JPS63293966A - 半導体集積回路装置 - Google Patents
半導体集積回路装置Info
- Publication number
- JPS63293966A JPS63293966A JP62128233A JP12823387A JPS63293966A JP S63293966 A JPS63293966 A JP S63293966A JP 62128233 A JP62128233 A JP 62128233A JP 12823387 A JP12823387 A JP 12823387A JP S63293966 A JPS63293966 A JP S63293966A
- Authority
- JP
- Japan
- Prior art keywords
- section
- memory
- logic
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体集積回路装置に関し、特に、メモリ部
と論理部とを有する超高速LSIに適用して有効な技術
に関するものである。
と論理部とを有する超高速LSIに適用して有効な技術
に関するものである。
近年、例えば大型計算機用のメモリLSIとしては、計
算機の高速化の要求から、周辺の論理機能をも持たせた
メモリLSI(以下、論理付きメモリLSIという)が
使用されている。
算機の高速化の要求から、周辺の論理機能をも持たせた
メモリLSI(以下、論理付きメモリLSIという)が
使用されている。
本発明者は、この論理付きメモリLSIについて検討し
た。以下は公知とされた技術ではないが、本発明者によ
って検討された技術であり、その概要は次のとおりであ
る。
た。以下は公知とされた技術ではないが、本発明者によ
って検討された技術であり、その概要は次のとおりであ
る。
すなわち、本発明者によって検討された論理付きメモリ
LSIにおいては、入出力回路部と論理部との間に例え
ばRA M (Random Access Memo
ry)のようなメモリ部が設けられている。このメモリ
部を構成するメモリセルアレイは配線の全層を使用して
構成されているため、入出力回路部と論理部との間を(
ti号配線により結線する場合、これらの信号配線は前
記メモリ部の上を通過することができない。そこで、こ
れらの信号配線は、前記メモリ部を迂回して前記論理部
に接続されていた。
LSIにおいては、入出力回路部と論理部との間に例え
ばRA M (Random Access Memo
ry)のようなメモリ部が設けられている。このメモリ
部を構成するメモリセルアレイは配線の全層を使用して
構成されているため、入出力回路部と論理部との間を(
ti号配線により結線する場合、これらの信号配線は前
記メモリ部の上を通過することができない。そこで、こ
れらの信号配線は、前記メモリ部を迂回して前記論理部
に接続されていた。
しかしながら、上述のようにメモリ部を迂回して信号配
線を論理部に接続する場合には、必然的に信号配線の配
線長が長くなるため、信号の遅延時間の増大を招くとい
う問題があった。また、入出力回路部の端子毎に信号配
線の配線長が変わるため、信号配線毎に信号の遅延時間
が異なり、従ってこれに起因してスキューが生じてしま
うという問題もあった。
線を論理部に接続する場合には、必然的に信号配線の配
線長が長くなるため、信号の遅延時間の増大を招くとい
う問題があった。また、入出力回路部の端子毎に信号配
線の配線長が変わるため、信号配線毎に信号の遅延時間
が異なり、従ってこれに起因してスキューが生じてしま
うという問題もあった。
本発明の目的は、信号の遅延時間の低減を図ることがで
きる技術を提供することにある。
きる技術を提供することにある。
本発明の他の目的は、スキューの発生の防止を図ること
ができる技術を提供することにある。
ができる技術を提供することにある。
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面によって明らかになるであろ
う。
明細書の記述及び添付図面によって明らかになるであろ
う。
本願において開示される発明のうち1代表的なものの概
要を簡単に説明すれば、下記のとおりである。
要を簡単に説明すれば、下記のとおりである。
すなわち、メモリ部をはさんで設けられる複数の回路間
を接続する信号配線を形成するために用いられる信号配
線チャネルをメモリ部の上に設けている。
を接続する信号配線を形成するために用いられる信号配
線チャネルをメモリ部の上に設けている。
上記した手段によれば、信号配線の最短化及び等長比が
可能となるので、信号の遅延時間の低減及びスキューの
発生の防止を図ることができる。
可能となるので、信号の遅延時間の低減及びスキューの
発生の防止を図ることができる。
以下、本発明の実施例を図面を用いて具体的に説明する
。
。
なお、実施例を説明するための全図において、同一機能
を有するものには同一符号を付け、その繰り返しの説明
は省略する。
を有するものには同一符号を付け、その繰り返しの説明
は省略する。
失態盤上
第1図は1本発明の実施例1による論理付きメモリLS
Iを示す平面図である。
Iを示す平面図である。
第1図に示すように、実施例■による論理付きメモリL
