JPS6037273U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS6037273U JPS6037273U JP12948183U JP12948183U JPS6037273U JP S6037273 U JPS6037273 U JP S6037273U JP 12948183 U JP12948183 U JP 12948183U JP 12948183 U JP12948183 U JP 12948183U JP S6037273 U JPS6037273 U JP S6037273U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid integrated
- integrated circuit
- transformer
- electrode
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路で用いられたトランスの一
例の封止樹脂を断面とした平面図、第２図は従来の他の
一例のトランスの平面図、第３図は本考案の一実施例に
係るトランスの平面図、第４図は第３図のトランスを用
いた本考案の一実施例の部分断面図である。
１・・・・・・トランスのコア、２・・・・・・リード
、３，５・・・・・・トランスの電極、４・・・・・・
封止樹脂、６・・・・・・回路基板、６ａ・・・・・・
基板の電極、７・・・・・・ボンディングワイヤ、８・
・・・・・トランス固定用１Ｍ脂。Figure 1 is a cross-sectional plan view of a sealing resin of an example of a transformer used in a conventional hybrid integrated circuit, Figure 2 is a plane view of another example of a conventional transformer, and Figure 3 is a cross-sectional view of a transformer of the present invention. FIG. 4 is a plan view of the transformer according to the embodiment. FIG. 4 is a partial sectional view of an embodiment of the present invention using the transformer shown in FIG. 3. 1... Core of transformer, 2... Lead, 3, 5... Electrode of transformer, 4...
Sealing resin, 6...Circuit board, 6a...
Substrate electrode, 7... Bonding wire, 8.
...1M fat for fixing the transformer.
Claims (1)
る混成集積回路において、前記トランスの電極はコアの
一部に形成され、この電極と前記回路基板との接続はボ
ンディングワイヤによって接続されていることを特徴と
する混成集積回路。In a hybrid integrated circuit having a circuit board on which at least one transformer is mounted, an electrode of the transformer is formed in a part of the core, and the electrode and the circuit board are connected by a bonding wire. Features of hybrid integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12948183U JPS6037273U (en) | 1983-08-22 | 1983-08-22 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12948183U JPS6037273U (en) | 1983-08-22 | 1983-08-22 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6037273U true JPS6037273U (en) | 1985-03-14 |
Family
ID=30293368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12948183U Pending JPS6037273U (en) | 1983-08-22 | 1983-08-22 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037273U (en) |
-
1983
- 1983-08-22 JP JP12948183U patent/JPS6037273U/en active Pending
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