JP2950832B2 - IC card and IC module - Google Patents

Description

The present invention relates to an IC card and an IC module mounted on the IC card.

(Prior art) In recent years, chip cards, memory cards, microcomputer cards or cards called electronic cards on which IC chips such as microcomputers and memories are mounted (hereinafter simply referred to as IC cards).
Various researches have been carried out.

Such an IC card, compared to a conventional magnetic card,
Because of its large storage capacity, it is planned to store the history of savings and deposits instead of the bankbook in the case of banks and the history of transactions such as shopping in the case of credits.

Such an IC card is composed of an IC module on which an IC chip is mounted, and a rectangular card base having a recess for mounting the IC module.

Among them, the IC module is formed by providing external terminals on one surface of the substrate, providing a pattern layer and an IC chip on the other surface of the substrate, and resin-molding the periphery of the IC chip and the wiring portion.

The IC chip is directly bonded to the substrate surface with a die bonding adhesive.

Further, a plurality of through holes are provided through the substrate and the pattern layer, and the external terminals and the pattern layer are formed by conductive plating (eg, copper plating + nickel plating + gold plating) formed on the inner surface of the through hole. Conducted.

(Problems to be Solved by the Invention) As described above, an IC card is configured by mounting an IC module in a concave portion of a card base material. Also for IC modules
The IC chip is bonded to the substrate surface with a die bonding adhesive.

However, the IC card is subjected to a bending action in the longitudinal direction of the card base during use, and the bending action in the longitudinal direction also applies a bending action to the IC module. In this case, since the IC chip of the IC module is directly bonded to the substrate surface with a die bonding adhesive, when the bending action applied to the IC module increases, the bending action is directly transmitted to the IC chip, and the IC chip is damaged. Sometimes.

The present invention has been made in view of such a point, and an object of the present invention is to provide an IC card that can prevent breakage of an IC chip even when a large bending action is applied to the IC card.

[Configuration of the invention]

According to a first aspect of the present invention, there is provided an external terminal having an insulating groove formed on one surface of a substrate, and a polyhedral IC chip and a pattern layer on the other surface of the substrate. In an IC card comprising an IC module to be provided and a rectangular card base having a recess formed on one side for mounting the IC module, a direction perpendicular to a longitudinal direction of the card base in the pattern layer. The other end of the lead tape is connected to the bump of the IC chip, and the other end of the lead tape supports the IC chip at a predetermined distance from the substrate, An IC card, wherein the IC chip and the lead tape are arranged inside an insulating groove in a ground portion in a central portion of the substrate.

According to a second aspect of the present invention, an external terminal having an insulating groove formed on one surface of a substrate is provided, and an IC chip and a pattern layer made of a polyhedron are provided on the other surface of the substrate. In an IC module to be mounted in a concave portion having one side opened, one end of a lead tape arranged in a direction orthogonal to a longitudinal direction of the card base material is connected to the pattern layer, and the other end of the lead tape is connected to the pattern layer. Is connected to the bumps of the IC chip, and the other end of the lead tape supports the IC chip at a predetermined distance from the substrate, and the IC chip and the lead tape are placed inside the insulating groove of the ground portion at the center of the substrate. An IC module characterized by being arranged.

(Operation) According to the present invention, since the IC chip and the lead tape are arranged inside the insulating groove of the ground portion at the center of the substrate, even if the IC card is bent in the longitudinal direction, the IC chip and the lead tape are not formed. No external force is transmitted to the tape. In other words, when bending in the longitudinal direction of the IC card, stress concentration may occur on the substrate near the insulating groove, but since the IC chip and the lead tape are arranged inside the insulating groove in the ground portion at the center of the substrate, the IC There is no stress concentration on the chip and the lead tape and they are not damaged.

(Example) Hereinafter, an example of the present invention is described with reference to drawings.

1 to 4 show an IC card and an IC according to the present invention.
FIG. 4 is a diagram illustrating a first example of a module.

In FIG. 1, an IC card 10 is configured by mounting an IC module 11 in a concave portion 25 of a card base 24.

Each of the IC module 11 and the card base 24 of the IC card 10 has a rectangular shape, and the longitudinal direction of the IC module 11 matches the longitudinal direction of the card base 24. These longitudinal directions are indicated by arrows L.