SIにおいては、例えばシリコンチップのような半導体
チップ1の周辺部に入出力回路部2が設けられている。
SIにおいては、例えばシリコンチップのような半導体
チップ1の周辺部に入出力回路部2が設けられている。
符号3は、多数のメモリセルにより構成されるメモリセ
ルアレイから成る例えばRAMのようなメモリ部であり
1本実施例においては4個設けられている。さらに、前
記半導体チップ1の中央部には、多数のゲートから成る
論理部4が設けられている。
ルアレイから成る例えばRAMのようなメモリ部であり
1本実施例においては4個設けられている。さらに、前
記半導体チップ1の中央部には、多数のゲートから成る
論理部4が設けられている。
前記入出力回路部2と前記論理部3との間は信号配線5
により接続されている0本実施例においては、メモリ部
3の上に信号配線チャネルSCが設けられ、この信号配
線チャネルScの上にこれらの信号配線5が設けられて
いる。
により接続されている0本実施例においては、メモリ部
3の上に信号配線チャネルSCが設けられ、この信号配
線チャネルScの上にこれらの信号配線5が設けられて
いる。
本実施例による論理付きメモリLSIにおいては、メモ
リ部3を構成するメモリセルアレイの配線は例えば(全
配線層数−1)層の配線により行い、残りの一層を信号
配線5として用いる。
リ部3を構成するメモリセルアレイの配線は例えば(全
配線層数−1)層の配線により行い、残りの一層を信号
配線5として用いる。
上述のようにメモリ部3の上に信号配線チャネルSCを
設けているので、メモリ部3を迂回することなく入出力
回路部2と論理部4とを信号配線5により結線すること
が可能となり、このため信号配線5の最短化が可能とな
る。これによって、信号の遅延時間の低減を図ることが
できるので。
設けているので、メモリ部3を迂回することなく入出力
回路部2と論理部4とを信号配線5により結線すること
が可能となり、このため信号配線5の最短化が可能とな
る。これによって、信号の遅延時間の低減を図ることが
できるので。
LSIの高速動作化を図ることができる。また。
入出力回路部2の全ての端子に接続される信号配線5の
等長比が可能となるので、これらの信号配線5の信号の
遅延時間を同一とすることができ、従ってスキューの発
生を防止することができる。
等長比が可能となるので、これらの信号配線5の信号の
遅延時間を同一とすることができ、従ってスキューの発
生を防止することができる。
さらに、これによってLSIの全入出力ビンを同等に取
り扱うことが可能となるため、LSIのタイミング設計
が容易となる。
り扱うことが可能となるため、LSIのタイミング設計
が容易となる。
さらに1本実施例による論理付きメモリLSIを例えば
ゲートアレイ方式のLSIにより構成する場合にも、信
号配線チャネルSCをメモリ部3の上に定義して自動設
計(DA)による自動配線を行うことによって、上述と
同様な効果を得ることができる。また、この場合、信号
配線チャネルSCを信号配線5の配線のためだけに使用
することができるので、自動配線の自由度の向上を図る
ことができる。さらに、入出力回路部2の端子の位置の
設定の自由度が高くなるので、これらの端子が局所的に
集中するのを防止することができ、この結果、自動配線
が容易となる。なお、この場合、前記入出力回路部2の
各端子(LSiパッケージの各入出力ピンにそれぞれ接
続されている)には、それぞれ1本又は複数本の信号配
線5が対応する構成とすることができる。その場合、D
Aにより信号配線5の自動配線を行う場合には、DA上
のピンは前記入出力回路部2の端子に対応した信号配線
5の端点をピンとして定義すれば、自動的に入出力回路
部へ接続される方式とすることも可能である。
ゲートアレイ方式のLSIにより構成する場合にも、信
号配線チャネルSCをメモリ部3の上に定義して自動設
計(DA)による自動配線を行うことによって、上述と
同様な効果を得ることができる。また、この場合、信号
配線チャネルSCを信号配線5の配線のためだけに使用
することができるので、自動配線の自由度の向上を図る
ことができる。さらに、入出力回路部2の端子の位置の
設定の自由度が高くなるので、これらの端子が局所的に
集中するのを防止することができ、この結果、自動配線
が容易となる。なお、この場合、前記入出力回路部2の
各端子(LSiパッケージの各入出力ピンにそれぞれ接
続されている)には、それぞれ1本又は複数本の信号配
線5が対応する構成とすることができる。その場合、D
Aにより信号配線5の自動配線を行う場合には、DA上
のピンは前記入出力回路部2の端子に対応した信号配線
5の端点をピンとして定義すれば、自動的に入出力回路
部へ接続される方式とすることも可能である。
夾胤涯l
第2図は、本発明の実施例■による論理付きメモリLS
Iを示す平面図である。
Iを示す平面図である。
第2図に示すように、実施例■による論理付きメモリL
SIにおいては、メモリ部3が半導体チップ1の中央部
に設けられ、このメモリ部3を取り囲むように論理部4
が設けられている6本実施例においても、実施例1と同
様に、メモリ部3の上に信号配線チャネルSCが設けら
れている。そして、この信号配線チャネルSC上に論理
部4間を接続する信号配線5が設けられている。従って
