JPS6331547U - - Google Patents
Info
- Publication number
- JPS6331547U JPS6331547U JP12515686U JP12515686U JPS6331547U JP S6331547 U JPS6331547 U JP S6331547U JP 12515686 U JP12515686 U JP 12515686U JP 12515686 U JP12515686 U JP 12515686U JP S6331547 U JPS6331547 U JP S6331547U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- external terminal
- resin molded
- conductive frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図ａ，ｂは混成集積回路の一例を示す説明図であ
り、ａ１，ａ２，ａ３は各部品の等価回路図、第
３図ａ乃至ｄは製造工程を示す概略説明図、第４
図は基板への半田付け状態を示す断面図、第５図
は従来の混成集積回路の断面図、第６図は従来の
混成集積回路の他の例を示す外観説明図である。
１１……混成集積回路、１２……外部端子、１
３……導電性フレーム、１５……樹脂モールドケ
ース。
Fig. 1 is a sectional view showing one embodiment of the present invention;
Figures a and b are explanatory diagrams showing an example of a hybrid integrated circuit, a 1 , a 2 and a 3 are equivalent circuit diagrams of each component, Figures 3 a to d are schematic explanatory diagrams showing the manufacturing process, and Figure 4
5 is a cross-sectional view showing a state of soldering to a substrate, FIG. 5 is a cross-sectional view of a conventional hybrid integrated circuit, and FIG. 6 is an explanatory external view showing another example of a conventional hybrid integrated circuit. 11... Hybrid integrated circuit, 12... External terminal, 1
3... Conductive frame, 15... Resin mold case.
Claims (1)
混成集積回路と、前記外部端子に接続された導電
性フレームと、前記混成集積回路をパツケージン
グする樹脂モールドケースとを有し、かつ、樹脂
モールドケースより露出された前記導電性フレー
ムを、装着用基板上に載置可能に折曲形成したこ
とを特徴とする混成集積回路部品。 A hybrid integrated circuit having an external terminal around a laminate of insulating sheets, a conductive frame connected to the external terminal, and a resin molded case packaging the hybrid integrated circuit, the resin molded case A hybrid integrated circuit component, characterized in that the more exposed conductive frame is bent so that it can be placed on a mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12515686U JPS6331547U (en) | 1986-08-14 | 1986-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12515686U JPS6331547U (en) | 1986-08-14 | 1986-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6331547U true JPS6331547U (en) | 1988-03-01 |
Family
ID=31017816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12515686U Pending JPS6331547U (en) | 1986-08-14 | 1986-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331547U (en) |
-
1986
- 1986-08-14 JP JP12515686U patent/JPS6331547U/ja active Pending