の透孔３ａに挿入した後、切り起こし片５の先端５ａ
により、シールドケース１を仮止め固定し、その後半田
付け固定するものである。2. Description of the Related Art The state of attachment of a conventional shield case will be described with reference to FIGS. In the figure, a shield case 1 is integrally formed with a plurality of soldering terminals 2 (only one position is shown in FIG. 3). A bent portion 2a is formed on the terminal 2,
The printed wiring board 3 is inserted and soldered in the component mounting terminal hole 3a (see FIG. 4). No. 4 is solder. Figure 5
After providing the cut-and-raised piece 5 on the terminal 2 and inserting the cut-and-raised piece 5 into the through hole 3a of the printed wiring board 3, the tip 5a of the cut-and-raised piece 5 is
Thus, the shield case 1 is temporarily fixed and fixed, and then fixed by soldering.
【０００３】[0003]
【発明が解決しようとする課題】上述の従来例図４の場
合、シールドケースは、プリント配線基板に対して端子
部分に付着する半田と端子の折曲部によって保持されて
いるが、折曲部の強度は弱く、ほとんど半田付けの強度
に依存している。その為、端子部分の半田付着面積を出
来るだけ大きくする必要があった。図５の場合は、切り
起こし片によって固定強度を増しているが、シールドケ
ースを取り外す際、端子部分の半田を除去しても切り起
こし片の根本に半田が残っていて切り起こし片が元に復
帰せず、シールドケースの取り外しが困難であった。In the conventional example shown in FIG. 4, the shield case is held by the solder attached to the terminal portion and the bent portion of the terminal with respect to the printed wiring board. Strength is weak and depends mostly on soldering strength. Therefore, it is necessary to increase the solder adhesion area of the terminal portion as much as possible. In the case of Fig. 5, the cut-and-raised pieces increase the fixing strength. It did not recover and it was difficult to remove the shield case.
【０００４】[0004]
【課題を解決するための手段】そこで本案では、プリン
ト配線基板に半田フィレット形成手段を設けることを特
徴とする。即ち、プリント配線基板に形成されるシール
ドケース等の取着用端子穴を囲繞する半田付けランド内
に透孔を設け、端子穴にシールドケース等（第１の部
品）の端子を取着し、前記透孔にジャンパー線、又は抵
抗・コンデンサ等（第２の部品）の端子を取着して、半
田ディッピングすることにより、両端子間に半田フィレ
ットを形成する構成とする。In view of this, the present invention is characterized in that a solder fillet forming means is provided on the printed wiring board. That is, a through hole is provided in a soldering land surrounding a mounting terminal hole such as a shield case formed on a printed wiring board, and a terminal such as a shield case (first part) is attached to the terminal hole. A jumper wire or a terminal such as a resistor / capacitor (second component) is attached to the through hole and solder dipping is performed to form a solder fillet between both terminals.
【０００５】[0005]
【作用】上述の構成により、プリント配線基板の端子穴
に第１の部品の端子を取着し、半田付けランド内の透孔
に第２の部品の端子を取着した後、半田ディッピングす
ることにより、第１の部品の端子と第２の部品の端子間
に半田が橋絡して半田フィレットが形成される。With the above structure, the terminals of the first component are attached to the terminal holes of the printed wiring board, the terminals of the second component are attached to the through holes in the soldering land, and then the solder dipping is performed. As a result, the solder is bridged between the terminals of the first component and the terminals of the second component to form a solder fillet.
【０００６】[0006]
【実施例】以下、本案の具体的な実施例を図面とともに
説明する。図１はプリント配線基板のパターン面を示す
部分拡大図及びその断面図、図２は他の実施例のパター
ン面の部分拡大図である。図において、従来例と同一部
分には同一番号を付けてその説明を省略する。図１にお
いて、６は半田付けランド６ａを有するパターンであ
り、該ランド６ａは部品取着用端子穴３ａを囲繞するよ
うに形成されている。７はランド６ａ内に設けられた透
孔、９はジャンパー線である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A concrete embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a partially enlarged view showing a pattern surface of a printed wiring board and a sectional view thereof, and FIG. 2 is a partially enlarged view of a pattern surface of another embodiment. In the figure, the same parts as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. In FIG. 1, 6 is a pattern having a soldering land 6a, and the land 6a is formed so as to surround the component mounting terminal hole 3a. Reference numeral 7 is a through hole provided in the land 6a, and 9 is a jumper wire.
【０００７】本案のプリント配線基板３の組立て方法
は、該基板３の端子穴３にシールドケース（第１の部
品）１の端子２を取着し、透孔７，７にジャンパー線
（第２の部品）９を取着した後、半田ディッピングを施
すと、図１（ｂ）に示すように端子２とジャンパー線９
間に半田４が橋絡して半田フィレット１０が形成され
る。この両端子２，９間に形成される半田フィレット１
０により、半田付け部の強度が大幅に向上する。In the method of assembling the printed wiring board 3 of the present invention, the terminal 2 of the shield case (first part) 1 is attached to the terminal hole 3 of the board 3, and the jumper wire (second part) is attached to the through holes 7, 7. Component 9) and solder dipping is applied, the terminal 2 and the jumper wire 9 are connected as shown in FIG. 1 (b).