、入出力回路部2と論理部4との間の信号配線5のみな
らず、論理部4間の信号配線5の最短化及び等良化が可
能であり、従って信号の遅延時間の低減及びスキューの
発生の防止を図ることができる。
SIにおいては、メモリ部3が半導体チップ1の中央部
に設けられ、このメモリ部3を取り囲むように論理部4
が設けられている6本実施例においても、実施例1と同
様に、メモリ部3の上に信号配線チャネルSCが設けら
れている。そして、この信号配線チャネルSC上に論理
部4間を接続する信号配線5が設けられている。従って
、入出力回路部2と論理部4との間の信号配線5のみな
らず、論理部4間の信号配線5の最短化及び等良化が可
能であり、従って信号の遅延時間の低減及びスキューの
発生の防止を図ることができる。
以上、本発明を実施例にもとづき具体的に説明したが、
本発明は、前記実施例に限定されるものではなく、その
要旨を逸脱しない範囲において種々変更可能であること
は言うまでもない。
本発明は、前記実施例に限定されるものではなく、その
要旨を逸脱しない範囲において種々変更可能であること
は言うまでもない。
例えば、半導体チップ1におけるメモリ部3及び論理部
4の形状、配置等は、上述の実施例!、■と異なる形状
、配置等とすることができる。また、本発明は、メモリ
部と論理部とを有する各種の半導体集積回路装置に適用
することができる。
4の形状、配置等は、上述の実施例!、■と異なる形状
、配置等とすることができる。また、本発明は、メモリ
部と論理部とを有する各種の半導体集積回路装置に適用
することができる。
本願において開示される発明のうち代表的なものによっ
て得られる効果を簡単に説明すれば、下 ′記
のとおりである。
て得られる効果を簡単に説明すれば、下 ′記
のとおりである。
すなわち、信号の遅延時間の低減及びスキューの発生の
防止を図ることができる。
防止を図ることができる。
第1図は、本発明の実施例Iによる論理付きメモリLS
Iを示す平面図、 第2図は1本発明の実施例■による論理付きメモリLS
Iを示す平面図である。 図中、1・・・半導体チップ、2・・・入出力回路部、
3・・・メモリ部、4・・・論理部、5・・・信号配線
、SC・・・信号配線チャネルである。 第 1 図 第 2 図 J7シ
Iを示す平面図、 第2図は1本発明の実施例■による論理付きメモリLS
Iを示す平面図である。 図中、1・・・半導体チップ、2・・・入出力回路部、
3・・・メモリ部、4・・・論理部、5・・・信号配線
、SC・・・信号配線チャネルである。 第 1 図 第 2 図 J7シ
Claims (1)
- 【特許請求の範囲】 1、メモリ部と論理部とを有する半導体集積回路装置で
あって、前記メモリ部をはさんで設けられる複数の回路
間を接続する信号配線を形成するために用いられる信号
配線チャネルを前記メモリ部の上に設けたことを特徴と
する半導体集積回路装置。 2、前記複数の回路が前記論理部及び入出力回路部から
成ることを特徴とする特許請求の範囲第1項記載の半導
体集積回路装置。 3、前記複数の回路が複数の前記論理部から成ることを
特徴とする特許請求の範囲第1項記載の半導体集積回路
装置。 4、前記メモリ部がRAMから成ることを特徴とする特
許請求の範囲第1項〜第3項のいずれか一項記載の半導
体集積回路装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62128233A JPS63293966A (ja) | 1987-05-27 | 1987-05-27 | 半導体集積回路装置 |
US07/198,311 US4959704A (en) | 1987-05-27 | 1988-05-25 | Semiconductor integrated circuit device |
US07/579,698 US5103282A (en) | 1987-05-27 | 1990-09-10 | Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and i/o unit circuit of the gate array |
US07/853,090 US5243208A (en) | 1987-05-27 | 1992-03-17 | Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array |
US08/114,091 US5477067A (en) | 1987-05-27 | 1993-08-31 | Semiconductor IC device having a RAM interposed between different logic sections and by-pass signal lines extending over the RAM for mutually connecting the logic sections |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62128233A JPS63293966A (ja) | 1987-05-27 | 1987-05-27 | 半導体集積回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63293966A true JPS63293966A (ja) | 1988-11-30 |
