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JPS61158975U - - Google Patents

Info

Publication number
JPS61158975U
JPS61158975U JP4415285U JP4415285U JPS61158975U JP S61158975 U JPS61158975 U JP S61158975U JP 4415285 U JP4415285 U JP 4415285U JP 4415285 U JP4415285 U JP 4415285U JP S61158975 U JPS61158975 U JP S61158975U
Authority
JP
Japan
Prior art keywords
semiconductor chip
circuit board
integrated circuit
surrounded
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4415285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4415285U priority Critical patent/JPS61158975U/ja
Publication of JPS61158975U publication Critical patent/JPS61158975U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第4図はこの考案の一実施例を示す
図で、第1図及び第2図は平面図、第3図及び第
4図は側面図、第5図は平面図、第6図は斜視図
である。 2は混成集積回路基板、3は導体部、4は裸の
半導体チツプ、9は登載部、12は樹脂である。
Figures 1 to 4 are views showing one embodiment of this invention, in which Figures 1 and 2 are plan views, Figures 3 and 4 are side views, Figure 5 is a plan view, and Figure 6 is a plan view. The figure is a perspective view. 2 is a hybrid integrated circuit board, 3 is a conductor portion, 4 is a bare semiconductor chip, 9 is a mounting portion, and 12 is a resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] すくなくとも裸の半導体チツプ4の登載部9の
周囲三方を回路を形成する導体部3で囲んだこと
を特徴とする混成集積回路基板。
A hybrid integrated circuit board characterized in that a mounting part 9 for a bare semiconductor chip 4 is surrounded on at least three sides by a conductor part 3 forming a circuit.
JP4415285U 1985-03-25 1985-03-25 Pending JPS61158975U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4415285U JPS61158975U (en) 1985-03-25 1985-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4415285U JPS61158975U (en) 1985-03-25 1985-03-25

Publications (1)

Publication Number Publication Date
JPS61158975U true JPS61158975U (en) 1986-10-02

Family

ID=30556469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4415285U Pending JPS61158975U (en) 1985-03-25 1985-03-25

Country Status (1)

Country Link
JP (1) JPS61158975U (en)

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