JPS6283196A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Industrial applications The present invention relates to an IC card.

2. Description of the Related Art In recent years, portable cards with memory functions, so-called IC cards, have been developed. If portability is important to these IC cards, the thickness must be as thin as conventional magnetic stripe cards or embossed cards, at least 1 LIIm or less, preferably 0.76 mm. Furthermore, in order to prevent damage to the built-in IC and LSI chips and breakage of circuit conductors when the card is bent, the mounting area must be significantly reduced.

Figure 6 shows an IC built into a conventional IC card.

A mounted module of an LSI chip is shown. Conductor wiring 3 coated with U-plating is formed on a glass epoxy substrate 1, and an IC is mounted on one side of the substrate 1.

11. SI chip 2 is pressed and wire 4
It is connected to the conductor wiring 3. Further, on the other side of the substrate 1, a plurality of terminal groups 6 for connection with external circuits are formed for inputting and outputting electrical signals. FIG. 7 shows a plan view of the module of FIG. 2. 7th
The module shown in FIGS. 8 and 8 is embedded or mounted in a card body 6 made of resin so that only the terminal group 6 is exposed to the outside (FIG. 8). This buried state is shown in FIG. I(:j, board 1 on which LSI chip 2 is mounted
is disposed in a recess 7 formed in the card body 6.

This concave portion 7 is filled with resin 8, and the substrate 1 is fixed to the card body e.

The problem that the invention seeks to solve However, in such a configuration, the IO.

Since the area where the LSI chip is mounted and the area where the terminal group is located are located on the same plane, the dimensions of the board 1 are large and the conductor wiring is easily broken due to bending or the like. The card body itself is formed with a thickness of about 1 m, and in the conventional method of fitting the mounting module (board) into a recess formed in the card body and fixing it by filling the space between the recess and the recess, the card itself Because the card is thin, the card may bend when carried or used, causing the mounted module to pop out of the recess, or the IC or LSI chip may also bend, damaging the chip itself and impairing its electrical characteristics. Confidence was markedly reduced.

Therefore, an object of the present invention is to prevent the mounted module or the IC or LSI chip from being damaged even if bending force is applied to the card itself when an IC or LSI chip is built into the card.

Means for Solving the Problems Technical means of the present invention for solving the above problems are IC, L
The SI chip is not fixed in the recess of the card body, but is allowed to move freely, and only the leads extending from the electrodes of the IC and LSI chips are fixed to the card body.

Since a space is formed between the working IC or LSI chip and the inner wall of the recess in the card body, even if the card body is bent outward, no external force will act on the RC or LSI chip, leading to chip damage. There's nothing wrong.

Example An embodiment of the present invention will be described using FIGS. 1 to 6.

First, in FIG. 1, a card body 1o made of BS resin or hard PVC is provided with a recess 12 for mounting and housing an IC chip 11 therein. IC chip 11
is located in this recess 12, and only the leads 14 extending from the electrodes 13 of the chip are fixed 16 to the card body 1o.

The recess 12 provided in the card body 10 has a volume that allows the IC chip 11 to be inserted freely, and a space 16 is formed at least between the inner wall of the recess 12 and the IC chip 11. The method of constructing the lead 14 will be described later, but the lead 14 is fixed to the card body 1o by, for example, adhesive 16 in the area in contact with the external electrode terminal.

The entire surface of the recess 12, including the upper surface thereof, is covered with a resin film 17, and only the region in contact with the external electrode terminal is left fully open.

Next, other embodiments will be described.

In FIG. 2, an I
A C-chip 11 is inserted, and a cushioning material 18 such as a sponge is provided at least around it. With such a configuration, even if the card body 1o is bent, no stress is applied to the IC chip 11, and the cushion material 18 absorbs some vibration, so the IC chip 1
This can prevent damage caused by extension from the electrode 13 of the first electrode 14 or mechanical vibration of the first electrode 14.

Further, the formation of the adhesive 14 from the IC chip 11 is performed using a film carrier method. For example, in FIG. 3, a lead 14 is connected to an electrode 13 of an IC chip 11.
This lead is formed using a film carrier method, and is formed into a predetermined shape by etching copper foil with a thickness of 17 to 160 μm.The other end of the lead 14 is a wide region 19. At least in this area, it is bonded to the card body 10, and this area is the part in contact with the external electrode terminal that transmits and receives external signals. Further, this area is subjected to Mu-U plating treatment in order to withstand the pressure when the external electrode terminal comes into contact with it and to prevent damage from outside air. Further, as shown in FIG. 3, if the leads 14 are led out from at least one side of the IC chip 11, the effects of the present invention can be maximized.

FIG. 4 shows an example in which a film carrier type structure is also used. A hole 21 is provided on a glass epoxy or polyimide substrate 20 of about 100 μm, and a wiring lead 22 is connected to the substrate 20.
0, the other end 23 is wide in the region in contact with the external electrode terminal, and one end protrudes into the hole 21 and is joined to the electrode 13 of the IC chip 11.

The wiring leads 22 are formed by forming predetermined openings in the substrate 20.
A predetermined wiring lead is formed by pasting Ou foil and etching it. Further, the wide area 23 of the wiring lead 22 is at least subjected to a U-plating process. Furthermore, in the configuration shown in FIG. 4, the wiring leads 22 may be led out from one side of the IC chip 11, as in the configuration shown in FIG.

FIG. 6 shows a cross section of the module shown in FIG. 4 mounted on the card body 10. The IC chip 11 is placed in the recess 12 of the card body 10, and the board 20 is placed in the recess 12 of the card body 10.
The 1G chip 11 is fixed to the recess 1 with adhesive 24.
It has a space 16 between the two inner walls.

Effects of the Invention In the configuration of the present invention, the IC chip is not fixed to the card body and only the leads are fixed to the card body, so even if the card body is bent, this bending stress does not act directly on the IC chip. , there are no accidents such as damage to the IC chip or the mounted module popping out of the card body.
High reliability can be obtained.

In addition, the configuration of the present invention is only an IC chip and leads,
Since it is only necessary to adhere and fix the leads to the card body, the structure is extremely simple, and the manufacturing process is easy, so the manufacturing cost is significantly reduced.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of an IC card according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of an IC card according to another embodiment of the present invention,
3 and 4 are perspective views showing how the leads of an IC chip to be stored in the IC card are formed, and FIG. 6 is a sectional view of the IC card with the mounting module shown in FIG. 4 arranged in the card body. Fig. 6 is a sectional view of a conventional IC card mounting module, Fig. 7 is a plan view of the same mounting module, and Fig. 8 is a sectional view of a conventional IC card mounting module.
The figure is a plan view of the IC card with the mounted module disposed in the card body, and FIG. 9 is a sectional view of the IC card with the mounted module (V) embedded in the card body. 10...Card body, 11...IC chip, 12...Recess, 13...Electrode,
14...Lead, 16...Space, 1B
...Cushion material. Name of agent: Patent attorney Toshio Nakao and one other person
---Card Book 4 Tree I4-m-Lead f6---Signal Figure 2 Figure 3 ``14 7・' Figure 6 Figure 9

Claims (3)

[Claims] (1) An IC card in which an IC chip having a lead is arranged in a recess of a card body so that a space is formed between the IC chip and the inner wall of the recess, and only the lead is fixed at a predetermined position in the card body. . (2) The IC card according to claim 1, wherein a cushioning material is provided in the recessed portion of the card body in which the IC chip is provided. (3) The IC card according to claim 1, wherein the lead fixed at a predetermined position of the card body has at least a region in contact with an external electrode terminal.