JPS6249268U - - Google Patents
Info
- Publication number
- JPS6249268U JPS6249268U JP14014585U JP14014585U JPS6249268U JP S6249268 U JPS6249268 U JP S6249268U JP 14014585 U JP14014585 U JP 14014585U JP 14014585 U JP14014585 U JP 14014585U JP S6249268 U JPS6249268 U JP S6249268U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- semiconductor pellet
- integrated circuit
- hybrid integrated
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による混成集積回路の絶縁板の
張り付け後の印刷配線基板の平面図、第２図は本
考案の混成集積回路の印刷配線基板の平面図、第
３図は本考案の実施に使用する絶縁板の斜視図、
第４図は従来の混成集積回路基板の絶縁成形後の
平面図である。
１……混成集積回路の印刷配線基板、２……絶
縁層、３……半導体ペレツトとクロス部分の配線
、４……絶縁板、５……半導体ペレツト。
Fig. 1 is a plan view of a printed wiring board of a hybrid integrated circuit according to the present invention after pasting an insulating plate, Fig. 2 is a plan view of a printed wiring board of a hybrid integrated circuit of the present invention, and Fig. 3 is a plan view of the printed wiring board of a hybrid integrated circuit according to the present invention. A perspective view of an insulating board used for
FIG. 4 is a plan view of a conventional hybrid integrated circuit board after insulation molding. DESCRIPTION OF SYMBOLS 1...Printed wiring board of hybrid integrated circuit, 2...Insulating layer, 3...Wiring at cross section with semiconductor pellet, 4...Insulating plate, 5...Semiconductor pellet.
Claims (1)
部が交又する混成集積回路において、前記交又部
における配線と半導体ペレツト間に絶縁板を前記
配線上に張り付けたことを特徴とする混成集積回
路。 1. A hybrid integrated circuit in which wiring of a printed wiring board intersects with a mounting part of a semiconductor pellet, characterized in that an insulating plate is pasted on the wiring between the wiring and the semiconductor pellet at the crossing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14014585U JPS6249268U (en) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14014585U JPS6249268U (en) | 1985-09-12 | 1985-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249268U true JPS6249268U (en) | 1987-03-26 |
Family
ID=31046717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14014585U Pending JPS6249268U (en) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249268U (en) |
-
1985
- 1985-09-12 JP JP14014585U patent/JPS6249268U/ja active Pending
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