Family
ID=14979786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62128233A Pending JPS63293966A (ja) | 1987-05-27 | 1987-05-27 | 半導体集積回路装置 |
Country Status (2)
Country | Link |
---|---|
US (2) | US4959704A (ja) |
JP (1) | JPS63293966A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100246074B1 (ko) * | 1990-10-10 | 2000-04-01 | 가나이 쓰도무 | 반도체집적회로장치 |
JP2007072616A (ja) * | 2005-09-05 | 2007-03-22 | Sony Corp | 共有メモリ装置 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5243208A (en) * | 1987-05-27 | 1993-09-07 | Hitachi, Ltd. | Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array |
JPS63293966A (ja) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | 半導体集積回路装置 |
JPH0772991B2 (ja) * | 1988-12-06 | 1995-08-02 | 三菱電機株式会社 | 半導体記憶装置 |
US5195053A (en) * | 1989-08-30 | 1993-03-16 | Nec Corporation | Semiconductor memory device wired to accommodate increased capacity without increasing the size of the semiconductor memory device |
US5119158A (en) * | 1989-11-21 | 1992-06-02 | Nec Corporation | Gate array semiconductor integrated circuit device |
JPH0834304B2 (ja) * | 1990-09-20 | 1996-03-29 | 富士通株式会社 | 半導体装置およびその製造方法 |
JP3186084B2 (ja) * | 1991-05-24 | 2001-07-11 | 日本電気株式会社 | 半導体メモリー装置 |
US5233135A (en) * | 1991-06-28 | 1993-08-03 | Sgs-Thomson Microelectronics, Inc. | Interconnect for integrated circuits |
JP2752863B2 (ja) * | 1991-09-11 | 1998-05-18 | 日本電気株式会社 | 半導体装置 |
US5441915A (en) * | 1992-09-01 | 1995-08-15 | Taiwan Semiconductor Manufacturing Company Ltd. | Process of fabrication planarized metallurgy structure for a semiconductor device |
US5969538A (en) * | 1996-10-31 | 1999-10-19 | Texas Instruments Incorporated | Semiconductor wafer with interconnect between dies for testing and a process of testing |
JP3177464B2 (ja) * | 1996-12-12 | 2001-06-18 | 株式会社日立製作所 | 入出力回路セル及び半導体集積回路装置 |
JP3212915B2 (ja) * | 1997-08-08 | 2001-09-25 | ローム株式会社 | 半導体集積回路装置 |
KR20000003649A (ko) * | 1998-06-29 | 2000-01-25 | 김영환 | 스큐를 제거한 입/출력 구조를 가지는 메모리 소자 |
US6225674B1 (en) | 1999-04-02 | 2001-05-01 | Motorola, Inc. | Semiconductor structure and method of manufacture |
JPWO2003065455A1 (ja) * | 2002-01-31 | 2005-05-26 | 株式会社ルネサステクノロジ | 半導体集積回路 |