The solder 4 is bridged in between to form the solder fillet 10. Solder fillet 1 formed between these terminals 2 and 9
When 0, the strength of the soldered portion is significantly improved.
【０００８】図２は、ランド６ａ内の透孔７，７に対抗
して別途部品端子挿入孔８，８を設け、２本のジャンパ
ー線９，９を取着した場合を示した。ジャンパー線９の
代わりに抵抗・コンデンサ等のリード端子付き部品を第
２の部品として取着してもよい。又、第１の部品として
は、シールドケース以外の半田付け可能な端子を有する
部品であれば、本案の構成を適用できる。FIG. 2 shows a case where the component terminal insertion holes 8 and 8 are separately provided to oppose the through holes 7 and 7 in the land 6a and two jumper wires 9 and 9 are attached. Instead of the jumper wire 9, a component with lead terminals such as a resistor and a capacitor may be attached as the second component. Further, as the first component, the configuration of the present invention can be applied as long as it is a component having a solderable terminal other than the shield case.
【０００９】[0009]
【発明の効果】本案によれば、プリント配線基板の端子
半田付け面の面積を少なくし、簡単な構造で部品の安定
した固定が可能になる。又、部品交換時に半田を簡単に
除去できるので、サービス補修の面で作業性の向上が図
られる。According to the present invention, the area of the terminal soldering surface of the printed wiring board can be reduced, and the components can be stably fixed with a simple structure. Further, since the solder can be easily removed when the parts are replaced, workability can be improved in terms of service repair.
【図１】プリント配線基板のパターン面を示す部分拡大
図及びその断面図である。FIG. 1 is a partially enlarged view showing a pattern surface of a printed wiring board and a sectional view thereof.
【図２】他の実施例のパターン面の部分拡大図である。FIG. 2 is a partially enlarged view of a pattern surface of another embodiment.
【図３】第１の部品の外観斜視図である。FIG. 3 is an external perspective view of a first component.
【図４】従来例の部分外観斜視図及び主要部の部分断面
図である。FIG. 4 is a partial external perspective view of a conventional example and a partial cross-sectional view of a main part.
【図５】従来例の他の部分外観斜視図及び主要部の部分
断面図である。FIG. 5 is a perspective view of another part of the conventional example and a partial cross-sectional view of the main part.
１ シールドケース（第１の部品） ２ 端子 ３ プリント配線板 ３ａ 部品取着用端子穴 ６ａ 半田付けランド ７ 透孔 ９ ジャンパー線（第２の部品） １０ 半田フィレット 1 Shield Case (1st Component) 2 Terminal 3 Printed Wiring Board 3a Component Mounting Hole 6a Soldering Land 7 Through Hole 9 Jumper Wire (2nd Component) 10 Solder Fillet
Claims (4)
ンド内に半田フィレット形成手段を設けることを特徴と
するプリント配線基板。1. A printed wiring board, characterized in that solder fillet forming means is provided in a soldering land surrounding a component mounting terminal hole.
１の部品の端子を取着すると共に、前記半田付けランド
内に設けられた透孔に第２の部品の端子を取着して半田
ディッピングすることにより形成されることを特徴とす
る請求項１のプリント配線基板。2. The solder fillet attaches a terminal of a first component to the terminal hole, and attaches a terminal of a second component to a through hole provided in the soldering land to solder. The printed wiring board according to claim 1, wherein the printed wiring board is formed by dipping.
請求項２のプリント配線基板。3. The printed wiring board according to claim 2, wherein the second component is a jumper wire.
するシールドケースである請求項２のプリント配線基
板。4. The printed wiring board according to claim 2, wherein the first component is a shield case having a component mounting terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227594A JPH07240576A (en) | 1994-03-02 | 1994-03-02 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227594A JPH07240576A (en) | 1994-03-02 | 1994-03-02 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07240576A true JPH07240576A (en) | 1995-09-12 |
Family
ID=12354437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3227594A Pending JPH07240576A (en) | 1994-03-02 | 1994-03-02 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07240576A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6707687B2 (en) | 2002-05-29 | 2004-03-16 | Alps Electric Co., Ltd. | Connection structure for radio frequency circuit that exceeds in RF characteristics |
| JP2011096886A (en) * | 2009-10-30 | 2011-05-12 | Rb Controls Co | Soldering structure |
-
1994
- 1994-03-02 JP JP3227594A patent/JPH07240576A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6707687B2 (en) | 2002-05-29 | 2004-03-16 | Alps Electric Co., Ltd. | Connection structure for radio frequency circuit that exceeds in RF characteristics |
| JP2011096886A (en) * | 2009-10-30 | 2011-05-12 | Rb Controls Co | Soldering structure |
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