 Next, the IC module will be described in detail.

As shown in FIG. 1, a substrate made of a material having excellent flexibility and strength (eg, glass epoxy, glass BT)
An external terminal 13 is provided on one surface of a resin, polyimide or the like 12 and a pattern layer 15 is provided on the other surface in a strip shape.

The external terminals 13 and the pattern layer 15 are both formed by applying copper plating, nickel plating, and gold plating to a copper foil.

A plurality of through holes 14 are provided through the external terminals 13, the substrate 12, and the pattern layer 15.
Conductive plating 14a for conducting the external terminals 13 and the pattern layer 15 is formed on the inner surface thereof.

Further, as shown in FIG. 4, one end of a lead tape 18 is connected to the pattern layer 15, and the IC chip 17 is supported by the other end of the lead tape 18 at a predetermined distance from the substrate 12. . In this case, the lead tape 18 is arranged in a direction orthogonal to the longitudinal direction of the card base 24. The lead tape 18 extends around the IC chip 17 from the pattern layer 15 and supports the IC chip 17 from below (FIG. 4).

Next, the connection configuration between the lead tape 18 and the IC chip 17 will be described in detail.

The lead tape 18 is usually formed by using a polyimide substrate as a substrate, etching a copper foil on the polyimide substrate, and further plating the copper foil with tin. Meanwhile IC chip 17
The side is preliminarily gold-plated, and the gold-plated portion (bump) 21 and the tin-plated lead tape 18 are thermocompression-bonded to connect the lead tape 18 and the IC chip 17.

Also, as shown in FIG. 4, an IC chip composed of a polyhedron
A resin chip coat 19 for protecting a wiring pattern (not shown) of the IC chip 17 is provided on the surface of the bump 17 on the side of the bump 21 with the other surface exposed to the outside.

By the way, as shown in FIG. 2, the external terminal 13 has an insulating groove 22a extending in the longitudinal direction (the direction of the arrow L) of the card base material 24,
Are divided into a plurality of regions 23a, 23b,... By an insulating groove 22b extending in a direction perpendicular to the insulating groove 22a.

The plurality of regions 23a, 23b,... Comprise a large-area ground portion 23a located substantially at the center, and seven small regions 23b, 23c,..., 23h located on both sides of the ground portion 23a. Further, the above-described IC chip 17 and lead tape 18 are arranged at positions corresponding to the ground portion 23a.

On the other hand, a concave portion 25 is previously formed in the card base material 24 by an engraving machine or the like, and the IC module is
11 is installed. The recess 25 is open at the top, and when a bending action is applied to the card base 24, the recess of the card base 24 is formed.
The vicinity of 25 is largely deflected.

The recess 25 includes a first recess 25a having a relatively shallow shape and a second recess 25b having a relatively deep shape.
Is a portion where the IC chip 17 and the chip coat 19 are mounted.

In this case, it is important that the depth of the second concave portion 25b is such that a space is created between the chip coat 19 of the IC module 11 and the second concave portion 25b when the IC module 11 is mounted. is there.

 Next, the operation of the present embodiment will be described.

 First, a method for manufacturing an IC card will be described.

The adhesive 26 is arranged on the bottom surface of the first concave portion 25a formed in the card base 24, and the IC module 11 is inserted. Subsequently, only the surface of the external terminal 13 is locally hot pressed by a hot stamper (not shown) (for example, 100 to 170 ° C., 5 to 15 kg / c).
m ² 5 seconds is enough)
Is fixed to the concave portion 25 of the card base 24, whereby the IC card 10 can be obtained.

During use of the IC card 10, the IC card 10 is subjected to a longitudinal bending action of the card base material 24 (arrow R in FIG. 1).

This bending action is applied to the IC module 11 from the card substrate 24, but since the IC chip 17 is supported by the lead tape 18 at a predetermined interval from the substrate 12, the bending action applied to the IC module 11 is reduced. IC chip from substrate 12
It is not transmitted to 17. For this reason, even if the bending action increases, the IC chip 17 is hardly damaged. Also, since the lead tape 18 is arranged in a direction orthogonal to the longitudinal direction of the card base 24, the IC card 10
The structure is such that the lead tape 18 is not easily broken even if a bend is applied in the longitudinal direction of the lead 24.