US7037541B2 (en) * | 2002-07-03 | 2006-05-02 | Ariake Japan Co. | Alcoholic beverages derived from animal extract, and methods for the production thereof |
JP4173751B2 (ja) * | 2003-02-28 | 2008-10-29 | 株式会社ルネサステクノロジ | 半導体装置 |
DE102006042775B3 (de) * | 2006-09-12 | 2008-03-27 | Qimonda Ag | Schaltungsmodul und Verfahren zur Herstellung eines Schaltungsmoduls |
CN104216182B (zh) * | 2014-08-22 | 2017-03-01 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法和显示面板 |
CN114068517B (zh) * | 2020-08-05 | 2023-03-24 | 圣邦微电子(北京)股份有限公司 | 半导体芯片 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57100758A (en) * | 1980-12-16 | 1982-06-23 | Nec Corp | Semiconductor device |
JPS57100747A (en) * | 1980-12-16 | 1982-06-23 | Nec Corp | Semiconductor device |
JPS60134462A (ja) * | 1983-12-22 | 1985-07-17 | Nippon Telegr & Teleph Corp <Ntt> | 集積化半導体論理回路装置 |
JPS60145641A (ja) * | 1984-01-10 | 1985-08-01 | Toshiba Corp | 半導体集積回路装置 |
KR940002772B1 (ko) * | 1984-08-31 | 1994-04-02 | 가부시기가이샤 히다찌세이사꾸쇼 | 반도체 집적회로 장치 및 그 제조방법 |
JPS6197849A (ja) * | 1984-10-18 | 1986-05-16 | Fujitsu Ltd | ゲ−トアレイlsi装置 |
JPS6197957A (ja) * | 1984-10-19 | 1986-05-16 | Hitachi Ltd | 半導体集積回路装置 |
JPH0652784B2 (ja) * | 1984-12-07 | 1994-07-06 | 富士通株式会社 | ゲートアレイ集積回路装置及びその製造方法 |
KR930010088B1 (ko) * | 1985-04-24 | 1993-10-14 | 가부시기가이샤 히다찌세이꾸쇼 | 반도체 기억장치와 그 제조방법 |
JPS61274339A (ja) * | 1985-05-02 | 1986-12-04 | Fujitsu Ltd | Ram搭載のゲ−ト・アレ− |
JPS61292951A (ja) * | 1985-06-21 | 1986-12-23 | Hitachi Ltd | 半導体集積回路装置の製法 |
JPH0789569B2 (ja) * | 1986-03-26 | 1995-09-27 | 株式会社日立製作所 | 半導体集積回路装置及びその製造方法 |
JP2523488B2 (ja) * | 1986-04-18 | 1996-08-07 | 株式会社日立製作所 | 半導体記憶装置 |
JPS63293966A (ja) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | 半導体集積回路装置 |
JPH088304B2 (ja) * | 1987-08-19 | 1996-01-29 | 富士通株式会社 | 半導体集積回路装置及びその設計方法 |
-
1987
- 1987-05-27 JP JP62128233A patent/JPS63293966A/ja active Pending
-
1988
- 1988-05-25 US US07/198,311 patent/US4959704A/en not_active Expired - Lifetime
-
1990
- 1990-09-10 US US07/579,698 patent/US5103282A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100246074B1 (ko) * | 1990-10-10 | 2000-04-01 | 가나이 쓰도무 | 반도체집적회로장치 |
JP2007072616A (ja) * | 2005-09-05 | 2007-03-22 | Sony Corp | 共有メモリ装置 |
Also Published As
Publication number | Publication date |
---|---|
US5103282A (en) | 1992-04-07 |
US4959704A (en) | 1990-09-25 |
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