In general, when the IC card 10 is subjected to a bending action, stress concentration occurs due to the notch in the substrate 12 near the insulating grooves 22a and 22b. However, the IC chip 17 and the lead tape 18
Since it is arranged at a position corresponding to the ground portion 23a without the portions 22a and 22b, it is not affected by stress concentration occurring on the substrate 12 near the insulating grooves 22a and 22b.

In addition, since the resin chip coat 19 for protecting the wiring pattern of the IC chip 17 is provided on the surface of the IC chip 17 on the side of the bumps 21, the IC chip 10 can be bent in the longitudinal direction of the IC card 10.
The wiring pattern of the chip 17 can be reliably protected.

Furthermore, since this resin chip coat 19 is provided so as to expose the surface other than the surface on the bump 21 side outward, that is, the resin chip coat 19 is provided so as to cover only the surface on the bump 21 side, the IC There is no risk that the IC chip 17 will be damaged due to thermal or mechanical stress from the resin chip coat 19 side during the production of the module or the like, so that a highly reliable IC card can be obtained. Further, since the resin chip coat 19 is provided only on one side of the IC chip 17, it is possible to easily coat the IC chip 17 with the resin chip coat 19.

Next, FIG. 5 shows a second embodiment of the IC card and the IC module according to the present invention.

The second embodiment is the same as the first embodiment except for the connection configuration between the lead tape 17 and the IC chip 17.

In FIG. 5, the lead tape 18 is formed from the pattern layer 15 to the IC.
It extends inside the chip 17 and supports the IC chip 17 from above. Also, on the surface of the IC chip 17 on the bump 21 side, the IC chip
A chip coat 19 made of resin is provided for protecting a wiring pattern (not shown) formed on the surface of the surface 17.

〔The invention's effect〕

As described above, according to the present invention, since the IC chip and the lead tape are arranged inside the insulating groove of the ground portion at the center of the substrate, even if the IC card is bent in the longitudinal direction, the IC chip Also, stress concentration does not occur on the lead tape and these are not damaged.

[Brief description of the drawings]

1 to 4 are views showing a first embodiment of an IC card and an IC module according to the present invention. FIG. 1 is a side sectional view of the IC card, FIG. 2 is a plan view of the IC module, and FIG. 3 is a bottom view of the IC module, FIG. 4 is a view taken in the direction of arrow IV in FIG. 2, and FIG. 5 is a view corresponding to FIG. 4 showing a second embodiment of the present invention. 10 …… IC card, 11 …… IC module, 12 …… Substrate, 13
... external terminals, 14 ... through-hole, 14a ... conductive plating, 15 ... pattern layer, 17 ... IC chip, 18 ... lead tape, 19 ... chip coat, 22a, 22b ... insulating groove, 24 …
... card base material, 25 ... recess.

Continuation of the front page (56) References JP-A-63-3998 (JP, A) JP-A-62-248691 (JP, A) JP-A-62-256696 (JP, A) Jpn. , U) Actual opening 63-68476 (JP, U)

Claims (2)

(57) [Claims] An IC module comprising: an external terminal having an insulating groove formed on one surface of a substrate; and a polyhedral IC chip and a pattern layer on the other surface of the substrate; An IC card comprising a rectangular card base material having a concave part with one side opened, wherein one end of a lead tape arranged in a direction orthogonal to a longitudinal direction of the card base material is connected to the pattern layer. Connecting the other end of the lead tape to the bump of the IC chip, supporting the IC chip at a predetermined distance from the substrate by the other end of the lead tape, and connecting the IC chip and the lead tape to the center of the substrate. IC that is located inside the insulating groove of the ground part
card. 2. An external terminal having an insulating groove formed on one surface of a substrate, and a polyhedral IC chip and a pattern layer provided on the other surface of the substrate. An IC module mounted in a concave part having an open side, wherein one end of a lead tape arranged in a direction orthogonal to a longitudinal direction of the card base material is connected to the pattern layer, and the other end of the lead tape is connected to an IC chip. And the other end of the lead tape supports the IC chip at a predetermined distance from the substrate, and the IC chip and the lead tape are arranged inside the insulating groove in the ground portion at the center of the substrate. IC characterized by
module.